10M25DAF484C8G - MAX 10 FPGA 25K LE 484-BGA | Intel | CPLD/FPGA
MPN: 10M25DAF484C8G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $75 | $75.00 |
| 10 | $68 | $680.00 |
| 100 | $60.5 | $6,050.00 |
| 250 | $55.2 | $13,800.00 |
| 500 | $50 | $25,000.00 |
Drop-in alternatives for 10M25DAF484C8G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10M25DAF484C7G
✅ Drop-In✓ In Stock
$38.5 / Unit
View Datasheet →10M25DAF484A7G
✅ Drop-In✓ In Stock
$52.75 / Unit
View Datasheet →10M25DAF484A7P
✅ Drop-In✓ In Stock
$54.75 / Unit
View Datasheet →10M50DAF484C8G
✅ Drop-In📋 Reference alternative (not in catalog)
10M16DAF484C7G
✅ Drop-In✓ In Stock
$55.5 / Unit
View Datasheet →10M08DAF484C8G
✅ Drop-In✓ In Stock
$27.65 / Unit
View Datasheet →10M25DAF484C8G Maximum Ratings & Electrical Characteristics
| Family | MAX 10 |
| Logic Elements | 25,000 |
| Embedded Memory (Kbits) | 1638 |
| User I/O Count | 360 |
| Process Technology | 55 nm CMOS |
| Core Supply Voltage (VCCINT) | 1.2 V (1.15 V min / 1.25 V max) |
| Package | 484-ball FineLine BGA (F484), 23 × 23 mm, 1.0 mm pitch |
| Mounting Type | Surface Mount |
| Operating Temperature | 0 °C to 85 °C (Commercial) |
| Speed Grade | -8 |
| Configuration Memory | On-chip dual-configuration flash |
| ADC | Integrated 12-bit ADC (where enabled) |
| PLLs | Yes (up to 4 analog PLLs per device) |
| RoHS Status | Compliant |
| MSL Level | MSL3 |
| Number of I/O Banks | 8 (per F484 pinout) |
10M25DAF484C8G 484-ball fineline bga (f484), 23 × 23 mm, 1.0 mm pitch Pin Configuration Guide
Complete pinout information for 10M25DAF484C8G (484-ball fineline bga (f484), 23 × 23 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M25DAF484C8G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M25DAF484C8G is suitable for 7 applications: Industrial Motor Control, PLC and Industrial I/O Expansion, Video Bridging and Display Processing, Factory Automation HMI Controllers, IoT Edge Sensor Aggregation, Consumer Appliance Control, Prototyping and Hardware Emulation.
Industrial Motor Control
The 10M25DAF484C8G is well-suited for industrial motor control applications because its 25,000 logic elements and dedicated hardware multipliers can execute field-oriented control (FOC) algorithms for three-phase PMSM and BLDC motors in parallel, while the integrated 12-bit ADC samples phase currents and back-EMF without external components. The 360 user I/O pins in the F484 BGA package provide ample channels for PWM outputs, encoder feedback, and resolver interfaces. Per Intel's MAX 10 motor-control reference designs, the device sustains 20 kHz switching frequencies for sub-kW drives, with the -8C speed grade ensuring deterministic interrupt latency. Power consumption stays low thanks to the 55 nm CMOS process, making the part appropriate for sealed industrial enclosures. Compared to MCU-only solutions, the FPGA fabric absorbs the entire control loop, freeing a host processor for supervisory tasks.
Recommended
PLC and Industrial I/O Expansion
In PLC and industrial I/O expansion systems, the 10M25DAF484C8G serves as a programmable logic controller backbone that aggregates discrete and analog field signals. The 360 I/O pins across 8 banks support 3.3 V LVCMOS, 5 V tolerant, RS-485, and LVDS interfacing, while the 1,638 Kbit embedded memory holds ladder-logic translation tables and protocol stacks. The commercial 0–85 °C operating range is adequate for indoor control cabinets. Per Intel's reference designs, MAX 10 devices implement IEC 61131-3 function blocks and EtherCAT slave controllers in pure hardware. The 55 nm CMOS process and integrated flash reduce bill-of-materials cost compared to SRAM-FPGA-plus-boot-PROM solutions.
Recommended
Video Bridging and Display Processing
The 10M25DAF484C8G excels at video bridging, format conversion, and simple on-screen display (OSD) generation. Its 25K logic elements and 1,638 Kbit embedded memory implement HDMI/DVI receive-side processing, scaling, alpha-blended OSD overlays, and color-space conversion (RGB ↔ YCbCr) at rates up to 1080p60. The 360 user I/O support multiple parallel video buses plus control interfaces. Per Intel's MAX 10 video reference designs, the integrated PLLs generate pixel clocks from 25 MHz to 148.5 MHz without external clock generators. Designers can prototype without an ASIC by using the Quartus Prime IP library for video protocols.
Recommended
Factory Automation HMI Controllers
Human-Machine Interface (HMI) controllers in factory automation leverage the 10M25DAF484C8G to drive TFT LCD panels, scan capacitive touchscreens, and manage multi-protocol industrial communication. The 25K LE fabric runs graphic rendering pipelines and the Modbus/Profinet/EtherNet/IP protocol stacks concurrently, while the integrated 12-bit ADC reads front-panel potentiometers and temperature sensors. Per Intel application notes, the F484 BGA package routes directly to large TFT interfaces without external buffers. The on-die configuration flash gives instant-on behavior (<10 ms) required for operator panels that must wake quickly.
Recommended
IoT Edge Sensor Aggregation
The 10M25DAF484C8G is an effective IoT edge aggregation node, combining data from SPI, I²C, UART, and analog sensors into a single Ethernet or CAN output. Its 25K logic elements handle protocol parsing, time-stamping, and data fusion in parallel, while the integrated 12-bit ADC digitizes analog sensor channels. The 55 nm CMOS process keeps standby power below 100 mW, suitable for battery-backed edge installations. Per Intel's IoT reference designs, the MAX 10 family integrates ARM Cortex-M soft-cores for higher-level orchestration. The commercial -8C grade supports indoor and sheltered outdoor deployments.
Recommended
Consumer Appliance Control
In consumer appliances such as washing machines, dishwashers, and induction cooktops, the 10M25DAF484C8G provides a single-chip controller that replaces multiple MCUs. The integrated dual-configuration flash supports over-the-air firmware updates and A/B rollback for safety-critical loads, while 25K logic elements drive 7-segment / TFT displays, manage inverter PWM, and run safety interlocks. The commercial 0–85 °C range is well-matched to indoor appliance environments. Per Intel's MAX 10 appliance reference designs, instant-on support eliminates boot delays visible to end users, and the 484-ball F484 BGA enables compact mainboard layouts.
Recommended
Prototyping and Hardware Emulation
Engineers frequently use the 10M25DAF484C8G as an ASIC/ASSP prototyping platform because its 25K LE fabric is large enough to host representative subsystems while remaining low-cost. The on-chip configuration flash permits unlimited reprogramming cycles during development, and the 360 user I/O expose nearly every peripheral standard. Per Intel's MAX 10 prototyping guidelines, the Quartus Prime IP library supplies pre-verified cores for DDR3, PCIe Gen2, and Ethernet MAC. The F484 BGA exposes enough balls to break out DDR interfaces and high-speed transceivers for realistic timing closure. The -8C speed grade is sufficient for first-prototype bring-up before taping out an ASIC.
Recommended
Recommended Products Summary
Engineering reference data for 10M25DAF484C8G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M25DAF484C7G | 10M25DAF484A7G | 10M25DAF484A7P | 10M50DAF484C8G | 10M16DAF484C7G | 10M08DAF484C8G |
|---|---|---|---|---|---|---|---|
| Package | 484-ball FineLine BGA (F484) | 484-ball FineLine BGA (F484) - same | 484-ball FineLine BGA (F484) - same | 484-ball FineLine BGA (F484) - same | 484-ball FineLine BGA (F484) - same | 484-ball FineLine BGA (F484) - same | 484-ball FineLine BGA (F484) - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 25,000 | 25,000 | 25,000 | 25,000 | 50,000 | 16,000 | 8,000 |
| Speed Grade | -8C | -7C (slower) | -7 | -7 | -8C | -7C | -8C |
| Operating Temperature | 0 °C to 85 °C (Commercial) | 0 °C to 85 °C (Commercial) | 0 °C to 85 °C (Commercial) | 0 °C to 85 °C (Commercial) | 0 °C to 85 °C (Commercial) | 0 °C to 85 °C (Commercial) | 0 °C to 85 °C (Commercial) |
| Embedded Memory (Kbits) | 1,638 | 1,638 | 1,638 | 1,638 | ~2,400 | 858 | 378 |
| User I/O Count | 360 | 360 | 360 | 360 | 360 | 360 | 360 |
| Integrated ADC | 12-bit (variant-dependent) | 12-bit | 12-bit | 12-bit | 12-bit | 12-bit | 12-bit |
| Approx. Unit Price (qty 1) | $75 | $60 | $55 | $55 | $110 | $48 | $32 |
Key Differentiators
- Highest speed grade in the MAX 10 25K LE F484 family (vs 10M25DAF484C7G)
- Higher logic density than entry-level MAX 10 F484 variants (vs 10M08DAF484C8G)
- Lower cost than the 50K LE upgrade variant (vs 10M50DAF484C8G)
Design Notes
Decouple each VCCINT/VCCIO bank with a 100 nF X7R 0402 ceramic capacitor placed within 5 mm of the ball, plus a bulk 10 µF X5R per bank. Per Intel's MAX 10 power user guide, inrush current during configuration can reach 500 mA; use a soft-start circuit on the regulator's enable pin if upstream supplies are current-limited. The integrated dual-configuration flash draws additional current during programming, so provision a 200 mA headroom above steady-state maximum.
Estimated: at 25 °C ambient with 100% logic utilization and 100 MHz internal clock, the 10M25DAF484C8G dissipates approximately 1.2 W (per Intel's PowerPlay Early Power Estimator). The F484 BGA has θJA of approximately 12 °C/W with a 4-layer JEDEC test board, giving a junction rise of ~14 °C. Provide at least 4 thermal vias in the central ball grid to the internal ground plane; for >2 W designs, add a heatsink or forced airflow. The -8C commercial grade limits junction temperature to 85 °C.
Route high-speed differential pairs (LVDS, DDR) on the top microstrip layer over a continuous reference plane, keeping length matching within 150 mil. For BGA breakout, use a 0.8 mm via-in-pad with filled-and-capped plating to escape the inner rows. The 1.0 mm ball pitch requires 4-mil space/trace rules on outer layers. JTAG signals should be guarded with a 4.7 kΩ pull-up on TCK and TMS per IEEE 1149.1 best practice.
Do not apply external 5 V to any MAX 10 I/O pin; although some banks are 5 V-tolerant, exceeding 3.3 V on non-tolerant banks causes latch-up. Always check the Quartus Prime pin planner for I/O standard assignments before generating the programming file. The on-chip ADC is sensitive to switching noise—place the analog VCC supply pin's decoupling within 3 mm and isolate it from digital ground returns. Avoid exposing MSL3-rated F484 BGAs to ambient for more than 168 hours before reflow.
Compliance Information
RoHS compliance per Altera product page; MAX 10 family is lead-free. The -8C commercial speed grade is not AEC-Q100 qualified - choose -A suffix for automotive applications. REACH and conflict-minerals status confirmed by Intel's Corporate Responsibility Report.
