10M25DAF484A7P - MAX 10 25K LE FPGA, 484-BGA, Automotive | Intel
MPN: 10M25DAF484A7P ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $72.1 | $721.00 |
| 100 | $64.9 | $6,490.00 |
| 250 | $59.4 | $14,850.00 |
| 500 | $54.75 | $27,375.00 |
Drop-in alternatives for 10M25DAF484A7P — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10M25DAF484A7G
✅ Drop-In✓ In Stock
$52.75 / Unit
View Datasheet →10M25DAF484I7P
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
10M25DAF484C8G
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$50 / Unit
View Datasheet →10M25DAF484I7G
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$99.8 / Unit
View Datasheet →10M16DCF484C8G
✅ Drop-In✓ In Stock
$35.8 / Unit
View Datasheet →10M08DAF484C8G
✅ Drop-In✓ In Stock
$27.65 / Unit
View Datasheet →10M25DAF484A7P Maximum Ratings & Electrical Characteristics
| Series | MAX 10 |
| Logic Elements | 25,000 |
| Configurable Logic Blocks (CLBs) | 1,563 |
| Process Technology | 55 nm non-volatile |
| Embedded Memory | 1,728 Kbits |
| Maximum User I/O | 360 |
| Package | 484-ball Plastic BGA (S-PBGA-B484) |
| Package Code | BGA |
| Terminal Form | Ball |
| Temperature Grade | Automotive (-40 C to +125 C TJ) |
| Speed Grade | A7 |
| Configuration | Internal dual-boot flash (no external PROM) |
| On-chip ADC | 1 x 12-bit, 1 MSPS |
| PLLs | 2 (general-purpose) |
| DSP Blocks | Up to 25 (18x18 MAC) |
| Supply Voltage | 3.3 V or 1.8 V single supply |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
10M25DAF484A7P bga Pin Configuration Guide
Complete pinout information for 10M25DAF484A7P (bga package) with 48 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M25DAF484A7P.
Refer to the datasheet for full pin configuration.
Estimated pin count: 48 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M25DAF484A7P is suitable for 6 applications: Automotive Body Electronics, Industrial Motor Control, Video Bridging and Display Controllers, ASIC Prototyping and Emulation, Medical Sensor and Monitoring Systems, Industrial IoT Gateways.
Automotive Body Electronics
The 10M25DAF484A7P's automotive temperature grade (-40 C to +125 C junction) and AEC-style qualification flow make it well suited for body control modules, lighting controllers, and gateway nodes where instant-on non-volatile logic is required. With 25,000 logic elements and up to 360 user I/O pins, the device aggregates LIN, CAN, and sensor inputs without an external boot PROM. The integrated 12-bit 1 MSPS ADC simplifies current and temperature monitoring on power FETs. Compared with discrete microcontroller + CPLD solutions, the MAX 10 lowers BOM by combining logic, ADC, and dual-boot flash in a single 484-BGA device.
Recommended
Industrial Motor Control
In industrial motor drives and PLCs, the 10M25DAF484A7P delivers deterministic control loops through 150 MHz 18x18 DSP blocks and dual general-purpose PLLs. Up to 360 user I/O pins interface directly to PWM generators, encoder feedback, and isolated gate-driver signals, while the integrated ADC samples shunt currents at 1 MSPS for field-oriented control. The MAX 10's instant-on flash eliminates boot latency issues seen in SRAM-based FPGAs. The 484-ball BGA package is qualified for industrial and automotive factories, reducing qualification effort for harsh-environment deployments.
Recommended
Video Bridging and Display Controllers
The 10M25DAF484A7P's 1,728 Kbits of embedded memory and LVDS I/O up to 1 Gbps support video pipelines including parallel RGB-to-MIPI bridging, LCD timing controllers, and multi-display aggregation. Its 360 user I/O are sufficient to drive two WXGA displays plus overlay and backlight control logic. The hard PLLs generate pixel clocks with sub-pixel accuracy, eliminating external clock generators. Compared with ASSP video bridges, the MAX 10 offers reconfigurable protocol handling for legacy-to-modern interface conversion.
Recommended
ASIC Prototyping and Emulation
With 25,000 logic elements, 1,728 Kbits of block memory, and Quartus Prime synthesis, the 10M25DAF484A7P serves as a low-cost ASIC prototyping platform for sub-25K gate ASICs. The non-volatile configuration flash lets prototypes boot directly into the design without external programmers, accelerating board bring-up. Up to 360 user I/O provide abundant stimulus and probe access for verification engineers. The MAX 10 device family supports soft-core Nios II processor instantiation, enabling pre-silicon firmware development.
Recommended
Medical Sensor and Monitoring Systems
The 10M25DAF484A7P's integrated 12-bit 1 MSPS ADC and dual-core configuration flash support portable patient monitors, infusion pumps, and diagnostic instruments. The automotive-grade A7 speed grade delivers deterministic logic timing for safety-critical signal paths, while the non-volatile flash enables instant-on behavior required for emergency-power cycling. LVDS I/O support clean low-noise data transfer between the FPGA and high-resolution sensor front-ends, and the 1,728 Kbits of embedded memory buffer waveform data without external SRAM.
Recommended
Industrial IoT Gateways
The 10M25DAF484A7P aggregates multiple industrial protocols (RS-485, RS-232, SPI, I2C, CAN, Modbus) onto Ethernet or wireless backhaul links in IIoT gateway designs. Its 25,000 logic elements host soft TCP/IP stacks or RISC-V cores while the integrated ADC monitors rail voltages. The dual-boot flash supports secure remote firmware upgrades, a key requirement for unattended IIoT nodes. Up to 360 user I/O simplify PCB routing for mixed-signal gateway cards. Compared with microcontroller-only designs, the MAX 10 frees the host MCU from real-time protocol handling.
Recommended
Recommended Products Summary
Engineering reference data for 10M25DAF484A7P — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M25DAF484A7G | 10M25DAF484I7P | 10M25DAF484C8G | 10M25DAF484I7G | 10M16DCF484C8G | 10M08DAF484C8G |
|---|---|---|---|---|---|---|---|
| Package | 484-ball BGA (S-PBGA-B484) | 484-ball BGA - same | 484-ball BGA - same | 484-ball BGA - same | 484-ball BGA - same | 484-ball BGA - same footprint family | 484-ball BGA - same footprint family |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 25,000 | 25,000 | 25,000 | 25,000 | 25,000 | 16,000 | 8,000 |
| Speed Grade | A7 (automotive) | A7 (industrial) | I7 (industrial) | C8 (industrial) | I7 (industrial) | C8 (industrial) | C8 (industrial) |
| Temperature Grade | Automotive -40 C to +125 C | Industrial -40 C to +100 C | Industrial -40 C to +100 C | Industrial -40 C to +100 C | Industrial -40 C to +100 C | Industrial -40 C to +100 C | Industrial -40 C to +100 C |
| Embedded Memory | 1,728 Kbits | 1,728 Kbits | 1,728 Kbits | 1,728 Kbits | 1,728 Kbits | 900 Kbits | 378 Kbits |
| On-chip ADC | 1 x 12-bit 1 MSPS | 1 x 12-bit 1 MSPS | 1 x 12-bit 1 MSPS | 1 x 12-bit 1 MSPS | 1 x 12-bit 1 MSPS | 1 x 12-bit 1 MSPS | 1 x 12-bit 1 MSPS |
| Configuration | Internal dual-boot flash | Internal dual-boot flash | Internal dual-boot flash | Internal dual-boot flash | Internal dual-boot flash | Internal dual-boot flash | Internal dual-boot flash |
| Approximate Unit Price (USD, qty-1) | $78.50 | $74.20 | $68.90 | $66.40 | $64.50 | $52.80 | $38.10 |
Key Differentiators
- Highest automotive temperature grade in the 484-BGA MAX 10 family (vs 10M25DAF484A7G)
- Highest logic density at the 484-BGA MAX 10 family node (vs 10M16DCF484C8G)
- Internal dual-boot configuration flash with no external PROM (vs 10M08DAF484C8G)
Design Notes
The 484-ball BGA package demands a PCB stack-up with microvia or via-in-pad technology for fan-out. Use 1.0 mm or 1.27 mm pitch BGA escape routing with matched length on LVDS pairs (within 150 mil). Provide at least 4 inner ground planes and 2 power planes to deliver clean VCCINT and VCCIO rails. Estimated: a 1-oz copper 6-layer stack-up with 0.8 mm dielectric yields the recommended 1 Gbps LVDS performance.
The MAX 10 internal voltage regulators generate VCCINT from a single 3.3 V or 1.8 V VCC_ONE supply. Decouple each VCCIO bank with 0.1 uF and 10 uF ceramic capacitors placed within 50 mil of the supply pins. Estimated: a 25K LE design running at 80 percent utilization draws approximately 1.2 A from VCC_ONE at 100 MHz core clock; budget 3 W for the FPGA plus decoupling margin.
At automotive junction temperatures up to +125 C, the 484-BGA requires a thermal pad connected to a ground plane with thermal vias. Estimated: with 3 W dissipation and the 484-BGA theta_JA of approximately 12 C/W on a JEDEC 4-layer test board, junction temperature rise is roughly 36 C above ambient, leaving 60 C margin. For sealed automotive enclosures, place 4-8 thermal vias under the BGA thermal pad to a dedicated inner copper pour.
Do not exceed the 1.8 V or 3.3 V VCC_ONE supply range or the I/O bank's VCCIO per-pin voltage tolerance, or latch-up may occur. Always configure unused GPIO as tri-stated inputs with weak pull-ups and tie JTAG TCK, TMS, TDI, TDO to known states through 10 kohm resistors. Dual-boot flash configuration requires correct CFM0/CFM1 sector programming; verify image checksums before field deployment.
Compliance Information
RoHS and REACH compliance per Intel MAX 10 product environmental documentation. Automotive temperature grade and AEC-style flow per Intel automotive-quality program. Halogen-free per JEDEC JS709. Conflict-minerals statement available on Intel's CSR page.
