10M50DAF484C7G - MAX 10 FPGA 50K LE, 484-BGA | Intel / Altera
MPN: 10M50DAF484C7G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $95 | $95.00 |
| 10 | $88.5 | $885.00 |
| 100 | $78.4 | $7,840.00 |
| 500 | $72.1 | $36,050.00 |
| 1,000 | $65.8 | $65,800.00 |
Drop-in alternatives for 10M50DAF484C7G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10M40DAF484C7G
✅ Drop-In✓ In Stock
$92.4 / Unit
View Datasheet →10M50DAF484C8G
✅ Drop-In📋 Reference alternative (not in catalog)
10M50DAF484I7G
✅ Drop-In✓ In Stock
$58.2 / Unit
View Datasheet →10M50DAF484A7G
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
10M50DAF484A7P
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
10M25DAF484C7G
✅ Drop-In✓ In Stock
$38.5 / Unit
View Datasheet →10M50DAF484C7G Maximum Ratings & Electrical Characteristics
| Product Type | FPGA (Field-Programmable Gate Array) |
| Series | MAX 10 |
| Logic Elements | 50,000 |
| Embedded Memory | 1,677,312 bits (approximately 1.6 Mbit) |
| Embedded 18x18 Multipliers | 312 |
| Number of User I/O | 360 |
| Supply Voltage | 1.2 V core (VCCINT) |
| Package | 484-ball FBGA (F484), 23 x 23 mm, 1.0 mm pitch |
| Mounting Type | Surface Mount |
| Configuration Memory | Non-volatile embedded flash (dual-configuration) |
| PLLs | 2 |
| ADC | Integrated 12-bit SAR, up to 17 channels |
| Operating Temperature | 0 C to +85 C (commercial grade, C7 speed) |
| Process Technology | 55 nm embedded flash CMOS |
| MSL Level | 3 |
| RoHS Status | Compliant |
10M50DAF484C7G 484-ball fbga (f484), 23 x 23 mm, 1.0 mm pitch Pin Configuration Guide
Complete pinout information for 10M50DAF484C7G (484-ball fbga (f484), 23 x 23 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M50DAF484C7G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M50DAF484C7G is suitable for 6 applications: Industrial Motor Control, Factory Automation I/O Expansion, Portable Test & Measurement, Video Bridging & Display Aggregation, Board Management Controller, Sensor Aggregation Hub for IoT Edge Gateways.
Industrial Motor Control
The 10M50DAF484C7G fits industrial motor-control designs because its 312 embedded 18x18 multipliers can compute field-oriented control (FOC) and space-vector PWM loops in microseconds. With 360 user I/Os, the FPGA can read quadrature encoders, drive three-phase gate drivers, and run safety logic in parallel. The integrated 12-bit SAR ADC supports up to 17 channels for shunt-current and bus-voltage sensing, eliminating an external ADC chip. Non-volatile flash means the controller powers up running field firmware within milliseconds - critical for conveyors and robotic cells where PLC scan-time matters. Designers typically deploy the 50K LE variant in mid-power servo drives from 1 kW to 15 kW where 10M25 lacks headroom but 10M40 is borderline on DSP.
Recommended
Factory Automation I/O Expansion
Used as a programmable I/O concentrator on the factory floor, the 10M50DAF484C7G aggregates discrete sensors, RS-485 nodes, and 24 V industrial buses into a single high-speed uplink. The 360 GPIO budget lets a single device handle a 256-point digital input module plus 128 outputs with comfortable margin. Hardware-accelerated Modbus, EtherCAT slave, or PROFINET IRT preprocessing can run alongside deterministic safety logic in the LAB fabric. The dual-configuration flash supports remote firmware update with rollback - a key requirement for Industry 4.0 retrofit installations where unplanned downtime is expensive.
Recommended
Portable Test & Measurement
Handheld oscilloscopes, logic analyzers, and protocol testers leverage the 10M50DAF484C7G for low-latency signal conditioning and on-the-fly protocol decoding. The 50K LEs are enough to run multiple soft IP cores (SPI, I2C, UART, CAN-FD, SENT) in parallel while the integrated ADC samples analog channels. The 484-FBGA package keeps board area under 25 mm squared, supporting compact handheld form factors. Non-volatile configuration lets the instrument boot to a known image without external memory, improving cold-start reliability in field-deployed units.
Recommended
Video Bridging & Display Aggregation
The 10M50DAF484C7G is widely used as a low-cost video bridge between MIPI CSI-2, LVDS, and parallel RGB interfaces in industrial HMIs and digital signage controllers. With 360 I/Os, designers can implement dual-display pipelines plus a touch controller and backlight PWM on a single device. The 50K LE budget absorbs color-space conversion, chroma resampling, and simple OSD overlays without an external processor. The MAX 10's instant-on flash also shortens boot time for kiosk and medical-cart displays.
Recommended
Board Management Controller
In larger computing platforms the 10M50DAF484C7G serves as a board management controller (BMC) handling power sequencing, thermal monitoring, fan control, and FRU/EEPROM emulation. Its non-volatile flash and 50K LEs are overkill for plain I2C/SPI glue but ideal when the BMC must also run a soft RISC-V core for vendor diagnostics. The integrated ADC reads VRM temperatures and currents, while 360 I/Os cover reset distribution and post-code error capture. Compared to a dedicated BMC ASIC, the MAX 10 allows late-binding firmware updates without respinning the host board.
Recommended
Sensor Aggregation Hub for IoT Edge Gateways
Industrial IoT edge gateways use the 10M50DAF484C7G to aggregate dozens of sensor streams - Modbus, CAN, 4-20 mA loops, and digital pulses - into a single preprocessed MQTT or OPC-UA uplink. The 50K LE fabric runs deterministic data-acquisition state machines while a soft ARM Cortex-M1 or RISC-V core handles protocol marshalling. The 360 I/Os cover multiple isolated RS-485 ports plus Ethernet-side GPIOs. The integrated ADC and non-volatile configuration reduce external component count, which is critical for sealed, fanless edge nodes deployed in factory cabinets.
Recommended
Recommended Products Summary
Engineering reference data for 10M50DAF484C7G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M40DAF484C7G | 10M50DAF484C8G | 10M50DAF484I7G | 10M50DAF484A7G | 10M25DAF484C7G |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 484-FBGA (F484) 23x23 mm | 484-FBGA (F484) - same | 484-FBGA (F484) - same | 484-FBGA (F484) - same | 484-FBGA (F484) - same | 484-FBGA (F484) - same |
| Logic Elements | 50,000 | 40,000 | 50,000 | 50,000 | 50,000 | 25,000 |
| Speed Grade | C7 (commercial) | C7 | C8 (faster) | I7 (industrial) | A7 (automotive) | C7 |
| Temperature Range | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C | -40 C to +100 C | -40 C to +125 C | 0 C to +85 C |
| Embedded 18x18 Multipliers | 312 | 240 | 312 | 312 | 312 | 156 |
| Embedded Memory (bits) | 1,677,312 | 1,294,336 | 1,677,312 | 1,677,312 | 1,677,312 | 823,296 |
| User I/O | 360 | 360 | 360 | 360 | 360 | 360 |
| Configuration Memory | Non-volatile flash | Non-volatile flash | Non-volatile flash | Non-volatile flash | Non-volatile flash | Non-volatile flash |
| Automotive Qualified | No | No | No | No | Yes (AEC-Q100) | No |
Key Differentiators
- Highest logic density with 360 I/Os in MAX 10 family at 484-FBGA (vs 10M40DAF484C7G)
- Industrial temperature option available in same footprint (vs 10M50DAF484C8G)
- Automotive AEC-Q100 qualified variant available (vs 10M25DAF484C7G)
Design Notes
The 484-FBGA package uses a 1.0 mm ball pitch and a 23 mm x 23 mm body. PCB layout must use laser-drilled microvias or 0.4 mm mechanical drills for fanout, with full ground planes on inner layers and at least four thermal vias under the central die-pad region. Use ENIG or OSP surface finish to ensure reliable BGA solder joint formation; HASL is not recommended for 1.0 mm pitch BGA.
The MAX 10 requires a 1.2 V VCCINT core supply plus 2.5 V/3.3 V VCCIO banks; inrush current during flash configuration can spike to several hundred milliamps. Place 100 nF decoupling caps adjacent to every power pin and bulk 47 uF tantalums near the regulator. Estimated: a fully populated 10M50 at 50 percent toggle rate draws roughly 300-500 mA from VCCINT - confirm with Quartus PowerPlay for your design.
Do not mix C7 and I7 bitstreams on the same hardware without regenerating the SOF file in Quartus Prime - the temperature and timing assumptions differ. Engineers migrating vertically between MAX 10 densities must verify I/O bank compatibility; the F484 footprint pinout is consistent across 10M25/10M40/10M50, but the M144 and U324 footprints are NOT drop-in compatible. Always use the latest MAX 10 pinout file from Intel before committing PCB layout.
Although the MAX 10 is non-volatile, sustained high toggle rates push junction temperature up. With theta_JA around 15 C/W for the 484-FBGA on a 4-layer JEDEC test board, 1 W dissipation yields about 15 C rise. For fanless sealed enclosures, derate clock frequency or reduce LAB utilization to keep Tj below 85 C for the C7 commercial grade.
Compliance Information
RoHS and lead-free per Intel MAX 10 product page. AEC-Q100 not qualified for this C7 commercial part - choose A7 variant for automotive. Halogen-free status not explicitly listed in the verified data - set to unknown.
