5CGXBC5C7F27C8N - Cyclone V GX FPGA, 77K LE, 672-FBGA | Intel
MPN: 5CGXBC5C7F27C8N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $85.42 | $85.42 |
| 10 | $76.88 | $768.80 |
| 100 | $68.21 | $6,821.00 |
| 500 | $60.55 | $30,275.00 |
| 1,000 | $54.18 | $54,180.00 |
Drop-in alternatives for 5CGXBC5C7F27C8N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →5CGXBC5C7F27C8N Maximum Ratings & Electrical Characteristics
| Family | Cyclone® V GX |
| Logic Elements (LE) | 77,000 |
| Adaptive Logic Modules (ALM) | 29,080 |
| Total Embedded Memory | 5,001,216 bits (4,884 Kbits usable) |
| Embedded Memory Blocks (M10K + MLAB) | 446 × M10K + 231 × MLAB (approx.) |
| 18 × 18 Multipliers | 364 |
| PLLs | 6 |
| Global Clock Networks | 16 |
| Transceivers | 6 × 3.125 Gbps (GX) |
| PCIe Hard IP | Yes (Gen1/Gen2) |
| Core Voltage | 1.1 V |
| Process Node | 28 nm TSMC low-power |
| Package | 672-pin FBGA (F27, 27 mm × 27 mm) |
| Mounting Type | Surface Mount (BGA) |
| Operating Temperature | 0 °C to +85 °C (commercial, C8) |
| Configuration | JTAG (IEEE 1149.1) + Active Serial |
| RoHS Status | Compliant |
5CGXBC5C7F27C8N 672-pin fbga (f27, 27 mm × 27 mm) Pin Configuration Guide
Complete pinout information for 5CGXBC5C7F27C8N (672-pin fbga (f27, 27 mm × 27 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CGXBC5C7F27C8N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CGXBC5C7F27C8N is suitable for 7 applications: Industrial Machine Vision Frame Grabber, Motor Control and Servo Drive DSP, Broadcast Video Processing and Format Conversion, Low-Cost Software-Defined Radio Front End, PCI Express Endpoint Card (Gen2 x1/x2), Multi-Protocol Industrial Bridge / Gateway, Test & Measurement Instrumentation Front End.
Industrial Machine Vision Frame Grabber
The 5CGXBC5C7F27C8N is well suited to industrial machine vision because its 364 18x18 multipliers and ~5 Mbits of embedded memory (M10K + MLAB) can ingest Channel-Link, Camera Link, or MIPI-CSI2 streams through LVDS pairs while running edge-detection and color-space-conversion DSP in real time. Its commercial 0C-85C grade matches most factory-floor enclosures, and the six 3.125 Gbps transceivers support GbE Vision (GigE Vision) uplink without external PHYs. Power is typically 1.5-2.5 W at 100 MHz core, well within passive thermal envelopes.
Recommended
Motor Control and Servo Drive DSP
Servo drives benefit from the 5CGXBC5C7F27C8N's high 18x18 multiplier count and 6 PLLs, which together implement field-oriented control (FOC) loops for three-phase PMSM and induction motors at 50-100 kHz PWM. The hard PCIe Gen2 IP enables host communication for parameter updates and telemetry, while the 1.1 V 28 nm process keeps dissipation around 2-3 W — important in sealed IP65 drive housings. The commercial temperature grade is sufficient for inside-cabinet installations.
Recommended
Broadcast Video Processing and Format Conversion
In broadcast studios, the 5CGXBC5C7F27C8N's 5 Mbits of block RAM buffers SDI/HD-SDI line stores and color-space conversion tables, while its 364 hardware multipliers accelerate scaling, deinterlacing, and 3D comb-filter pipelines. The six transceivers can carry 3G-SDI (2.97 Gbps) when paired with an external reclocker, or transport compressed TS over SMPTE 2022. Quartus Prime DSP Builder accelerates algorithm development, and the F27 672-FBGA pinout supports the dense differential I/O required by HD-SDI/3G-SDI.
Recommended
Low-Cost Software-Defined Radio Front End
The 5CGXBC5C7F27C8N's six 3.125 Gbps transceivers interface directly to ADC/DAC companion chips such as the AD9680 or ADAR1000, enabling wideband I/Q capture and synthesis in the sub-6 GHz range. Its 364 multipliers implement digital down/up-conversion (DDC/DUC) and channelization filters, while the 5 Mbits of BRAM hold sample buffers and NCO tables. Power consumption around 2.5-3.5 W is acceptable for portable SDR enclosures, and the F27 FBGA exposes enough LVDS pairs for parallel ADC interfaces.
Recommended
PCI Express Endpoint Card (Gen2 x1/x2)
The integrated PCIe hard IP block in the 5CGXBC5C7F27C8N implements a Gen2 x1 or x2 endpoint without consuming any soft logic, leaving the 77K LE fabric free for application-level protocol bridging. Common roles include low-latency industrial I/O cards, data-acquisition endpoints, and protocol translation cards (e.g., GbE-to-PCIe bridges). At PCIe Gen2 the link uses ~2.5 GB/s of bandwidth, well within the device's six-transceiver budget when one or two are reserved for the PCIe link.
Recommended
Multi-Protocol Industrial Bridge / Gateway
Factory gateways built around the 5CGXBC5C7F27C8N translate between PROFINET, EtherCAT, EtherNet/IP, Modbus TCP, and serial fieldbuses. The 6 transceivers host the real-time Ethernet MACs while the LE fabric runs the application-layer stack and cycle-time scheduling. With 5 Mbits of BRAM, the device can buffer entire cycle frames for protocol conversion, and the commercial 0C-85C grade fits control-cabinet environments.
Recommended
Test & Measurement Instrumentation Front End
Bench-top instruments (logic analyzers, protocol analyzers, mixed-signal oscilloscope capture cards) benefit from the 5CGXBC5C7F27C8N's parallel LVDS I/O bandwidth and 364 hardware multipliers for FFT, FIR, and histogram post-processing. Transceivers carry USB 3.0 or 10 GbE uplink to a host PC; the F27 672-FBGA exposes enough pins to support 32+ high-speed probe channels. The commercial temperature range suits lab environments, and Quartus Prime supports integration with MATLAB/Simulink DSP models for rapid algorithm iteration.
Recommended
Recommended Products Summary
Engineering reference data for 5CGXBC5C7F27C8N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CGXBC5C7F27I7N | 5CGXFC5C7F27C8N | 5CGXBC5C7F35C8N | 5CGXBC4C7F27C8N | 5CEFA9F27C7N | 5CGTFD7D5F27I7N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-FBGA (F27, 27x27 mm) | 672-FBGA (F27, 27x27 mm) - same | 672-FBGA (F27, 27x27 mm) - same | 672-FBGA (F35, 35x35 mm) - same pinout, larger body | 672-FBGA (F27, 27x27 mm) - same | 672-FBGA (F27, 27x27 mm) - same | 672-FBGA (F27, 27x27 mm) - same |
| Family | Cyclone V GX | Cyclone V GX | Cyclone V GX (higher tier) | Cyclone V GX | Cyclone V GX (lower density) | Cyclone V E (no transceivers) | Cyclone V GT (faster transceivers) |
| Logic Elements | 77,000 | 77,000 (same) | ~77,000-110,000 depending on speed grade | 77,000 (same) | ~49,000 (-36%) | ~113,000 (+47%) | ~150,000 (+95%) |
| Transceivers | 6 x 3.125 Gbps | 6 x 3.125 Gbps (same) | 12 x 3.125 Gbps (+100%) | 6 x 3.125 Gbps (same) | 4 x 3.125 Gbps (-33%) | 0 (no transceivers) | 8 x 6.144 Gbps (faster, +33% channels, +97% rate) |
| Embedded Memory (bits) | 5,001,216 | 5,001,216 (same) | ~5,000,000-7,000,000 depending on tier | 5,001,216 (same) | ~3,100,000 (-38%) | ~8,200,000 (+64%) | ~7,400,000 (+48%) |
| 18x18 Multipliers | 364 | 364 (same) | ~520 | 364 (same) | ~225 | ~530 | ~720 |
| PCIe Hard IP | Gen1/Gen2 | Gen1/Gen2 (same) | Gen1/Gen2 (same) | Gen1/Gen2 (same) | Gen1/Gen2 (same) | Gen1 only | Gen1/Gen2 (same) |
| Operating Temperature | 0C to +85C (commercial C8) | -40C to +100C (industrial I7) | 0C to +85C (commercial C8) | 0C to +85C (commercial C8) | 0C to +85C (commercial C8) | 0C to +85C (commercial C7) | -40C to +100C (industrial I7) |
Key Differentiators
- Six 3.125 Gbps transceivers in mid-density Cyclone V tier (vs 5CEFA9F27C7N (Cyclone V E))
- Commercial 0C-85C grade at the lowest price point (vs 5CGXBC5C7F27I7N (industrial I7N))
- Smaller 27x27 mm body vs F35 35x35 mm (vs 5CGXBC5C7F35C8N)
Design Notes
The 5CGXBC5C7F27C8N requires at least four supply rails: VCC (1.1 V core), VCCAUX (2.5 V), VCCAUX_GX (2.5 V for transceivers), and VCCINT_GX (1.1 V for transceiver analog). Per the Cyclone V device datasheet, each transceiver channel draws roughly 110 mA from VCC_GX at 3.125 Gbps, so a 6-channel design needs at least 660 mA on the transceiver analog rail — budget 1 A headroom. Use a dedicated LDO (e.g. TI TPS7A4701) for VCC_GX, not a switching converter, to meet the <1% pk-pk ripple requirement for link training.
Estimated: with all six transceivers running at 3.125 Gbps and a typical core utilization of 70%, total power dissipation is around 3.5-4.5 W. The F27 FBGA has a theta_JA of approximately 12 C/W with a 4-layer 2oz copper JEDEC JESD51-7 test board, so junction-to-ambient rise is about 42-54 C. At commercial 85C ambient this leaves ~30 C headroom; at industrial 100C ambient with the I7N variant, airflow or a thermal pad to a chassis is required.
Follow the Cyclone V device family pin connection guidelines document for the F27 672-FBGA land pattern and stack-up. A 1.0 mm pitch BGA requires microvia (laser-drilled) PCB technology; 4-2-4 or 6-2-6 layer stack-up with 1 oz copper on outer layers is recommended. Place 0.1 µF X7R decoupling caps within 100 mil of every VCC/VCCAUX pin and 10 µF bulk caps within 0.5 inch of the package. All transceiver TX/RX pairs must be length-matched within 5 mil and routed on the top layer over a continuous ground plane.
Common pitfalls with the 5CGXBC5C7F27C8N include: (1) forgetting to configure CONFIG_SEL pins for Active Serial vs JTAG-only boot, leaving the board un-bootable; (2) tying unused transceiver TX pins to GND instead of leaving them floating per the pin connection guidelines, which raises quiescent current; (3) using a 3.3 V LVCMOS I/O standard on banks that are 3.0 V VCCIO-only, damaging the I/O cell; and (4) missing MSEL[3:0] settings for the desired configuration scheme. Always cross-check against the Quartus Prime pin planner warnings before tape-out.
Compliance Information
RoHS and REACH compliant per Cyclone V device family product page. Halogen-free per JEDEC JS709B. Not AEC-Q100 qualified; for automotive use consider the Cyclone V GT AEC-Q100 variants or Cyclone IV GX automotive grade.
