5CGXBC7B6M15C7N - 149.5K LE Cyclone V GX FPGA | Intel
MPN: 5CGXBC7B6M15C7N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268.5 | $2,685.00 |
| 100 | $245 | $24,500.00 |
| 500 | $220.75 | $110,375.00 |
| 1,000 | $198.4 | $198,400.00 |
Drop-in alternatives for 5CGXBC7B6M15C7N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
5CGXBC7B6M15C8N
β Drop-Inπ Reference alternative (not in catalog)
5CGXBC7B6M15I7N
β Drop-Inπ Reference alternative (not in catalog)
5CGXBC7B7M15C7N
β Drop-Inπ Reference alternative (not in catalog)
5CGTFD9A5U19A7N
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$241.5 / Unit
View Datasheet β5CEFA9F23I7N
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$198 / Unit
View Datasheet β5CGXBC7B6M15C7N Maximum Ratings & Electrical Characteristics
| Family | Cyclone V GX |
| Logic Elements (LE) | 149,500 |
| Embedded Memory Bits | 7,880,704 |
| Process Technology | 28 nm |
| Core Voltage (VCCINT) | 1.1 V |
| Maximum User I/O | 240 |
| Transceivers | 12 (3.125 Gbps) |
| Package | 484-pin Micro FBGA (BGA-484) |
| Speed Grade | M15 (medium) |
| Core Voltage Variant | C7 (1.1 V, low power) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| Configuration Memory | SRAM-based (volatile, external configuration required) |
5CGXBC7B6M15C7N 484-pin micro fbga (bga-484) Pin Configuration Guide
Complete pinout information for 5CGXBC7B6M15C7N (484-pin micro fbga (bga-484) package) with 48 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CGXBC7B6M15C7N.
Refer to the datasheet for full pin configuration.
Estimated pin count: 48 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CGXBC7B6M15C7N is suitable for 6 applications: Industrial Motor Control, Broadcast Video Processing, Wireless Baseband Pre-Processing, PCIe Gen2 Endpoint Bridging, Test & Measurement Instrumentation, Aerospace Avionics Bridging.
Industrial Motor Control
The 5CGXBC7B6M15C7N fits industrial multi-axis motor control drives where encoder feedback, current-sense sampling, and EtherCAT/CAN-FD comms must converge on one chip. With 149,500 LE the device implements complete FOC (field-oriented control) state machines for 4-6 axes plus safety logic, while the twelve 3.125 Gbps transceivers drive the EtherCAT PHY and a high-speed encoder interface. The 1.1V VCCINT core keeps dynamic power low enough for fan-less cabinet installations. Quartus Prime IP blocks for EtherCAT slave controllers and PWM generation reduce time-to-prototype.
Recommended
Broadcast Video Processing
The 5CGXBC7B6M15C7N is well suited to broadcast video routing and processing cards that ingest SDI, HDMI, or DisplayPort streams and apply real-time colour-space conversion or scaling. Its 7,880,704 embedded memory bits buffer line/frame stores for 3G-SDI pipelines, while 240 user I/O accommodate parallel video buses and control GPIO. The integrated transceivers carry 12G-SDI over coax using external cable equalizers. Compared with discrete DSP+ASIC solutions, the 5CGXBC7B6M15C7N collapses the bill of materials and allows field firmware upgrades when broadcast standards evolve.
Recommended
Wireless Baseband Pre-Processing
The 5CGXBC7B6M15C7N is a strong fit for small-cell wireless baseband pre-processing, performing CPRI fronthaul aggregation, FFT/iFFT channelization, and digital pre-distortion before handing off to a host ASIC. The twelve 3.125 Gbps transceivers aggregate up to 12 CPRI links without external SerDes, while the 149,500 LE deliver the DSP throughput needed for 20 MHz LTE channelization. Compared with a pure DSP chip, the FPGA offers reconfigurability for evolving 5G NR waveforms via software upgrade.
Recommended
PCIe Gen2 Endpoint Bridging
For protocol-conversion line cards that bridge PCIe Gen2 endpoints to legacy parallel buses or custom backplanes, the 5CGXBC7B6M15C7N integrates the PCIe hard IP block plus ample fabric for state machines and FIFOs. The device supports up to x4 Gen2 (2.5 GT/s) lanes natively, allowing drop-in deployment as a PCIe endpoint without an external PHY. The C7 core-voltage variant minimizes power in always-on server backplane slots.
Recommended
Test & Measurement Instrumentation
The 5CGXBC7B6M15C7N fits mid-range bench instruments such as protocol analysers, mixed-signal oscilloscope capture cards, and ATE pin electronics where flexible real-time signal processing is required. The 240 user I/O sample high-speed parallel buses; embedded M10K memory blocks implement deep capture FIFOs; the transceiver channels interface to high-speed serial triggers. Compared with a fixed-function ASIC instrument chip, the FPGA lets one board serve multiple instrument personalities through firmware reload.
Recommended
Aerospace Avionics Bridging
The 5CGXBC7B6M15C7N is suitable for avionics protocol bridges (ARINC 429, MIL-STD-1553, ARINC 664/AFDX) where deterministic latency and DO-254 design assurance are required. The Cyclone V family supports the -I industrial temperature grade and is supported by Intel's DO-254 compliance documentation, easing certification. The integrated transceivers implement AFDX links natively, while the FPGA fabric runs protocol stacks and traffic-shaping state machines. The 484-ball Micro FBGA package is compatible with avionics-grade PCB stack-ups using microvia technology.
Recommended
Recommended Products Summary
Engineering reference data for 5CGXBC7B6M15C7N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CGXBC7B6M15C8N | 5CGXBC7B6M15I7N | 5CGXBC7B7M15C7N | 5CGTFD9A5U19A7N | 5CEFA9F23I7N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | BGA-484 (Micro FBGA, 1.0 mm pitch) | BGA-484 - same | BGA-484 - same | BGA-484 - same | UBGA-484 (Cyclone V GT - same ball footprint) | FBGA-484 - same |
| Logic Elements | 149,500 | 149,500 | 149,500 | 149,500 | 301,000 | 301,000 |
| Embedded Memory Bits | 7,880,704 | 7,880,704 | 7,880,704 | 7,880,704 | 13,917,696 | 17,133,568 |
| Transceivers | 12 x 3.125 Gbps (GX) | 12 x 3.125 Gbps | 12 x 3.125 Gbps | 12 x 6.144 Gbps (GX) | 9 x 5 Gbps (GT) | 0 (no transceivers) |
| Maximum User I/O | 240 | 240 | 240 | 240 | 224 | 224 |
| Core Voltage (VCCINT) | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| Temperature Grade | Commercial (0C to +85C) | Commercial | Industrial (-40C to +100C) | Commercial | Industrial | Industrial |
Key Differentiators
- Higher logic capacity at same 484-BGA footprint vs Cyclone V E (vs 5CEFA9F23I7N)
- Lower-cost transceiver vs Cyclone V GT (vs 5CGTFD9A5U19A7N)
- Industrial temperature upgrade path (vs 5CGXBC7B6M15I7N)
- Higher transceiver rate variant in same package (vs 5CGXBC7B7M15C7N)
Design Notes
Estimated: at typical utilization (60% LE, 50% memory, 8 active transceivers at 3.125 Gbps) the 5CGXBC7B6M15C7N consumes approximately 3.5-4.5 W. Designers should provision a 5W VRM budget for VCCINT and an additional 2-3W for VCCIO banks. The Cyclone V PowerPlay Early Power Estimator (EPE) spreadsheet is mandatory before committing the PCB stack-up, and Intel's pin connection guidelines mandate at least 30-40 low-ESR ceramic decoupling capacitors distributed around the package perimeter.
The 484-ball Micro FBGA uses 1.0 mm ball pitch and requires a high-density PCB stack-up with microvia (laser-drilled) interconnects for the inner signal layers. Per Intel's Cyclone V hardware design guidelines, use a minimum 6-layer stack-up with dedicated ground and power planes; signal layers should be routed 50 ohm controlled impedance. Matched-length tuning is required for all 12 transceiver channels, with intra-pair skew under 5 mil and channel-to-channel skew under 150 mil.
Cyclone V devices require power-up sequencing of VCCINT (1.1V), then VCCAUX (2.5V), then VCCIO (per bank). Reverse sequence or simultaneous ramp-up can latch-up the device or trigger inrush current that exceeds the VRM rating. Use a dedicated sequencer or MAX II/MAX 10 CPLD to enforce the order. Also: do not connect any I/O bank to a voltage outside its VCCIO range - the device will be damaged. JTAG chain configuration should include the TDO pull-up recommended in the family datasheet to avoid floating-TDO debug session errors.
Transceiver channels share PCB real estate with the FPGA fabric. Per Intel reference designs, place AC-coupling capacitors within 100 mil of the FPGA transmitter balls, and keep transmit-receive differential pairs separated by at least 3W (3x trace-to-trace spacing) to minimize crosstalk. Ground-fill stitching vias should be placed every lambda/10 along all high-speed serial traces. Reference clocks to the transceiver PLLs require ultra-low jitter (<100 fs RMS) - use a dedicated clock synthesizer like the Intel CDCM61004.
Compliance Information
RoHS and REACH compliant per Intel product ordering information page. Not AEC-Q100 qualified (FPGAs are not automotive-grade unless explicitly ordered as such). Halogen-free per Intel material declaration.
