10M08SCE144I7G - MAX 10 FPGA, 8K LE, 144-LQFP | Intel
MPN: 10M08SCE144I7G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.75 | $167.50 |
| 100 | $14.2 | $1,420.00 |
| 500 | $12.4 | $6,200.00 |
| 1,000 | $10.85 | $10,850.00 |
Drop-in alternatives for 10M08SCE144I7G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10M08SCE144C8G
✅ Drop-In✓ In Stock
$15.95 / Unit
View Datasheet →10M08SAE144I7G
✅ Drop-In✓ In Stock
$11.48 / Unit
View Datasheet →10M08SAE144C8G
✅ Drop-In✓ In Stock
$16.25 / Unit
View Datasheet →10M04SCE144I7G
✅ Drop-In✓ In Stock
$15.8 / Unit
View Datasheet →10M04SCE144A7G
✅ Drop-In✓ In Stock
$10.1 / Unit
View Datasheet →LCMXO2-640ZE-3TG144C
✅ Drop-In📋 Reference alternative (not in catalog)
10M08SCE144I7G Maximum Ratings & Electrical Characteristics
| Family | MAX 10 |
| Logic Elements | 8000 |
| Embedded Memory (bits) | 387072 |
| Embedded SRAM (Kbits) | 414 |
| User Flash (Kbits) | 295 (user) / 47.4 usable |
| User I/O Pins | 101 |
| Package | 144-LQFP Exposed Pad (EQFP-144) |
| Speed Grade | -7 |
| Core Voltage | 1.2 V |
| Operating Temperature | -40C to +100C (Industrial) |
| Configuration Memory | Internal dual-configuration flash (non-volatile) |
| ADC | 2x 12-bit, up to 16 analog inputs |
| PLLs | 2 |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
10M08SCE144I7G 144-lqfp exposed pad (eqfp-144) Pin Configuration Guide
Complete pinout information for 10M08SCE144I7G (144-lqfp exposed pad (eqfp-144) package) with 101 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M08SCE144I7G.
Refer to the datasheet for full pin configuration.
Estimated pin count: 101 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M08SCE144I7G is suitable for 6 applications: Industrial Machine Control and I/O Aggregation, Sensor Data Acquisition and Pre-Processing, Protocol Bridging (I2C/SPI/UART/CAN) Gateways, Motor Control and Drive Pre-Stage, LED Lighting Controllers and Pixel Drivers, Legacy 5V-CPLD Replacement and Glue Logic Consolidation.
Industrial Machine Control and I/O Aggregation
The 10M08SCE144I7G is well suited for industrial machine controllers that aggregate dozens of discrete inputs and outputs from sensors, limit switches, and actuators. Its 8K logic elements handle state-machine logic for ladder-logic replacement, while 101 user I/O pins drive optocoupler-isolated outputs and read 24V field signals via resistor dividers. The integrated dual-configuration flash supports instant-on operation, restarting motor controllers in under 10 ms after power-cycle, while two 12-bit ADCs monitor motor current and supply rails in real time.
Recommended
Sensor Data Acquisition and Pre-Processing
For multi-sensor data acquisition front-ends, the 10M08SCE144I7G combines its two on-chip 12-bit ADCs with M9K memory buffers and DSP multiplier blocks to perform FIR filtering and peak detection before passing data upstream. Up to 16 analog inputs handle thermocouples, RTDs, or pressure transducers. Non-volatile storage of calibration coefficients in user flash eliminates an external EEPROM, and the EQFP-144 footprint provides the thermal headroom needed for industrial enclosures.
Recommended
Protocol Bridging (I2C/SPI/UART/CAN) Gateways
The 10M08SCE144I7G's 8K logic elements comfortably run UART-to-I2C, SPI-to-CAN, or RS-485-to-Ethernet bridging state machines in a single device. The 101 I/Os support multiple simultaneous buses without external muxing, while on-chip user flash stores gateway configuration and protocol tables. Instant-on behavior is critical for gateways that must be ready before the host CPU boots, and the industrial -40C to +100C rating allows deployment in unconditioned factory cabinets.
Recommended
Motor Control and Drive Pre-Stage
In variable-frequency drives and stepper/servo controllers, the 10M08SCE144I7G handles PWM generation, dead-time insertion, encoder quadrature decoding, and current-loop pre-processing. Its two PLLs generate the precise timing needed for SVPWM and field-oriented control, while the integrated ADCs sample phase currents synchronously to the PWM carrier. Non-volatile storage retains the motor profile parameters between power cycles.
Recommended
LED Lighting Controllers and Pixel Drivers
For architectural and entertainment lighting, the 10M08SCE144I7G drives long chains of WS2812B, APA102, or DMX512-compatible LED drivers. The high I/O count supports many parallel pixel strips, and M9K memory buffers frame data while user flash stores lighting presets. Instant-on capability lets lighting fixtures boot to a known state without external boot devices, and the LQFP package is hand-solderable for low-volume custom installations.
Recommended
Legacy 5V-CPLD Replacement and Glue Logic Consolidation
The 10M08SCE144I7G is a common modern replacement for legacy 5V-tolerant CPLDs such as the Altera MAX 7000 and Xilinx XC9500XL families. The MAX 10 LVTTL/LVCMOS I/O banks support 3.3V operation natively, with level-shifted I/O standards for 5V mixed-signal boards. Designers consolidate multiple discrete 74-series glue-logic packages into a single programmable device, reducing board area while gaining non-volatile instant-on operation and field-upgradable logic.
Recommended
Recommended Products Summary
Engineering reference data for 10M08SCE144I7G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M08SCE144C8G | 10M08SAE144I7G | 10M08SAE144C8G | 10M04SCE144I7G | 10M04SCE144A7G | LCMXO2-640ZE-3TG144C |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Lattice Semiconductor |
| Package | 144-LQFP Exposed Pad (EQFP-144) | 144-LQFP Exposed Pad (EQFP-144) | 144-LQFP Exposed Pad (EQFP-144) | 144-LQFP Exposed Pad (EQFP-144) | 144-LQFP Exposed Pad (EQFP-144) | 144-LQFP Exposed Pad (EQFP-144) | 144-LQFP (TQFP-144) |
| Family | MAX 10 | MAX 10 | MAX 10 | MAX 10 | MAX 10 | MAX 10 | MachXO2 |
| Logic Elements / LUTs | 8000 LE | 8000 LE | 8000 LE | 8000 LE | 4000 LE | 4000 LE | 640 LUTs |
| Embedded Memory | 387072 bits | 387072 bits | 387072 bits | 387072 bits | 189440 bits | 189440 bits | 65536 bits |
| User I/O | 101 | 101 | 101 | 101 | 101 | 101 | 107 |
| Operating Temperature | -40C to +100C (Industrial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) |
| Internal Configuration Flash | Yes (dual-config) | Yes (dual-config) | Yes (dual-config) | Yes (dual-config) | Yes (dual-config) | Yes (dual-config) | Yes (FlashFreeze) |
Key Differentiators
- Single-chip non-volatile operation eliminates external boot flash (vs 10M04SCE144I7G)
- Higher density at same footprint than Lattice MachXO2 (vs LCMXO2-640ZE-3TG144C)
- Industrial temperature grade in same package as commercial variant (vs 10M08SCE144C8G)
Design Notes
The MAX 10 device requires a stable 1.2V core supply and per-bank VCCIO rails (1.2V, 1.5V, 1.8V, 2.5V, 3.0V, 3.3V). Place a 100 nF decoupling capacitor within 2 mm of each VCCIO pin, plus a 4.7 uF bulk capacitor per voltage rail. For ADC applications, isolate VCCA (analog supply) from VCCD (digital core) using a ferrite bead; noise on VCCA directly couples into the 12-bit ADC result and can degrade SNR by 6-10 dB. Power-on reset timing must allow VCCINT to rise monotonically within the datasheet's tRAMP specification.
Estimated: at full utilization of the 8K LE fabric with all 101 I/Os switching at 100 MHz and 3.3V VCCIO, the device may dissipate up to ~1.2W. The exposed thermal pad on the EQFP-144 package must be soldered to a copper pour of at least 1 square inch with 9 thermal vias (0.3 mm drill, 0.5 mm pitch) to the internal ground plane to keep theta-JA within ~28 C/W and junction temperature below 100C in industrial environments. Without adequate thermal relief, the device may thermally throttle or trigger the internal over-temperature sensor in sealed enclosures.
Use a 4-layer PCB stackup with continuous ground plane beneath the device for signal integrity and EMI control. Route JTAG (TCK, TMS, TDI, TDO) as a matched-length bus with a 10 kohm pull-up on TCK and TMS; route the nCONFIG, nSTATUS, and CONF_DONE configuration pins to accessible test points. Place crystal oscillator or clock input within 5 mm of the CLK pin and guard with ground vias. Keep high-speed LVDS pairs length-matched within 150 mil and skew-matched to within 20 ps to meet MAX 10 LVDS timing budgets.
Do not leave the exposed pad un-soldered - this causes both thermal runaway and ground-return discontinuity. Do not drive the JTAG TCK pin with a non-3.3V signal unless the VCCIO bank is configured for that voltage. Do not exceed the 16-channel ADC simultaneous sampling rate specified in the datasheet. Do not assume default pull-ups on user I/Os - explicitly enable or disable internal pull-ups via Quartus Prime pin assignments to avoid floating inputs during user-mode-to-configuration-mode transitions.
Compliance Information
RoHS and REACH compliance confirmed per the Altera product page and Arrow distributor listing; the part is not AEC-Q100 qualified and is intended for industrial/consumer use, not automotive. Lead-free finish (Pb-free) confirmed.
