10M25DAF484A7G - MAX 10 FPGA, 25K LE, 484-BGA | Intel
MPN: 10M25DAF484A7G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $72.3 | $723.00 |
| 100 | $65.1 | $6,510.00 |
| 500 | $58.4 | $29,200.00 |
| 1,000 | $52.75 | $52,750.00 |
Drop-in alternatives for 10M25DAF484A7G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10M25DAF484C8G
✅ Drop-In✓ In Stock
$50 / Unit
View Datasheet →10M25DAF484I7G
✅ Drop-In✓ In Stock
$99.8 / Unit
View Datasheet →10M25DAF484A7P
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$54.75 / Unit
View Datasheet →10M50DAF484A7G
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
10M16DAF484A7G
✅ Drop-In✓ In Stock
$12.1 / Unit
View Datasheet →10M25DAF484A7G Maximum Ratings & Electrical Characteristics
| Family | MAX 10 |
| Logic Elements | 25,000 |
| Embedded Memory (bits) | 691,200 |
| Embedded Memory Blocks | 360 (M9K) |
| 18x18 Multipliers | 25 |
| User I/O Pins | 360 |
| Package | 484-ball BGA |
| Operating Temperature | -40C to +125C (automotive) |
| Configuration Memory | On-chip flash (non-volatile) |
| PLLs | 8 |
| Global Clock Networks | 16 |
| On-chip ADC | 12-bit SAR, 16 channels, up to 1 Msps |
| Hard Memory Controller | DDR3 / LPDDR3 |
| Core Voltage | 1.2 V |
| I/O Voltage | 2.5 V / 3.3 V (bank-dependent) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
10M25DAF484A7G 484-ball bga Pin Configuration Guide
Complete pinout information for 10M25DAF484A7G (484-ball bga package) with 360 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M25DAF484A7G.
Refer to the datasheet for full pin configuration.
Estimated pin count: 360 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M25DAF484A7G is suitable for 6 applications: Industrial Motor Control, Automotive Body Electronics, LED Video Wall Tile Controller, Industrial Sensor Hub with Local Analytics, Portable Medical Device Interface, Machine Vision Pre-Processing.
Industrial Motor Control
The 10M25DAF484A7G is well suited for industrial motor control because its 25K logic elements and 25 dedicated 18x18 multipliers can implement field-oriented control (FOC) algorithms with adequate headroom for current loop, PWM generation, and encoder feedback. The integrated 12-bit SAR ADC samples phase currents at up to 1 Msps, eliminating an external ADC for cost-sensitive servo drives. The on-chip DDR3 controller interfaces directly to external SDRAM for waveform logging. Operating from -40C to +125C, the device survives the thermal envelope of an IPM-mounted motor inverter board. Designers typically pair the MAX 10 with an external gate driver such as the EiceDRIVER 2ED family for the high-side/low-side drive.
Recommended
Automotive Body Electronics
For body control modules, LED drivers, and CAN/LIN gateway applications, the 10M25DAF484A7G offers instant-on behavior from its non-volatile flash, eliminating boot time delays that complicate ASIC replacement. Automotive temperature qualification (-40C to +125C) and 360 user I/Os support many LED strings, switch inputs, and LIN/CAN transceivers on a single chip. The hard memory controller interfaces with DDR3 for diagnostic logging. Compared with discrete MCU approaches, the FPGA enables late-stage design changes without silicon respin. Combined with TLE9250 CAN transceivers and TPSx LED drivers, the MAX 10 forms a flexible body-ECU platform.
Recommended
LED Video Wall Tile Controller
Each LED video wall tile requires a controller that streams pixel data at high refresh rates over many parallel lanes. The 10M25DAF484A7G with 360 user I/Os supports up to 18 parallel HUB75 chains or 12 high-speed LVDS links driving a 256x256 RGB panel. The 25 dedicated 18x18 multipliers handle brightness correction, gamma mapping, and color-space conversion in real time. The on-chip ADC monitors panel temperature for thermal compensation. The 484-BGA footprint allows dense layout with controlled-impedance traces for LVDS pairs. Designers commonly pair the MAX 10 with a Bitec video input board and external SDRAM for frame buffering.
Recommended
Industrial Sensor Hub with Local Analytics
In a distributed IIoT sensor hub, the 10M25DAF484A7G aggregates multiple analog and digital sensor inputs, performs on-board pre-processing (filtering, FFT, threshold detection), and forwards processed data via Ethernet or RS-485. The integrated 12-bit SAR ADC samples up to 16 analog channels, eliminating dedicated ADC chips and reducing BOM. The 25K LE fabric is sufficient for small FFTs and PID loops running locally. Non-volatile flash storage retains calibration data and IP configuration without an external EEPROM. The automotive temperature grade ensures operation in unconditioned factory cabinets. Pair with a Wiznet W5500 Ethernet controller for connectivity.
Recommended
Portable Medical Device Interface
Portable medical devices such as patient monitors and pulse oximeters benefit from the 10M25DAF484A7G's instant-on capability and integrated ADC. The MAX 10 samples sensor signals, drives a small TFT display, and manages USB or Bluetooth data uplink to a host processor. The on-chip ADC reads SpO2 photodiode signals directly, while logic elements implement digital filtering and signal-quality checks. Non-volatile flash stores device calibration constants. The automotive-grade temperature envelope ensures reliable operation across clinical and field environments. Pair with an external Bluetooth module such as the RN4678 for wireless data link.
Recommended
Machine Vision Pre-Processing
For low-cost machine vision pre-processing in industrial inspection, the 10M25DAF484A7G interfaces with a parallel-output image sensor (e.g., 1 MPixel MT9V032), performs pixel-level processing (threshold, blob detection, line scan), and outputs results over Ethernet or USB. The 25K LE fabric and 25 multipliers support simple convolution kernels and morphological operations. DDR3 hard memory controller handles line-buffer storage efficiently. Compared with a full GPU or high-end FPGA approach, the MAX 10 keeps BOM cost low while delivering deterministic latency. Designers commonly combine the FPGA with an Aptina/onsemi CMOS sensor and external SRAM.
Recommended
Recommended Products Summary
Engineering reference data for 10M25DAF484A7G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M25DAF484C8G | 10M25DAF484I7G | 10M25DAF484A7P | 10M50DAF484A7G | 10M16DAF484A7G |
|---|---|---|---|---|---|---|
| Package | 484-ball BGA | 484-ball BGA - same | 484-ball BGA - same | 484-ball BGA - same | 484-ball BGA - same | 484-ball BGA - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 25,000 | 25,000 | 25,000 | 25,000 | 50,000 | 16,000 |
| Embedded Memory (bits) | 691,200 | 691,200 | 691,200 | 691,200 | 1,638,400 | 414,720 |
| 18x18 Multipliers | 25 | 25 | 25 | 25 | 50 | 16 |
| User I/O | 360 | 360 | 360 | 360 | 360 | 360 |
| Temperature Grade | Automotive -40C to +125C | Commercial 0C to +85C | Industrial -40C to +100C | Automotive -40C to +125C | Automotive -40C to +125C | Automotive -40C to +125C |
| On-chip ADC | 12-bit SAR, 16 ch, 1 Msps | 12-bit SAR, 16 ch, 1 Msps | 12-bit SAR, 16 ch, 1 Msps | 12-bit SAR, 16 ch, 1 Msps | 12-bit SAR, 16 ch, 1 Msps | 12-bit SAR, 16 ch, 1 Msps |
| Approx Unit Price (qty 1, USD) | 78.50 | 61.20 | 72.00 | 82.10 | 118.40 | 62.80 |
Key Differentiators
- Non-volatile on-chip configuration flash (vs Cyclone V (5CEFA series))
- Integrated 12-bit SAR ADC (vs Cyclone V (5CEFA series))
- Higher density at same package (vs 10M16DAF484A7G)
- Drop-in scalability within family (vs 10M50DAF484A7G)
Design Notes
The MAX 10 requires a 1.2V core rail plus 2.5V and 3.3V rails for I/O banks and on-chip flash programming. Place at least four 4.7uF ceramic decoupling capacitors within 5mm of each power pin. Use a separate LDO for the analog VCCA supply feeding the SAR ADC to minimize digital switching noise coupling. The device's dynamic current can spike to 500mA during configuration; ensure the regulator handles the inrush without sagging below 1.15V on VCCINT.
At full fabric utilization (90% LEs, all multipliers running at 200 MHz, ADC active), estimated power dissipation is approximately 1.8W. The 484-BGA package's theta_JA is rated around 14 C/W on a JEDEC 4-layer test board. Estimated: at 1.8W and 14 C/W the junction rises about 25C above ambient. For automotive-grade (-40C to +125C junction) operation in an enclosed cabinet, ensure 1 square inch of unbroken inner copper plane under the BGA to keep junction below 110C. Avoid placing the FPGA on the bottom of the PCB unless thermal vias are used.
The 484-BGA has a 1.0mm ball pitch; use 0.4mm drilled microvias and a 4-layer stackup with 1oz copper. Escape top-layer signal traces between BGA balls on a 0.2mm grid. Match 100-ohm differential impedance for LVDS pairs. Fan-out all JTAG pins (TCK, TMS, TDI, TDO) to a 0.1-inch header for in-system programming access. Place a 32.768 kHz clock crystal within 8mm of the CLK0p pin for PLL reference stability.
Do not program the on-chip flash before the core rail is stable; the configuration controller can lock out JTAG access. Always include a delay (typically 100ms) between VCCINT reaching 1.2V and beginning configuration. Verify CONF_DONE pulls high before releasing system reset; otherwise the rest of the board will start with the FPGA in an undefined state. For automotive designs, enable the CRC error-checking feature to detect bitstream corruption in the field.
DDR3 interfaces on the MAX 10 require matched-length routing within 25 mils (0.635mm) across the byte lane. Use fly-by topology for memory address/command signals with termination at the last DRAM device. Enable on-chip dynamic phase shifting (DPS) for read/write leveling. Source-synchronous LVDS inputs benefit from the MAX 10's dedicated DPA (Dynamic Phase Alignment) blocks which eliminate per-channel manual calibration.
Compliance Information
RoHS and REACH compliance per Intel product declaration; AEC-Q100 qualified due to automotive temperature grade; lead-free / halogen-free per MAX 10 datasheet.
