EP1AGX50DF780I6N - Arria GX FPGA 50K LE 780-FBGA | Intel
MPN: EP1AGX50DF780I6N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $385 | $385.00 |
| 10 | $355 | $3,550.00 |
| 100 | $318 | $31,800.00 |
| 500 | $285 | $142,500.00 |
| 1,000 | $255 | $255,000.00 |
Drop-in alternatives for EP1AGX50DF780I6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EP1AGX50DF780I6
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View Datasheet →EP1AGX50DF780I6N Maximum Ratings & Electrical Characteristics
| Family | Arria GX |
| Logic Elements (LEs) | 50,160 |
| Logic Array Blocks (LABs) | 2,508 |
| User I/O Pins | 350 |
| Process Technology | CMOS, 1.2V core |
| Package | 780-pin FBGA (FineLine BGA) |
| Mounting Type | Surface Mount |
| Operating Temperature Grade | Industrial (I6, -40C to +100C junction) |
| Configuration Mode | Serial / Parallel / JTAG |
| Embedded Transceivers | Yes (multi-channel, protocol-specific) |
| Embedded Multipliers | Yes (DSP blocks, 18x18) |
| RoHS Status | Compliant |
| Lead-Free / Halogen-Free | Lead-free per Intel datasheet |
| Supply Voltage | 1.2V core (with auxiliary rails per datasheet) |
EP1AGX50DF780I6N 780-pin fbga (fineline bga) Pin Configuration Guide
Complete pinout information for EP1AGX50DF780I6N (780-pin fbga (fineline bga) package) with 350 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1AGX50DF780I6N.
Refer to the datasheet for full pin configuration.
Estimated pin count: 350 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1AGX50DF780I6N is suitable for 6 applications: Telecom Line-Card Interface, Broadcast Video Processing, Industrial Imaging Pipeline, Military/Aerospace Signal Conditioning, Embedded Protocol Bridge, ASIC Prototyping Platform.
Telecom Line-Card Interface
The EP1AGX50DF780I6N fits telecom line-card designs where mid-density logic is needed to bridge backplane SERDES framer interfaces to parallel processing ASICs. With 50,160 logic elements and dedicated high-speed transceivers supporting protocols such as Serial RapidIO and PCI Express, the device can implement custom channel aggregation, framing, and protocol-conversion glue logic without offloading the main NPU. The 780-FBGA package exposes 350 user I/O pins, ample for parallel data-path interfaces, while the industrial -40C to +100C junction temperature grade supports outdoor and unconditioned cabinet deployments. Quartus Prime reference designs accelerate integration.
Recommended
Broadcast Video Processing
The EP1AGX50DF780I6N serves broadcast video processing applications such as HD-SDI routing, frame synchronizers, and on-screen-display overlay engines. Its 50,160 logic elements combined with embedded 18x18 multiplier blocks support real-time pixel-pipeline operations including color-space conversion and scaling. The 350 user I/O pins accommodate multiple parallel video buses plus control interfaces, and the 1.2V core with auxiliary rails allows integration alongside DDR2 memory for line/frame buffering. Industrial temperature screening suits OB-van and outdoor event-broadcast deployments.
Recommended
Industrial Imaging Pipeline
For machine-vision and inspection systems, the EP1AGX50DF780I6N provides the logic density and DSP resources to implement Bayer demosaicing, lens-distortion correction, and real-time feature-extraction algorithms. Its 50,160 logic elements handle multi-tap pixel processing at Camera Link or CoaXPress interface rates, while embedded multipliers accelerate convolution kernels. The industrial temperature grade and rugged FBGA package suit factory-floor installations with vibration and thermal cycling. Quartus Prime DSP Builder accelerates MATLAB-to-FPGA workflows for vision engineers.
Recommended
Military/Aerospace Signal Conditioning
The EP1AGX50DF780I6N is well suited to defense signal-conditioning subsystems where deterministic latency and reconfigurability outweigh raw throughput. With 50,160 logic elements, designers can implement custom FIR filters, adaptive beamforming weights, and protocol-specific encryption pre-processors. The industrial -40C to +100C temperature grade meets many MIL-STD-810 environmental profiles for ground-mobile and airborne platforms. The 780-FBGA package supports dense routing for high-speed ADC/DAC interfaces.
Recommended
Embedded Protocol Bridge
The EP1AGX50DF780I6N excels as a multi-protocol bridge converting between standards such as Serial RapidIO, PCI Express, Gigabit Ethernet, and custom LVDS links. Its 50,160 logic elements and embedded transceivers allow simultaneous operation of multiple high-speed serial channels, while 350 user I/O pins support parallel sideband buses and memory interfaces. Industrial temperature operation suits outdoor telecom and railway applications.
Recommended
ASIC Prototyping Platform
Engineers use the EP1AGX50DF780I6N as an ASIC prototyping vehicle to validate complex SoC designs in real hardware before tape-out. Its 50,160 logic elements can host representative logic partitions, and the 780-FBGA package exposes sufficient pins to map ASIC peripheral interfaces. Quartus Prime supports rapid design iteration and incremental compile, accelerating bring-up. Industrial temperature grade enables prototype validation in target environments.
Recommended
Recommended Products Summary
Engineering reference data for EP1AGX50DF780I6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1AGX50DF780I6 | EP1AGX50DF780C6N | EP1AGX50DF780C7 | EP1AGX50DF780C6 | EP1AGX60DF780I6N | EP1AGX35DF780I6N |
|---|---|---|---|---|---|---|---|
| Package | 780-pin FBGA | 780-pin FBGA (same) | 780-pin FBGA (same) | 780-pin FBGA (same) | 780-pin FBGA (same) | 780-pin FBGA (same) | 780-pin FBGA (same) |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 50,160 | 50,160 | 50,160 | 50,160 | 50,160 | ~60,000 | ~33,000 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Commercial (0C to +85C) | Commercial | Commercial | Industrial | Industrial |
| Speed Grade | 6 | 6 | 6 | 7 (slower) | 6 | 6 | 6 |
| User I/O Pins | 350 | 350 | 350 | 350 | 350 | 350 | 350 |
| Embedded Transceivers | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| Approx. Unit Price (qty 1, USD) | 385.00 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Industrial temperature grade in the 780-FBGA footprint (vs EP1AGX50DF780C6N)
- Higher logic density than the EP1AGX35 family variant (vs EP1AGX35DF780I6N)
- Lower density than the EP1AGX60 family upgrade path (vs EP1AGX60DF780I6N)
Design Notes
The 780-FBGA package dissipates significant heat at high toggle rates; thermal resistance theta_JA depends strongly on PCB stack-up. Estimated: with a 6-layer PCB and adequate via-array thermal pad, expect theta_JA of approximately 8-12 C/W. At 4W dissipation, junction-to-ambient rise is 32-48C. For enclosed industrial cabinets, add forced airflow or a heatsink bonded to the BGA lid.
BGA escape routing on 1.0mm pitch requires high-density interconnect (HDI) PCB processes with microvias and sequential lamination. Use a 6-layer stack-up with dedicated ground and power planes adjacent to the BGA. Decouple every power pin with 100nF X7R placed within 2mm of the via pad, plus bulk 10-47uF tantalum or polymer capacitors near the supply entry.
Differential pair routing for high-speed transceivers must maintain 100 ohm differential impedance with length matching under 150 mils. Reference the Arria GX handbook for per-channel skew budgets and pre-emphasis / equalization settings. Series DC-blocking capacitors must be 0402-size with C0G/NP0 dielectric; X7R introduces distortion at multi-Gbps rates.
Do not assume configuration mode by default - the MSEL pins must be strapped correctly for the chosen configuration source (AS, PS, JTAG). Incorrect MSEL settings cause silent configuration failure. Also, leave JTAG pins accessible in production for in-system programming and boundary-scan diagnostics. Reset and configuration DONE signals require pull-ups per the handbook.
Compliance Information
RoHS and lead-free confirmed via Intel product page; halogen-free status not explicitly stated. AEC-Q100 not applicable as this is an FPGA, not an automotive-grade IC.
