10M16DAF484C7G - MAX 10 FPGA 16K LE 484-FBGA | Intel
MPN: 10M16DAF484C7G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $80 | $80.00 |
| 10 | $75 | $750.00 |
| 100 | $68.5 | $6,850.00 |
| 500 | $62 | $31,000.00 |
| 1,000 | $55.5 | $55,500.00 |
Drop-in alternatives for 10M16DAF484C7G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10M16DAF484A7G
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View Datasheet →10M16DCF484C8G
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View Datasheet →10M16DAF256C7G
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View Datasheet →10M08DAF484C8G
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View Datasheet →10M08DCF484C8G
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View Datasheet →10M16DAF484C7G Maximum Ratings & Electrical Characteristics
| Family | MAX 10 |
| Logic Elements | 16000 |
| Embedded Memory | 504 Kbits (10,240 x 5 RAM bits) |
| Embedded User Flash | 562 Kbits |
| Digital Signal Processing (DSP) Blocks | 16 (18x18 multipliers) |
| Maximum User I/O Pins | 320 |
| ADC Blocks | 2 (12-bit SAR) |
| Analog Inputs | Up to 18 single-ended |
| PLLs | 4 |
| Process Technology | 55 nm |
| Core Voltage (VCCINT) | 1.2 V |
| Operating Temperature | 0C to 85C (commercial, -7C speed grade) |
| Package | 484-FBGA (F484), 23 mm x 23 mm, 1.0 mm pitch |
| Mounting Type | Surface Mount |
| Configuration | Non-volatile (dual-boot on-chip flash) |
| RoHS Status | Compliant |
10M16DAF484C7G 484-fbga (f484), 23 mm x 23 mm, 1.0 mm pitch Pin Configuration Guide
Complete pinout information for 10M16DAF484C7G (484-fbga (f484), 23 mm x 23 mm, 1.0 mm pitch package) with 320 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M16DAF484C7G.
Refer to the datasheet for full pin configuration.
Estimated pin count: 320 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M16DAF484C7G is suitable for 7 applications: Industrial Motor Control, Factory Automation PLC, Video Bridging and Display Controllers, IoT Edge Nodes with Sensor Fusion, Medical Patient Monitoring, Automotive Infotainment and Body Electronics, Communications and Networking Bridges.
Industrial Motor Control
The 10M16DAF484C7G suits industrial motor control with its 16,000 logic elements and 16 DSP blocks (18x18 multipliers) handling field-oriented control (FOC) loops, PWM generation, and encoder feedback in a single chip. The integrated 12-bit SAR ADC samples up to 18 analog inputs at 1 MSPS per channel for current sensing and bus voltage monitoring, eliminating an external ADC. Non-volatile dual-boot flash supports fail-safe firmware updates on the factory floor. Source: Intel MAX 10 industrial reference designs.
Recommended
Factory Automation PLC
For PLC backplanes and distributed I/O modules, the 10M16DAF484C7G provides 320 user I/Os to handle dozens of digital inputs and outputs without external I/O expanders. Its on-chip flash and DSP blocks enable deterministic ladder-logic execution and PID control loops, while four PLLs synthesize multiple baud-rate clocks for industrial protocols (RS-485, CAN, EtherCAT). The 484-FBGA package supports ruggedized boards operating in 0-85C ambient. Source: Intel MAX 10 industrial user guide.
Recommended
Video Bridging and Display Controllers
The 10M16DAF484C7G handles real-time video bridging between parallel RGB, LVDS, MIPI, and HDMI interfaces, supported by its 320 I/Os and DSP blocks for color-space conversion and chroma resampling. On-chip M9K memory blocks buffer scan-line data without external SDRAM for sub-1080p streams. Quartus Prime IP cores provide ready-made video timing generators and pixel-clock PLLs. Source: Intel MAX 10 video reference designs.
Recommended
IoT Edge Nodes with Sensor Fusion
The 10M16DAF484C7G integrates two 12-bit ADC blocks, DSP multipliers, and 504 Kbits of RAM for sensor fusion at the network edge, replacing a discrete MCU + ADC + CPLD trio. Its 16,000 logic elements implement lightweight RISC-V soft cores or custom DSP pipelines for vibration, temperature, and current monitoring. Non-volatile on-chip flash enables instant-on behavior with zero external boot time. Source: Intel MAX 10 IoT user guide.
Recommended
Medical Patient Monitoring
The 10M16DAF484C7G fits portable patient-monitoring devices where its 12-bit SAR ADC samples ECG, SpO2, and temperature analog channels while DSP blocks filter and detect QRS complexes in real time. Low FPGA power consumption extends battery life, and dual-boot flash supports FDA-traceable firmware updates. The commercial 0-85C temperature range covers body-worn and bedside use. Source: Intel MAX 10 healthcare reference designs.
Recommended
Automotive Infotainment and Body Electronics
The 10M16DAF484C7G (commercial grade) is suitable for non-safety automotive body electronics such as HVAC panels, ambient lighting controllers, and rear-seat infotainment, where its 320 I/Os drive LED matrices and capacitive-touch interfaces. For safety-critical applications (gateway, ADAS), designers must select the AEC-Q100-qualified -I temperature variant (10M16DAF484I7G). On-chip ADCs monitor battery voltage and temperature sensors. Source: Intel MAX 10 automotive user guide.
Recommended
Communications and Networking Bridges
The 10M16DAF484C7G bridges industrial Ethernet, CAN, RS-485, and SPI buses with 320 user I/Os supporting multiple concurrent interfaces. Its four PLLs synthesize independent baud-rate clocks per port, while DSP blocks accelerate CRC and encryption offload. Non-volatile boot allows instant-on bridging without waiting for external PROM load. Source: Intel MAX 10 communications reference designs.
Recommended
Recommended Products Summary
Engineering reference data for 10M16DAF484C7G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M16DAF484A7G | 10M16DCF484C8G | 10M16DAF256C7G | 10M08DAF484C8G | 10M08DCF484C8G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-FBGA (F484), 23x23 mm | 484-FBGA (F484) - same | 484-FBGA (F484) - same | 256-FBGA (F256) - different | 484-FBGA (F484) - same | 484-FBGA (F484) - same |
| Logic Elements | 16000 | 16000 | 16000 | 16000 | 8000 | 8000 |
| Speed Grade | -7 (C7) | -7 (A7) | -8 (C8) | -7 (C7) | -8 (C8) | -8 (C8) |
| Temperature Range | 0C to 85C (commercial) | 0C to 85C (commercial) | 0C to 85C (commercial) | 0C to 85C (commercial) | 0C to 85C (commercial) | 0C to 85C (commercial) |
| DSP Blocks | 16 | 16 | 16 | 16 | 8 | 8 |
| Embedded User Flash | 562 Kbits | 562 Kbits | 562 Kbits | 562 Kbits | 308 Kbits | 308 Kbits |
| Embedded RAM | 504 Kbits | 504 Kbits | 504 Kbits | 504 Kbits | 378 Kbits | 378 Kbits |
| Maximum User I/O | 320 | 320 | 320 | 178 | 320 | 320 |
| ADC Blocks | 2 (12-bit SAR) | 2 (12-bit SAR) | 2 (12-bit SAR) | 2 (12-bit SAR) | 2 (12-bit SAR) | 2 (12-bit SAR) |
| Configuration | Dual-boot on-chip flash | Dual-boot on-chip flash | Dual-boot on-chip flash | Dual-boot on-chip flash | Dual-boot on-chip flash | Dual-boot on-chip flash |
Key Differentiators
- Highest LE density in the MAX 10 F484-package lineup (vs 10M08DAF484C8G)
- Balanced speed grade for Fmax and power (vs 10M16DAF484A7G)
- Dual-boot on-chip flash eliminates external boot PROM (vs Cyclone IV (10CL025YU256C8G))
- Highest I/O count in F484 package (vs 10M16DAF256C7G)
Design Notes
The MAX 10 FPGA integrates on-chip voltage regulators, but designers must still supply VCCA (analog ADC supply) and VCCINT (core 1.2 V) separately with per-pin decoupling of 0.1 uF and 10 uF bulk capacitors. The ADC's VCCA must be isolated from noisy digital rails through a ferrite bead to achieve the datasheet's 12-bit SNR; sharing VCCA with switching regulator outputs degrades ADC noise floor by 6-10 dB. Source: Intel MAX 10 hardware design guidelines.
The 484-FBGA package exposes the die through the BGA balls and central thermal balls; for sustained operation above 25C ambient with high utilization (>70% LE, DSP blocks active), allocate at least 4 thermal balls to a continuous copper pour on the top layer and stitch additional vias to inner ground planes. Without thermal management, junction temperatures can exceed 100C and trigger thermal-sensor throttling or device reset. Source: Intel MAX 10 thermal management user guide.
Route all high-speed differential pairs (LVDS, DDR, parallel RGB) with 100 ohm differential impedance and length matching within 150 mils. The F484 package supports 1.0 mm BGA pitch, which permits microvia/stacked-via PCB stack-ups. For the integrated ADC analog inputs, keep analog traces short, guarded by ground, and away from switching signals to avoid digital coupling into the ADC sample window. Source: Intel MAX 10 board design guidelines.
Common pitfalls include: (1) using the wrong speed grade in timing closure - Quartus TimeQuest must be run with the exact -C7 device selected; (2) leaving dual-boot configuration disabled when field updates are required - the CFG pin must be tied correctly per datasheet; (3) forgetting to enable the on-chip temperature sensor before reading it via ADC channel; (4) assuming 320 user I/Os are simultaneously available - actual usable I/O depends on package pinout and assigned functions. Source: Intel MAX 10 user guides.
Place decoupling capacitors on the bottom side directly beneath the BGA, with vias within 5 mm of the corresponding power balls. Decoupling values: 0.1 uF for every VCC/VCCINT pin, 10 uF bulk per power rail, and 4.7 uF on VCCA_ADC. For JTAG, route TMS, TDI, TDO, TCK as a 50 ohm single-ended bus with TCK guarded to ground; long JTAG traces (>75 mm) cause programming failures. Source: Intel MAX 10 hardware design guidelines.
Compliance Information
RoHS compliance per Intel MAX 10 product page. AEC-Q100 not applicable to the commercial -C7 variant; industrial/automotive -I variants are AEC-Q100 qualified. Lead-free reflow profile per J-STD-020.
