CSD17484F4 - 30V N-Ch FemtoFET MOSFET 3A | Texas Instruments
MPN: CSD17484F4 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $0.62 | $0.62 |
| 10 | $0.47 | $4.70 |
| 100 | $0.34 | $34.00 |
| 500 | $0.28 | $140.00 |
| 1,000 | $0.22 | $220.00 |
Drop-in alternatives for CSD17484F4 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
CSD17483F4
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
CSD17484F4 Maximum Ratings & Electrical Characteristics
| VDS Drain-to-Source Voltage | 30 V |
| ID Continuous Drain Current | 3 A (Ta) |
| RDS(on) Max | 128 mOhm |
| RDS(on) Typ | 99 mOhm |
| Power Dissipation | 500 mW (Ta) |
| Polarity | N-Channel |
| Technology | NexFET / FemtoFET |
| Gate ESD Protection | Yes |
| Package | 3-PICOSTAR LGA (1.0 mm x 0.6 mm) |
| Mounting Type | Surface Mount |
| Configuration | Single FET |
| Footprint Reduction | >= 60% vs standard small-signal MOSFETs |
| Drive Compatibility | Low VGS(th), logic-level drive |
CSD17484F4 Pin Configuration
| Pin 1 | G — Gate terminal - logic-level drive input with integrated ESD protection |
| Pin 2 | S — Source terminal - reference for gate drive and current return |
| Pin 3 | D — Drain terminal - main current path, also primary thermal path via PCB copper |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this component. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
CSD17484F4 is suitable for 6 applications: Smartphone Load Switching, Portable Battery-Powered Devices, Wearable Electronics, Compact Industrial Sensor Nodes, Camera Flash and Haptics Drivers, Board-Level DC Power Distribution.
Smartphone Load Switching
The CSD17484F4 fits smartphone power rails where every square millimeter of PCB counts. Its 1.0 x 0.6 mm PICOSTAR footprint is at least 60% smaller than standard small-signal MOSFETs, while the 99 mOhm typical RDS(on) keeps conduction loss low at sub-amp load currents. Placed as a low-side switch between the PMIC and system load, the low gate threshold voltage permits direct drive from 1.8V-2.5V logic rails, and integrated gate ESD protection survives automated assembly handling.
Recommended
Portable Battery-Powered Devices
In battery-powered tablets, power banks, and handheld instruments, the CSD17484F4 serves as a battery disconnect or load switch on single-cell and multi-cell stacks within its 30V rating. The low on-resistance of 99 mOhm typical minimizes voltage drop and wasted energy at moderate loads, extending runtime, while low gate charge keeps switching losses small even when driven by power management ICs with limited gate-drive current, making it efficient for infrequent and periodic switching duties.
Recommended
Wearable Electronics
Smartwatches, fitness bands, and hearables demand the smallest viable power switches. The CSD17484F4 PICOSTAR LGA occupies roughly 0.6 square millimeters, enabling dense flexible and rigid PCB layouts where component height and area dominate. Its NexFET process balances RDS(on) and gate charge so wearables can switch sensor rails and haptics supplies efficiently, and the 3A continuous rating provides ample headroom above typical wearable load currents of tens to hundreds of milliamps.
Recommended
Compact Industrial Sensor Nodes
Low-side switching in industrial sensor nodes and IIoT modules benefits from the CSD17484F4's combination of 30V tolerance and minimal footprint on dense mixed-signal boards. The 128 mOhm maximum RDS(on) ensures predictable conduction loss across process corners, and gate ESD protection improves yields on automated SMT lines handling tiny LGA packages. Nodes switching 12V or 24V sensor supplies within the 30V limit can use this FET with logic-level drive from an MCU GPIO through a small gate resistor.
Recommended
Camera Flash and Haptics Drivers
Mobile camera flash capacitors and haptic actuators need small, fast, robust switches. The CSD17484F4's low total gate charge permits rapid turn-on and turn-off with limited drive current, important for timing-critical flash charge/discharge paths within its 30V rating. Its 3A capability handles pulsed currents with the 500 mW dissipation limit respected, and the 60% footprint saving versus SOT-23 alternatives frees board area near the camera module where space is scarcest.
Recommended
Board-Level DC Power Distribution
On dense daughter cards and modules, the CSD17484F4 acts as a low-side switch or inrush-control element on 3.3V-12V distribution rails. Working with hot-swap or eFuse controllers, its 30V VDS rating provides margin on 12V rails, and 99 mOhm typical RDS(on) keeps drop below 10 mV per ampere. The PICOSTAR layout demands attention: TI datasheet SLPS550 land-pattern guidance and generous copper pours ensure both solderability and thermal performance at sustained load.
Recommended
Recommended Products Summary
Engineering reference data for CSD17484F4 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | CSD17483F4 | CSD22206W | CSD17303Q5 |
|---|---|---|---|---|
| Package | 3-PICOSTAR LGA (1.0 x 0.6 mm) | 3-PICOSTAR LGA - same | SOT-23 (W) - different | SON 2x2 - different |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| VDS | 30 V | 30 V | [DATA_NEEDED] | 30 V |
| RDS(on) | 99 mOhm typ / 128 mOhm max | [DATA_NEEDED] | [DATA_NEEDED] | lower (larger die) |
| Continuous Current | 3 A (Ta) | 3 A (Ta) | [DATA_NEEDED] | [DATA_NEEDED] |
| Gate ESD Protection | Yes | Yes | [DATA_NEEDED] | [DATA_NEEDED] |
| Footprint Area | 0.6 mm2 | 0.6 mm2 | ~5.6 mm2 (SOT-23) | 4 mm2 (SON 2x2) |
| Power Dissipation | 500 mW (Ta) | 500 mW (Ta) | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Smallest footprint in its voltage class (vs CSD22206W)
- Integrated gate ESD protection (vs CSD17483F4)
- 30V rating in a 1x0.6 mm package (vs CSD17303Q5)
Design Notes
The PICOSTAR package is rated 500 mW at 25C ambient, but its tiny thermal mass means PCB copper is the only heatsink. Maximize drain and source copper pours on the top layer and add stitching vias to inner/ground planes where the net permits. At 1A continuous, conduction loss is roughly I2 x R = 0.13W, which is safe; at 3A it approaches 1.15W and exceeds the rating - derate duty cycle or use a larger FemtoFET/NexFET.
Follow TI datasheet SLPS550 land-pattern and stencil recommendations exactly. The three LGA bumps on a 1.0 x 0.6 mm body require a fine stencil (thin foil, reduced apertures) to deposit a controlled paste volume: too little paste causes open joints, too much causes bridging between bumps. Confirm the stencil aperture area ratio with your fabricator before production.
Gate drive must respect the absolute maximum VGS rating in datasheet SLPS550 - although the part has gate ESD protection, this does not replace a series gate resistor or zener clamp when driven from noisy or inductive sources. Also, do not assume SOT-23 thermal behavior: the LGA has no exposed pad and relies entirely on bump-to-copper heat transfer, so reflow profile per TI guidance is mandatory.
Compliance Information
Compliance status not present in the provided verified web data. TI standard product is typically RoHS-compliant; confirm on the TI.com quality page for CSD17484F4.
