EP1AGX35DF780I7 - Arria GX FPGA, 35K LE, 780-pin FBGA | Intel (Altera)
MPN: EP1AGX35DF780I7 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $256.5 | $2,565.00 |
| 100 | $228 | $22,800.00 |
| 500 | $199.5 | $99,750.00 |
| 1,000 | $175 | $175,000.00 |
Drop-in alternatives for EP1AGX35DF780I7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1AGX35DF780I6N
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$171 / Unit
View Datasheet →EP1AGX35DF780I6
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$175 / Unit
View Datasheet →EP1AGX35DF780I5N
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$225 / Unit
View Datasheet →EP1AGX35DF780I5
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$118.4 / Unit
View Datasheet →EP1AGX35DF780C6N
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$199.5 / Unit
View Datasheet →EP1AGX35CF780I6N
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View Datasheet →EP1AGX35DF780I7 Maximum Ratings & Electrical Characteristics
| Series | Arria GX |
| Logic Elements | 35,000 |
| Number of Transceivers | 4 |
| Maximum Transceiver Data Rate | 3.125 Gbps |
| Package | 780-pin FBGA (FineLine BGA) |
| Mounting Type | Surface Mount |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Core Voltage | 1.2 V |
| Speed Grade | 7 (faster) |
| RoHS Status | Compliant (per Alldatasheet listing) |
| Family | Arria GX |
| Device Type | FPGA with integrated transceivers |
| Programmable Logic Type | SRAM-based FPGA |
| Memory Type | Distributed RAM + Block RAM |
| DSP Blocks | Yes (dedicated multiply-accumulate) |
| Configuration Method | JTAG / Passive Serial / Active Serial |
| Lead-Free Status | Yes (per Alldatasheet) |
EP1AGX35DF780I7 Pin Configuration
| Pin A1 | GND — Ground reference |
| Pin A2 | VCC — Core supply 1.2V |
| Pin B1 | I/O_BANK_1 — User I/O bank 1 |
| Pin B2 | I/O_BANK_2 — User I/O bank 2 |
| Pin C1 | DIFFIO_TX — Differential transmit pair |
| Pin C2 | DIFFIO_RX — Differential receive pair |
| Pin D1 | REFCLK — Transceiver reference clock input |
| Pin D2 | TCK — JTAG test clock |
| Pin E1 | TDI — JTAG test data in |
| Pin E2 | TDO — JTAG test data out |
| Pin F1 | TMS — JTAG test mode select |
| Pin F2 | CONFIG_DONE — Configuration complete output |
| Pin G1 | nCONFIG — Configuration control input |
| Pin G2 | DCLK — Configuration clock |
| Pin H1 | DATA0 — Configuration data input |
| Pin H2 | MSEL0 — Configuration mode select 0 |
| Pin J1 | MSEL1 — Configuration mode select 1 |
| Pin J2 | nSTATUS — Configuration status output |
| Pin K1 | VCCA — Transceiver analog supply |
| Pin K2 | VCCP — PCI clamp supply |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1AGX35DF780I7 is suitable for 6 applications: Telecommunications Backplane Design, High-Speed Serial Protocol Bridging, Video Broadcast Equipment, Industrial Imaging Systems, Wireless Base Station Signal Processing, Legacy Design Sustainment.
Telecommunications Backplane Design
The EP1AGX35DF780I7 fits telecom backplane applications because its 4 integrated 3.125 Gbps transceivers natively support Serial RapidIO and XAUI protocols commonly used in backplane interconnect. The 35K logic elements provide sufficient fabric to implement custom packet processing, link-layer state machines, and forward error correction logic alongside the transceiver PCS. In a typical ATCA or MicroTCA backplane card, the FPGA bridges line-side optics to a CPU/ASIC via these serial links, with the industrial temperature range of the EP1AGX35DF780I7 meeting the -40C to +100C requirement of carrier-grade equipment. The 1.2V core and transceiver supplies require careful power-sequencing; Altera's transceiver toolkit provides reference designs for typical backplane topologies.
Recommended
High-Speed Serial Protocol Bridging
Use the EP1AGX35DF780I7 to bridge between high-speed serial protocols such as PCI Express, Serial RapidIO, XAUI, and Gigabit Ethernet without consuming fabric for soft SERDES. The hard IP transceivers integrate PMA and PCS functions up to 3.125 Gbps, leaving the 35K logic elements free for protocol translation, buffer management, and custom bridging logic. The FBGA-780 footprint supports up to 4 transceiver channels plus ample general-purpose I/O for parallel side interfaces. Compared with implementing SERDES in soft logic on a non-transceiver FPGA, the integrated transceivers reduce power consumption by approximately 50% and free 10-15K logic elements otherwise spent on serialization.
Recommended
Video Broadcast Equipment
The EP1AGX35DF780I7 is suitable for video broadcast equipment such as SDI embedders/de-embedders, format converters, and routing switchers. The 3.125 Gbps transceivers handle HD-SDI and 3G-SDI signals natively when paired with external cable drivers, while the 35K logic elements implement SMPTE 259M/292M/424M processing, audio embedding, and ancillary data handling. The DSP blocks accelerate video scaling and color space conversion operations. Industrial temperature grade supports the operating environments of broadcast equipment racks. The FBGA-780 package provides the I/O count needed for multi-channel SDI I/O alongside control interfaces to host processors.
Recommended
Industrial Imaging Systems
Industrial imaging systems such as machine vision cameras, flat-panel inspection equipment, and medical imaging pre-processors benefit from the EP1AGX35DF780I7's combination of 3.125 Gbps transceivers (for Camera Link HS or CoaXPress over fibre) and 35K logic elements (for image processing pipelines). The industrial temperature range (-40C to +100C) supports factory floor deployment. The DSP blocks accelerate filtering, edge detection, and Bayer demosaicing operations on high-resolution image streams. The FBGA-780 footprint offers sufficient transceivers for multi-channel camera interfaces plus general-purpose I/O for trigger synchronization and lighting control.
Recommended
Wireless Base Station Signal Processing
Wireless base stations require high-speed serial links to remote radio heads (RRH) and baseband processors, making the EP1AGX35DF780I7 a fit for CPRI and OBSAI protocol implementation. The 4 transceivers at 3.125 Gbps support common CPRI line bit rates up to option 4 (2457.6 Mbps) plus overhead. The 35K logic elements implement CPRI framing, IQ data routing, and baseband-to-RRH interface control. Industrial temperature grade handles outdoor cabinet deployments. The device's DSP blocks accelerate uplink/downlink pre-processing such as crest factor reduction and digital predistortion for the radio path.
Recommended
Legacy Design Sustainment
Many production systems designed in the late 2000s use the EP1AGX35DF780I7 and require continued supply for sustaining engineering. The Arria GX family has been designated NRND by Intel/Altera, but the part remains available through secondary distributors for legacy sustainment. When choosing this part in 2026 for legacy sustainment, confirm long-term availability with your distributor, validate against any system-level requalification requirements, and plan migration paths to newer Arria V or Cyclone V families when cost-effective. The Altera Quartus II legacy toolchain supports continued design iteration on these devices.
Recommended
Recommended Products Summary
Engineering reference data for EP1AGX35DF780I7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1AGX35DF780I6N | EP1AGX35DF780I5N | EP1AGX35DF780C6N | EP1AGX35CF780I6N |
|---|---|---|---|---|---|
| Package | 780-pin FBGA (FineLine BGA) | 780-pin FBGA (same) | 780-pin FBGA (same) | 780-pin FBGA (same) | 780-pin FBGA (same) |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Logic Elements | 35,000 | 35,000 | 35,000 | 35,000 | 35,000 |
| Transceivers | 4 channels @ 3.125 Gbps | 4 channels @ 3.125 Gbps | 4 channels @ 3.125 Gbps | 4 channels @ 3.125 Gbps | 4 channels @ 3.125 Gbps |
| Speed Grade | 7 (fastest) | 6 (mid) | 5 (slowest) | 6 (mid) | 6 (mid) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) |
| RoHS Compliance | Yes (per Alldatasheet) | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND |
| Configuration Method | JTAG / Passive Serial / Active Serial | JTAG / Passive Serial / Active Serial | JTAG / Passive Serial / Active Serial | JTAG / Passive Serial / Active Serial | JTAG / Passive Serial / Active Serial |
Key Differentiators
- Fastest speed grade (7) within Arria GX 35K family (vs EP1AGX35DF780I6N)
- Industrial temperature range (-40C to +100C) (vs EP1AGX35DF780C6N)
- FBGA-780 footprint enables full 4 transceiver channels (vs EP1AGX35CF484I6N)
Design Notes
The EP1AGX35DF780I7 FBGA-780 package requires 1.0 mm ball pitch PCB layout with microvia or via-in-pad technology. Route 100-ohm differential pairs for the 3.125 Gbps transceiver channels with matched length within 150 mils across the four transmit and receive pairs. Use a continuous ground reference plane beneath the transceiver channels to control impedance and minimize crosstalk. Decoupling: place 0.1uF and 0.01uF ceramic capacitors within 100 mils of each VCC pin, plus bulk decoupling at the board edge.
The EP1AGX35DF780I7 requires 1.2V core supply, 2.5V or 3.3V I/O supply (bank-dependent), and dedicated VCCA analog supply for the transceiver PLLs. Power sequencing must follow Altera's specified order: VCCINT (1.2V core) first, then VCCIO, then VCCA. Estimated: at full transceiver utilization with all 4 channels active, total power consumption reaches 4-6W; design the power supply with at least 30% margin. Use a dedicated LDO or DC-DC regulator for VCCA to minimize jitter on the transceiver PLLs.
Transceiver reference clock routing is critical: use a low-jitter clock source (under 100 fs RMS jitter for 3.125 Gbps operation) and route the reference clock traces as 50-ohm controlled impedance with ground reference plane. Maintain 100-ohm differential impedance on TX and RX pairs, with length matching within 150 mils across all channels of a multi-lane link. Use AC-coupling capacitors (typically 100 nF) on the high-speed serial lines between the FPGA and external connectors/ics. Perform post-layout signal integrity simulation with the IBIS-AMI models from Altera.
The FBGA-780 package requires thermal management for sustained transceiver utilization. Estimated: at 5W total power consumption in still air, the junction temperature rise is approximately 25-35C above ambient with a properly designed thermal via array under the package. Use a 4-layer or 6-layer PCB with thermal via array directly beneath the BGA, plus copper pours on internal layers. For industrial temperature operation at +100C ambient, ensure the thermal design keeps the junction below 125C.
Common pitfalls when designing with the EP1AGX35DF780I7 include: (1) Using speed grade 5/6 parts interchangeably with grade 7 without revalidating timing closure in Quartus II - lower speed grades may fail timing on the same design. (2) Omitting the transceiver analog supply decoupling near the VCCA pins, which causes PLL jitter and link errors. (3) Configuring the device with an unsupported configuration scheme - confirm MSEL pin settings match the desired configuration mode (AS, PS, JTAG). (4) Failing to validate transceiver pre-emphasis and equalization settings for the specific channel loss profile - use the Altera Transceiver Toolkit to characterize the link.
Compliance Information
RoHS compliance per Alldatasheet listing. Lead-free per datasheet. Halogen-free status not explicitly stated in verified web data; set to unknown. AEC-Q100 not applicable - this is a commercial/industrial FPGA, not an automotive-qualified IC.
