10M40DAF484C7G - MAX 10 FPGA, 40K LE, 484-BGA | Intel / Altera
MPN: 10M40DAF484C7G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $142.5 | $142.50 |
| 10 | $128.75 | $1,287.50 |
| 100 | $110.2 | $11,020.00 |
| 250 | $99.8 | $24,950.00 |
| 500 | $92.4 | $46,200.00 |
Drop-in alternatives for 10M40DAF484C7G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10M40DAF484C8G
✅ Drop-In📋 Reference alternative (not in catalog)
10M40DAF484I7G
✅ Drop-In📋 Reference alternative (not in catalog)
10M40DAF256C7G
✅ Drop-In✓ In Stock
$46.83 / Unit
View Datasheet →10M25DAF484C7G
✅ Drop-In✓ In Stock
$38.5 / Unit
View Datasheet →10M16DAF484C7G
✅ Drop-In✓ In Stock
$55.5 / Unit
View Datasheet →10M40DAF484C7G Maximum Ratings & Electrical Characteristics
| Family | MAX 10 |
| Logic Elements (LE) | 40,000 |
| Embedded Memory (bits) | 1,290,240 |
| User I/Os | 360 |
| DSP Blocks | 4 |
| Package | 484-BGA (FineLine BGA) |
| Configuration Memory | Internal flash, dual-image capable |
| On-chip ADC | 12-bit, integrated |
| Temperature Range | Commercial (C7G suffix) |
| Process Node | 55 nm embedded flash |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
| Supported Design Tool | Intel Quartus Prime |
10M40DAF484C7G 484-bga (fineline bga) Pin Configuration Guide
Complete pinout information for 10M40DAF484C7G (484-bga (fineline bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M40DAF484C7G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M40DAF484C7G is suitable for 7 applications: Industrial Motor Control, Machine Vision Pre-Processing, Video Bridging and Protocol Translation, I/O Expansion and Protocol Translation, Portable Test and Measurement Instrumentation, Low-Cost Display Controllers, Industrial IoT Edge Gateways.
Industrial Motor Control
The 10M40DAF484C7G fits industrial motor control applications because its 40,000 logic elements and 4 DSP blocks deliver enough fabric to implement field-oriented control (FOC) loops, PWM generation, and encoder decoding on a single device. The 360 user I/Os in the 484-BGA package fan out to multi-axis gate drivers, Hall/quadrature encoders, and isolation barriers without external bus expander chips. The integrated 12-bit ADC samples motor phase currents in real time, eliminating an external ADC and reducing BOM cost. The MAX 10's instant-on flash configuration ensures the controller is alive within microseconds of power-up, which is critical for safe-turbous spindle braking.
Recommended
Machine Vision Pre-Processing
The 10M40DAF484C7G is well suited to entry-level machine vision pre-processing pipelines, where 40K logic elements implement Bayer demosaicing, simple thresholding, and frame-rate conversion without needing an external processor. The 1,290,240 bits of embedded SRAM serve as line buffers for image data, and the high I/O count supports direct MIPI-CSI or parallel LVDS camera interfaces alongside the 484-BGA footprint. The on-chip ADC samples ambient-light sensors or trigger inputs, while 4 DSP blocks accelerate convolution kernels for edge detection. Designers using Quartus Prime can leverage the VIP suite to assemble pixel pipelines quickly.
Recommended
Video Bridging and Protocol Translation
For video bridging designs, the 10M40DAF484C7G converts between HDMI, MIPI-CSI, parallel RGB, and LVDS without an external companion chip. Its 40K logic elements hold the pixel pipeline and color-space converter logic, while the 1,290,240 bits of SRAM buffer active scan lines. The 360 user I/Os in the 484-BGA package accommodate the wide parallel buses common in industrial panels (18/30-bit RGB) and the high-speed serial lanes used by MIPI/CSI. The integrated temperature-sensing diode lets the design throttle the backlight or warn of overheating without external thermistors.
Recommended
I/O Expansion and Protocol Translation
The 10M40DAF484C7G works well as a protocol-translation hub where a host CPU lacks enough native I/O for industrial sensors, GPIOs, or legacy buses. The 360 user I/Os in the 484-BGA expose UART, SPI, I2C, RS-485, and parallel buses simultaneously, while 40K logic elements handle address mapping and timing translation. The instant-on flash configuration means translation begins as soon as power is applied, with no external boot device. Dual-image flash allows field firmware updates without bricking the hub.
Recommended
Portable Test and Measurement Instrumentation
Handheld oscilloscopes, data loggers, and bench instruments benefit from the 10M40DAF484C7G's mix of on-chip ADC, 40K logic elements, and 360 I/Os. The integrated 12-bit ADC digitizes analog front-end signals at up to 1 MSPS, while logic elements implement trigger decoding, FFT pre-processing, and display refresh. The 1,290,240 bits of SRAM act as deep capture memory for transient events. The commercial temperature range and surface-mount BGA fit inside compact instrument enclosures, and Quartus Prime's SignalTap logic analyzer provides on-chip debug without external probes.
Recommended
Low-Cost Display Controllers
Low-cost display controllers for industrial HMIs, kiosks, and consumer appliances use the 10M40DAF484C7G to drive TFT panels up to 1080p from a low-bandwidth host interface. The 40K logic elements implement pixel doubling, color correction, and backlight PWM, while the 360 user I/Os expose RGB888 plus LVDS to the panel. The integrated ADC reads touch-controller or ambient-light signals, eliminating a separate microcontroller. The 484-BGA package sits between display and host board, simplifying the mechanical layout of slim-panel designs.
Recommended
Industrial IoT Edge Gateways
The 10M40DAF484C7G serves as the programmable logic heart of industrial IoT edge gateways, aggregating data from sensors, RS-485 chains, and CAN buses before forwarding to the host processor. Its 40K logic elements implement Modbus, CANopen, and EtherCAT slave stacks directly, while the 360 user I/Os handle multiple physical interfaces concurrently. The 1,290,240 bits of embedded SRAM buffer protocol frames without external memory. The MAX 10's industrial-temp variant (10M40DAF484I7G) extends operation to -40C to 100C for factory-floor enclosures, and the instant-on configuration brings the gateway online within microseconds.
Recommended
Recommended Products Summary
Engineering reference data for 10M40DAF484C7G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M40DAF484C8G | 10M40DAF484I7G | 10M25DAF484C7G | 10M16DAF484C7G |
|---|---|---|---|---|---|
| Package | 484-BGA (FineLine BGA) | 484-BGA (FineLine BGA) - same | 484-BGA (FineLine BGA) - same | 484-BGA (FineLine BGA) - same | 484-BGA (FineLine BGA) - same |
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Logic Elements (LE) | 40,000 | 40,000 | 40,000 | 25,000 | 16,000 |
| Embedded Memory (bits) | 1,290,240 | 1,290,240 | 1,290,240 | 837,120 | 549,888 |
| User I/Os | 360 | 360 | 360 | 360 | 360 |
| DSP Blocks | 4 | 4 | 4 | 3 | 2 |
| Temperature Grade | Commercial (C7G) | Commercial (C8G) | Industrial (I7G) | Commercial (C7G) | Commercial (C7G) |
| On-chip ADC | 12-bit, integrated | 12-bit, integrated | 12-bit, integrated | 12-bit, integrated | 12-bit, integrated |
| Configuration Memory | Internal flash, dual-image | Internal flash, dual-image | Internal flash, dual-image | Internal flash, dual-image | Internal flash, dual-image |
Key Differentiators
- Highest logic density in 484-BGA within the MAX 10 family (vs 10M25DAF484C7G)
- Industrial-temperature drop-in available on identical silicon (vs 10M40DAF484I7G)
- More user I/Os than competing FPGAs in similar package (vs 10M16DAF484C7G)
- Integrated 12-bit ADC eliminates external ADC (vs Lattice ECP5 (cross-family, non-BGA equivalent))
Design Notes
The 484-BGA FineLine package of the 10M40DAF484C7G requires at least a 4-layer PCB stack-up with continuous ground and power planes directly under the BGA for return-path integrity. Use 0.5 mm pitch BGA escape routing with 4 mil traces and 4 mil spacing, and break out via-in-pad micro-vias if your fab supports them. Place 0.1 microfarad ceramic decoupling capacitors on every VCCIO/VCCINT ball within the breakout fan-out region; bulk 10 microfarad ceramics serve the FPGA core supply.
The 10M40DAF484C7G requires multiple supply rails (VCCINT core, VCCIO per I/O bank, VCCA_PLL, VCC_ADC) that must be sequenced according to Intel/Altera's MAX 10 power-up guidelines. Failing to sequence VCCINT before VCCIO can latch-up or damage the I/O cells. Use a dedicated power-management IC such as the LM3880 or a discrete MOSFET sequencing circuit. Estimated total quiescent current at 0C is approximately 200 mA on VCCINT; full-fabric switching adds 100-300 mA depending on toggle rate.
Estimated: at typical 25 percent toggle activity with 40K LE utilization, the 10M40DAF484C7G dissipates approximately 1.5 W to 2.0 W. The 484-BGA package has a theta_JA around 20 C/W on a 4-layer JEDEC board, producing a 30-40 C rise above ambient. For sealed industrial enclosures, consider attaching a small copper heat-spreader or thermal pad. Do not exceed the commercial temperature ceiling of 85 C at the case; switch to the 10M40DAF484I7G variant for -40 C to 100 C industrial deployments.
Use IBIS models for the MAX 10 to simulate LVDS and high-speed LVCMOS signaling before committing to the PCB. Match trace lengths within each LVDS pair to within 5 mils and keep impedance to 100 ohms differential. The 484-BGA package of the 10M40DAF484C7G has fine-pitch balls; follow the manufacturer-recommended BGA breakout template in the MAX 10 device pin connection guidelines. For DDR or LVDS memories, place series-termination resistors within 200 mils of the FPGA balls.
Do not leave any MAX 10 I/O bank supply (VCCIO) floating; unused banks still require power for the I/O buffers to enter a known state. Configure unused I/Os as tri-stated inputs with weak pull-up enabled to prevent floating pins drawing shoot-through current. Verify Quartus Prime device selection matches the exact 'C7G' speed/grade before programming; an 'I7G' file accidentally loaded into a commercial part may operate outside the rated temperature window.
Compliance Information
RoHS and REACH compliance per Altera/Intel product page. Not AEC-Q100 qualified; choose automotive-grade MAX 10 variants for AEC-Q100 applications. Halogen-free status not stated explicitly - set to unknown.
