5CGXBC7C7U19C8N - Cyclone V GX FPGA, 149.5K LE | Intel
MPN: 5CGXBC7C7U19C8N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $105.79 | $105.79 |
| 10 | $98.5 | $985.00 |
| 25 | $92.1 | $2,302.50 |
| 100 | $84.3 | $8,430.00 |
| 500 | $76.8 | $38,400.00 |
Drop-in alternatives for 5CGXBC7C7U19C8N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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5CGXBC7C7U19I7N
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5CGXBC7C6U19C7N
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View Datasheet →5CGXBC7C7U19C8N
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$76.8 / Unit
View Datasheet →5CGXBC5C7U19C8N
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$112 / Unit
View Datasheet →5CGXBC7C7U19C8N Maximum Ratings & Electrical Characteristics
| Family | Cyclone V GX |
| Logic Elements (LE) | 149,500 |
| Embedded Memory (Bits) | 7,880,704 |
| Number of I/Os | 240 |
| Package | 484-FBGA (UBGA, U19) |
| Supply Voltage (Core) | 1.1 V (typ) |
| Transceivers | 9 channels |
| Transceiver Data Rate | Up to 3.125 Gbps |
| PCIe Hard IP | 2 blocks (Gen1/Gen2) |
| PLLs | 6 (general-purpose) |
| Embedded Multipliers | 156 (18x18) |
| M10K Memory Blocks | 446 |
| Operating Temperature | 0C to +85C (Commercial) |
| Mounting Type | Surface Mount (BGA) |
| MSL Level | 3 (168 hours) |
| RoHS Status | Compliant |
| Configuration Scheme | SRAM-based, supports bitstream compression |
5CGXBC7C7U19C8N 484-fbga (ubga, u19) Pin Configuration Guide
Complete pinout information for 5CGXBC7C7U19C8N (484-fbga (ubga, u19) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CGXBC7C7U19C8N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CGXBC7C7U19C8N is suitable for 6 applications: Industrial Motor Control, Video Surveillance and Broadcast Bridging, PCIe Endpoint Cards, Wireless Backhaul and Small-Cell Baseband, Factory Automation and Industrial Networking, Test and Measurement Instrumentation.
Industrial Motor Control
The 5CGXBC7C7U19C8N is well suited for multi-axis industrial motor control drives because it combines 156 embedded 18x18 multipliers and 9 transceivers up to 3.125 Gbps in the U19 484-pin BGA package. The 149,500 LEs can absorb the field-oriented control (FOC) loops, PWM generation, encoder feedback, and EtherCAT/MII slave interface without external coprocessors. The C8 speed grade supports 100 MHz control loops with deterministic latency, and the device's low static power (typically below 1.5 W) simplifies thermal design in DIN-rail mounted drives.
Recommended
Video Surveillance and Broadcast Bridging
For video surveillance encoders, the 5CGXBC7C7U19C8N provides the fabric needed to bridge MIPI-CSI, LVDS camera inputs, and PCIe Gen2 to a host SoC, while its 7.88 Mbit of embedded memory buffers frame-rate conversions. The 9 transceivers handle multiple Gigabit Ethernet streams for IP camera aggregation or SDI-over-IP bridging. The U19 package's 240 user I/Os are sufficient to land 4x MIPI CSI-2 lanes plus control plane GPIO, replacing a discrete PHY plus microcontroller solution.
Recommended
PCIe Endpoint Cards
The 5CGXBC7C7U19C8N integrates two hardened PCIe Gen1/Gen2 IP blocks, allowing direct root-complex or endpoint connectivity without an external bridge. The 9 transceivers and 6 PLLs support PCIe x1 or x2 plus auxiliary SGMII or SATA links on the same chip. The 149,500 LEs accommodate custom DMA engines and protocol logic in NIC, instrumentation, or low-cost accelerator cards.
Recommended
Wireless Backhaul and Small-Cell Baseband
The 5CGXBC7C7U19C8N's 3.125 Gbps transceivers support CPRI up to 3.072 Gbps, making the part a viable baseband processing device for small-cell and low-density macro base stations. The 156 DSP-friendly 18x18 multipliers handle uplink/downlink channelization and pre-coding for LTE small cells, while the embedded memory buffers HARQ processes. The U19 package's ball pitch simplifies 8-layer PCB stack-up for cost-sensitive small-cell form factors.
Recommended
Factory Automation and Industrial Networking
The 5CGXBC7C7U19C8N delivers the I/O count, transceiver count, and logic density needed to consolidate EtherCAT master, Profinet IRT, and EtherNet/IP adapter stacks on a single device. The 240 user I/Os in the U19 BGA handle multiple isolated RS-485 ports, digital I/O modules, and encoder interfaces. Hardened PCIe blocks enable modular PLC backplane designs, while bitstream compression accelerates firmware update cycles in the field.
Recommended
Test and Measurement Instrumentation
The 5CGXBC7C7U19C8N provides the logic and DSP density required for mid-range oscilloscope, signal analyzer, and protocol tester front ends. The 156 18x18 multipliers implement FIR decimation filters, FFT engines, and modulation analyzers; the 7.88 Mbit embedded memory stores sample buffers. The 9 transceivers drive LVDS or SGMII ADC/DAC interfaces such as AD9680BCPZ-500 or ADAR1000ACCZN, while the hardened PCIe Gen2 block streams captured waveforms to the host at sustained rates above 1.5 GB/s.
Recommended
Recommended Products Summary
Engineering reference data for 5CGXBC7C7U19C8N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CGXBC7C7U19I7N | 5CGXBC7C6U19C7N | 5CGXBC5C7U19C8N | 5CGXBC7B7M15C8N |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 484-FBGA (U19) | 484-FBGA (U19) - same footprint | 484-FBGA (U19) - same footprint | 484-FBGA (U19) - same footprint | 484-BGA (M15) - different ball map |
| Logic Elements | 149,500 | 149,500 | 149,500 | 77,760 (approx) | 149,500 |
| Embedded Memory (bits) | 7,880,704 | 7,880,704 | 7,880,704 | 4,462,848 | 7,880,704 |
| Transceivers | 9 channels / 3.125 Gbps | 9 channels / 3.125 Gbps | 9 channels / 3.125 Gbps | 9 channels / 3.125 Gbps | 9 channels / 3.125 Gbps |
| Operating Temperature | 0C to +85C (Commercial) | -40C to +100C (Industrial) | 0C to +85C | 0C to +85C | 0C to +85C |
| Speed Grade | C8 | I7 | C6 (slower) | C8 | C8 |
| PCIe Hard IP | 2 blocks (Gen1/Gen2) | 2 blocks | 2 blocks | 2 blocks | 2 blocks |
| Unit Price (qty 1) | $105.79 | $118-$140 (industrial) | $98-$110 | $78-$95 | $115-$130 |
Key Differentiators
- Highest logic density in the 484-ball U19 footprint (vs 5CGXBC5C7U19C8N)
- Commercial vs industrial temperature grade (vs 5CGXBC7C7U19I7N)
- Speed-grade flexibility in identical footprint (vs 5CGXBC7C6U19C7N)
Design Notes
Estimated: at 1.1 V core supply and full utilization, VCCINT current may reach 1.5 A; place 22 uF + 100 nF bulk decoupling within 100 mils of each VCCINT ball group, with VCCPD (2.5/3.3 V) and VCCA (2.5 V) decoupled separately. Use a 6-layer PCB with one dedicated ground plane to minimize power-supply-induced jitter on the 3.125 Gbps transceivers. Cyclone V GX has separate PLL analog supplies (VCCA_PLL) that must be filtered with ferrite beads.
The 484-ball UBGA package has a theta_JA of approximately 12 C/W with a 1 oz copper inner ground plane and no airflow; at full fabric utilization the die may dissipate 1.5 to 2.0 W. For continuous commercial-temperature operation (0C to +85C), provide at least 10 CFM of forced airflow or a small clip-on heatsink. The industrial-grade I7N variant relaxes this requirement because the maximum ambient extends only to 100C, but thermal design must still respect the 100C junction limit.
Use the standard Intel Cyclone V GX U19 land pattern (19 mm body, 1.0 mm ball pitch) with 0.5 mm-diameter NSMD pads and microvia-in-pad for the inner rows to break out the 484 balls on a 6-layer stack-up. Match all transceiver differential pairs to 100 ohm +/- 10 percent impedance and keep intra-pair skew below 1 ps for 3.125 Gbps operation. Reference the Cyclone V GX device handbook pin-out files for exact ball assignments and bank VREF pinouts.
Do not confuse the U19 (484-ball) and M15 (484-ball) Cyclone V GX packages - they share ball count but differ in ball map, body size, and I/O count. The M15 variant uses a smaller body and exposes fewer transceivers. Mixing U19 and M15 land patterns will cause a PCB rework. Also note that LVDS channels require an external 100-ohm near-end termination; the device provides on-chip termination only for some I/O standards.
Compliance Information
RoHS and REACH compliance per Intel/Altera product page for Cyclone V GX family. Not AEC-Q100 qualified - FPGAs in this family target industrial and commercial markets, not automotive. Lead-free BGA balls confirmed per Intel datasheet.
