5CGXBC7C7F23C8N - Cyclone V GX FPGA, 149.5K LE, 484-FBGA | Intel
MPN: 5CGXBC7C7F23C8N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $49.5 | $49.50 |
| 10 | $44.55 | $445.50 |
| 100 | $39.6 | $3,960.00 |
| 500 | $34.65 | $17,325.00 |
| 1,000 | $29.7 | $29,700.00 |
Drop-in alternatives for 5CGXBC7C7F23C8N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →5CGXBC7C7F23C8N Maximum Ratings & Electrical Characteristics
| Series | Cyclone V GX |
| Family | 5CGXC7 (logic density tier) |
| Logic Elements (LE) | 149,500 |
| Embedded Memory Bits | 7,880,704 bits (~963 Kbytes) |
| Embedded 18x18 Multipliers | 312 |
| Transceivers | 6 channels, up to 3.125 Gbps |
| User I/O Pins | 240 |
| Core Voltage | 1.1 V |
| Process Technology | TSMC 28 nm low-power |
| Package | 484-ball FBGA (F23) |
| Mounting Type | Surface Mount (BGA) |
| Temperature Grade | Commercial (0C to 85C) |
| Speed Grade | 8 (slowest commercial) |
| Hard Memory Controllers | 2 |
| PLLs | Up to 8 |
| Global Clock Networks | Up to 16 |
| RoHS Status | Compliant |
5CGXBC7C7F23C8N 484-ball fbga (f23) Pin Configuration Guide
Complete pinout information for 5CGXBC7C7F23C8N (484-ball fbga (f23) package) with 240 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CGXBC7C7F23C8N.
Refer to the datasheet for full pin configuration.
Estimated pin count: 240 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CGXBC7C7F23C8N is suitable for 6 applications: Industrial Motor Control and Factory Automation, Video Surveillance and Image Processing Pipelines, Wireless Backhaul and Small-Cell Baseband, Broadcast Video Bridging and SDI Routing, Military and Aerospace Digital Signal Processing, Embedded Vision and Machine Learning Inference.
Industrial Motor Control and Factory Automation
The 5CGXBC7C7F23C8N's 149,500 logic elements, 240 user I/Os, and six 3.125 Gbps transceivers make it well-suited to multi-axis industrial motor controllers and EtherCAT/EtherNet/IP slave nodes. Designers implement up to 16 axes of field-oriented control (FOC) using the 312 embedded 18x18 multipliers for Park/Clarke transforms and PWM modulation, while the 7,880,704 bits of block RAM absorb encoder buffers and trajectory lookup tables. The 28nm core delivers up to 40% lower power than Cyclone IV GX equivalents, easing thermal design in sealed control cabinets. Industrial deployments benefit from the integrated transceivers, which eliminate an external PHY on the serial bus and reduce BOM by approximately $5 to $15 per node.
Recommended
Video Surveillance and Image Processing Pipelines
The 5CGXBC7C7F23C8N's 963 Kbytes of embedded RAM (7,880,704 bits) and 312 DSP blocks are well-matched to mid-resolution video pipelines: HD-SDI input deserialization, color-space conversion, motion detection, and H.264 encoding pre-processing. The six transceivers accept SMPTE SDI up to 3 Gbps directly, while the 240 user I/Os interface to image sensors, DDR2/DDR3 memory, and HDMI output bridges. Compared to a Cyclone IV GX design at the same density, this Cyclone V GX device typically achieves 30 to 50 percent higher pixel throughput at lower power, which is decisive in 16-channel NVR deployments.
Recommended
Wireless Backhaul and Small-Cell Baseband
The 5CGXBC7C7F23C8N targets small-cell and wireless-backhaul baseband processing where six 3.125 Gbps transceivers carry CPRI or OBSAI links to the radio unit. The 149,500 LEs implement LTE PHY layer functions including FFT/iFFT, channel estimation, and Turbo decoding, while the 312 18x18 multipliers handle 64-QAM modulation and equalization. The 7.88 Mbit block RAM holds soft-decision buffers and HARQ retransmission state. Power-constrained remote-radio-head designs benefit from the 28nm core, which typically draws 35 to 40 percent less power than Cyclone IV at the same throughput.
Recommended
Broadcast Video Bridging and SDI Routing
The 5CGXBC7C7F23C8N integrates six transceivers that natively accept SDI data rates (270 Mbps, 1.485 Gbps, 2.97 Gbps), making it a strong fit for broadcast routers, format converters, and embedder/de-embedder cards. The 149.5K logic elements handle audio embedding, ANC processing, and genlock, while the 7.88 Mbit block RAM serves as a frame buffer for frame-sync and de-jitter. The 240 user I/Os allow direct interface to HDMI, DisplayPort, and analog video DAC bridges, and the Cyclone V GX architecture reduces per-channel power by roughly 40% versus Cyclone IV GX designs of equivalent channel count.
Recommended
Military and Aerospace Digital Signal Processing
The 5CGXBC7C7F23C8N, with 312 18x18 multipliers and 7,880,704 bits of embedded RAM, accelerates channelized digital signal processing for SIGINT, radar, and EW applications where commercial temperature grades are acceptable (lab, ground-mobile, or shelter-mounted equipment). The six 3.125 Gbps transceivers accept digitized RF output from ADC ASICs, while the 149,500 LEs implement DDC/DUC chains, polyphase filterbanks, and pulse compression. For ruggedized deployments, designers pair this commercial part with vibration-isolated housings; for harsh-environment aerospace, designers migrate to the -I industrial or -A military temperature variants in the same Cyclone V GX family.
Recommended
Embedded Vision and Machine Learning Inference
The 5CGXBC7C7F23C8N is well-matched to embedded vision and CNN inference at the edge where power and cost dominate. The 149,500 LEs implement quantized INT8 convolution engines, the 312 18x18 multipliers accelerate convolutional layers, and the 7.88 Mbit block RAM holds activation tiles. Designers typically achieve 10 to 25 frames per second on MobileNet-class networks at 224x224 input resolution. The six transceivers accept MIPI-CSI-2 input via bridge chips, while 240 user I/Os interface to image sensors, MIPI DSI displays, and DDR3 memory. Compared to a discrete CPU + GPU implementation, this single-chip FPGA approach reduces system power by 30 to 50 percent.
Recommended
Recommended Products Summary
Engineering reference data for 5CGXBC7C7F23C8N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CGXBC7C6F23C7N | 5CGXBC7C6U19C7N | 5CGXBC5C7F27C8N | 5CGXBC7B7M15C8N | XC7A100T-2FGG484I |
|---|---|---|---|---|---|---|
| Package | 484-FBGA (F23) | 484-FBGA (F23) | 484-FBGA (U19) | 484-FBGA (F27) | 484-FBGA (M15) | FBG-484 |
| Brand | Intel | Intel | Intel | Intel | Intel | Xilinx |
| Logic Elements / Cells | 149,500 LE | 149,500 LE | 149,500 LE | 77,000 LE | 149,500 LE | 101,440 LC |
| Embedded Memory (bits) | 7,880,704 | 7,880,704 | 7,880,704 | 4,461,312 | 7,880,704 | 4,976,640 |
| Transceivers | 6 x 3.125 Gbps | 6 x 3.125 Gbps | 6 x 3.125 Gbps | 6 x 3.125 Gbps | 6 x 3.125 Gbps | 4 x 6.6 Gbps |
| Speed Grade | 8 | 7 | 7 | 8 | 8 | -2 |
| User I/O Pins | 240 | 240 | 240 | 240 | 240 | 250 |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.0 V |
| Embedded 18x18 Multipliers | 312 | 312 | 312 | 150 | 312 | 240 DSP48E1 slices |
| 1-Piece Price (USD) | $49.50 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Six integrated 3.125 Gbps transceivers eliminate external PHY (vs XC7A100T-2FGG484I)
- 149,500 LEs at the 5CGXC7 tier with 28nm low-power process (vs 5CGXBC5C7F27C8N)
- Speed grade 8 commercial pricing (vs 5CGXBC7C6F23C7N)
- Dedicated hard memory controllers simplify DDR3 interface design (vs 5CGXBC5C7U19C8N)
Design Notes
The 484-FBGA F23 package uses a 1.0 mm ball pitch and 23x23 mm body, which requires 4 to 6 PCB routing layers with microvia stacks (laser-drilled, 4-mil pad) to fan out all 484 balls. Estimated: the BGA escape routing requires 0.8 mm hole-to-hole clearance and trace widths of 4 mil on the top layer. Use the Intel Cyclone V GX Symbol and Footprint files for the F23 land pattern, and follow IPC-7351 BGA guidelines for solder mask defined (SMD) versus non-solder mask defined (NSMD) pads. NSMD pads are preferred for F23 to improve thermal cycling reliability.
Estimated: at 100 percent LE utilization with all six transceivers active, the 5CGXBC7C7F23C8N dissipates approximately 3 to 5 W. The 484-FBGA package has a theta_JA of approximately 12 to 15 C/W with the recommended PCB land pattern and thermal vias, yielding a 36 to 75 C junction temperature rise above ambient. Use the Quartus Prime Early Power Estimator (EPE) spreadsheet before RTL commit to validate thermal margin; commercial temperature grade (0C to 85C ambient) is the binding constraint in sealed enclosures. Place at least 4 thermal vias under each corner GND ball array for heat extraction.
Three common pitfalls when designing with the 5CGXBC7C7F23C8N: (1) Speed grade 8 is the slowest commercial grade; high-fanout DSP and 250 MHz+ logic paths may not close timing, so request speed grade 7 (5CGXBC7C6F23C7N) if Fmax is binding. (2) The configuration pins (MSEL, nCONFIG, nSTATUS, CONF_DONE) require specific pull-up/pull-down resistors per the Cyclone V GX Device Handbook - failing to populate them leaves the device in an undefined boot state. (3) All six transceiver channels share a PLL structure; leaving channels unused but powered wastes 200 to 400 mW - tie unused TX/RX pins to analog ground per the handbook.
For SDI or 3.125 Gbps serial links, the 5CGXBC7C7F23C8N transceivers require 100-ohm differential routing with length matching to within 5 mils, and the AC-coupling capacitors (typically 100 nF X7R) must sit within 250 mils of the FPGA TX ball pins. The Cyclone V GX Device Handbook pinout file specifies the dedicated transceiver ball assignments - do not swap TX and RX pairs. For PCIe Gen1, the reference clock input requires a 100 MHz HCSL source with a 100-ohm termination to ground at the FPGA clock ball.
Compliance Information
RoHS compliant per Intel product page. AEC-Q100 not applicable - this is a commercial-grade part. Lead-free BGA balls. Halogen-free per Intel Cyclone V GX family datasheet.
