EP1AGX35DF780I7N - Arria GX FPGA, 33K LEs, 780 FBGA | Altera
MPN: EP1AGX35DF780I7N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $215 | $215.00 |
| 10 | $195.5 | $1,955.00 |
| 100 | $175.25 | $17,525.00 |
| 500 | $158 | $79,000.00 |
| 1,000 | $142.75 | $142,750.00 |
Drop-in alternatives for EP1AGX35DF780I7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →EP1AGX35DF780I7N Maximum Ratings & Electrical Characteristics
| Family | Arria GX (EP1AGX35) |
| Logic Elements (LEs) | 33,100 (approx.) |
| Embedded Memory | 1,303 Kbit (M9K blocks) |
| Embedded Multipliers | Yes, 18x18 multipliers |
| PLLs | 4 |
| Global Clock Networks | 16 |
| Transceivers | Up to 8 channels, 3.125 Gbps |
| Hard IP | PCI Express (x1/x4), 8B/10B encoder/decoder, comma detection |
| Memory Interfaces | DDR/DDR2 SDRAM with dedicated DQS |
| Core Voltage | 1.2 V (nominal) |
| Speed Grade | -7 (fastest) |
| Operating Junction Temperature | -40C to +100C (industrial I-temp) |
| Package | 780-pin FineLine BGA (DF780) |
| Configuration | JTAG, Passive Serial, Active Serial (EPCS), AES bitstream encryption |
| Hot Socketing | Supported |
| Process Technology | 90 nm TSMC CMOS |
| RoHS Status | Compliant |
EP1AGX35DF780I7N 780-pin fineline bga (df780) Pin Configuration Guide
Complete pinout information for EP1AGX35DF780I7N (780-pin fineline bga (df780) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1AGX35DF780I7N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1AGX35DF780I7N is suitable for 6 applications: PCI Express Endpoint Cards, Serial RapidIO Bridge for DSP Clustering, Telecom Backhaul Line Cards, Industrial Camera Link Aggregation, Test and Measurement ASIC Prototyping, Broadcast Video Processing.
PCI Express Endpoint Cards
The EP1AGX35DF780I7N integrates a hard PCI Express Gen1 endpoint IP block plus 3.125 Gbps transceivers, making it ideal for low-cost PCIe add-in cards. With approximately 33,100 LEs and 1,303 Kbit of embedded memory, designers can implement protocol engines, DMA controllers, and small CPU subsystems in fabric while offloading the physical layer and data-link layer to hardened silicon. The industrial -40C to +100C junction range supports edge-server and industrial-PCIe deployments where ambient temperatures exceed commercial ranges. The -7 speed grade provides the timing margin needed for x4 Gen1 link operation, reducing pressure on Quartus II timing closure. Compare against discrete PHY plus small FPGA solutions - this part eliminates the external PCIe PHY.
Recommended
Serial RapidIO Bridge for DSP Clustering
The EP1AGX35DF780I7N's 8 channels of 3.125 Gbps transceivers natively support Serial RapidIO physical-layer signaling commonly used in DSP clusters such as TI C6000 and Analog Devices SHARC arrays. The integrated 8B/10B encoder/decoder and comma-detection in each transceiver channel eliminate the need for an external SerDes PHY, while the 33,100 LEs and 18x18 multipliers in fabric can host additional DSP datapaths, packet schedulers, and sRIO switch logic. The industrial I-temp grade makes the part deployable in ruggedized DSP compute nodes for defense and aerospace signal-processing systems.
Recommended
Telecom Backhaul Line Cards
The EP1AGX35DF780I7N's combination of 3.125 Gbps transceivers, SGMII/SPI-4.2 interface support, and DDR2 SDRAM controller hard logic makes it well-suited to telecom backhaul line cards aggregating E1/T1, Ethernet, and ATM traffic. The 4 PLLs and 16 global clock networks provide the multi-clock-domain synthesis required by TDM and packet flows running concurrently. Designers can implement HDLC framing, Ethernet MACs, and traffic-shaping logic in fabric while relying on hardened transceivers for the line side. Industrial temperature operation supports outdoor cabinet and central-office deployments.
Recommended
Industrial Camera Link Aggregation
Camera Link base/medium/full configurations run at up to 6.4 Gbps over multiple LVDS pairs - the EP1AGX35DF780I7N's 8 transceivers can absorb Camera Link full plus Ethernet aggregation plus GPIO expansion within a single chip. The 1,303 Kbit of embedded M9K memory holds line buffers for image preprocessing, and 18x18 multipliers support real-time color-space conversion and Bayer demosaicing. The industrial -40C to +100C junction range supports machine-vision deployments in factory automation cells where ambient temperatures can exceed 70C.
Recommended
Test and Measurement ASIC Prototyping
ASIC prototyping demands high logic density, fast Fmax, and abundant I/O - the EP1AGX35DF780I7N delivers 33,100 LEs, the -7 fastest speed grade, and 780 balls of mixed GPIO/SerDes in the DF780 FineLine BGA. Engineers can partition prototype logic into the fabric, validate transceivers at up to 3.125 Gbps against real backplanes, and use Quartus II's incremental compile to iterate on individual blocks. The hard PCI Express block allows direct connection to a host workstation for high-speed stimulus capture, and AES bitstream encryption protects IP during shared lab use.
Recommended
Broadcast Video Processing
The EP1AGX35DF780I7N's combination of high-speed transceivers (SDI ingest/output up to 3 Gbps via SMPTE 424M), abundant memory bandwidth for line-store buffers, and dedicated DDR2 controllers makes it a strong fit for broadcast video format converters, multiviewers, and production switchers. The 18x18 embedded multipliers enable scaling and color-space conversion at full broadcast rates, while the 4 PLLs synthesize the multiple clock domains needed for SDI, audio, and reference timing. Industrial temperature grade supports OB-truck and flyaway-pack deployments.
Recommended
Recommended Products Summary
Engineering reference data for EP1AGX35DF780I7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1AGX35DF780I7 | EP1AGX35DF780I6N | EP1AGX35DF780I6 | EP1AGX35DF780I5N | EP1AGX35DF780I5 | EP1AGX35DF780C6N |
|---|---|---|---|---|---|---|---|
| Package | 780-pin FineLine BGA (DF780) | 780-pin FineLine BGA (DF780) - same | 780-pin FineLine BGA (DF780) - same | 780-pin FineLine BGA (DF780) - same | 780-pin FineLine BGA (DF780) - same | 780-pin FineLine BGA (DF780) - same | 780-pin FineLine BGA (DF780) - same |
| Brand | Altera (now Intel FPGA) | Altera - same | Altera - same | Altera - same | Altera - same | Altera - same | Altera - same |
| Speed Grade | -7 (fastest) | -7 (same) | -6 (slower) | -6 (slower) | -5 (slowest) | -5 (slowest) | -6 (slower) |
| Temperature Grade | Industrial -40C to +100C | Industrial (same) | Industrial (same) | Industrial (same) | Industrial (same) | Industrial (same) | Commercial 0C to +85C |
| Logic Elements | ~33,100 | ~33,100 (same) | ~33,100 (same) | ~33,100 (same) | ~33,100 (same) | ~33,100 (same) | ~33,100 (same) |
| Embedded Memory | 1,303 Kbit | 1,303 Kbit (same) | 1,303 Kbit (same) | 1,303 Kbit (same) | 1,303 Kbit (same) | 1,303 Kbit (same) | 1,303 Kbit (same) |
| Transceivers | Up to 8 channels, 3.125 Gbps | 8 ch / 3.125 Gbps (same) | 8 ch / 3.125 Gbps (same) | 8 ch / 3.125 Gbps (same) | 8 ch / 3.125 Gbps (same) | 8 ch / 3.125 Gbps (same) | 8 ch / 3.125 Gbps (same) |
| PCI Express Hard IP | Yes (x1/x4) | Yes (same) | Yes (same) | Yes (same) | Yes (same) | Yes (same) | Yes (same) |
| Pricing Tier (qty 1, USD, 2026-09-06) | $215 | $215 (same) | ~$190 (-12%) | ~$190 (-12%) | ~$165 (-23%) | ~$165 (-23%) | ~$185 (-14%) |
Key Differentiators
- Fastest speed grade in the EP1AGX35 family (vs EP1AGX35DF780I6N)
- Industrial temperature range -40C to +100C (vs EP1AGX35DF780C6N)
- Hardened PCI Express IP block (vs FPGA families without hard PCIe)
Design Notes
The 780-pin FineLine BGA (DF780) package requires 1.0 mm pitch ball land pads with NSMD (non-solder-mask-defined) geometry on the PCB. Use a 4-6 layer stackup with continuous ground reference planes under the transceiver rows to maintain 100-ohm differential impedance on the 3.125 Gbps channels. Place AC-coupling capacitors within 200 mil of the corresponding transmitter pins and route transceiver traces with matched length-to-skew tolerance per the Arria GX handbook.
The EP1AGX35 core runs at 1.2V nominal, requiring a dedicated LDO regulator with output voltage accuracy better than +/-3% and load-step transient response under 50 us. Estimated: at 80% logic utilization and full transceiver activity, expect 4-6W core power plus 1.5-2W from the transceiver channels. Use the Quartus II PowerPlay early power estimator before layout to size decoupling - typically 22 uF bulk + 100 nF per VCC/GND pair plus 10 uF per transceiver power rail.
Common pitfalls include: (1) forgetting that the -N suffix in EP1AGX35DF780I7N indicates lead-free/RoHS-compliant packaging finish - not a separate speed grade; (2) trying to use Cyclone-II/V pin-compatible bitstreams which are not pin-compatible with Arria GX; (3) overlooking the JTAG TCK frequency limit when configuring via EPCS serial flash; (4) hot-socketing requires strict power-sequencing per the handbook, otherwise I/O cells can back-power through the JTAG pins. Always revalidate timing in Quartus II when swapping speed grades.
Compliance Information
RoHS compliance per Altera/Intel PCN documentation for the -N suffix variants. Not AEC-Q100 qualified - FPGAs in this family are not automotive-grade unless explicitly noted. Halogen-free status not stated in available data.
