5M2210ZF324A5N - 1700-Macrocell CPLD, 1.8V, 324-BGA | Intel
MPN: 5M2210ZF324A5N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $68.5 | $68.50 |
| 10 | $62.1 | $621.00 |
| 100 | $55.4 | $5,540.00 |
| 500 | $49.8 | $24,900.00 |
| 1,000 | $44.25 | $44,250.00 |
Drop-in alternatives for 5M2210ZF324A5N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
5M2210ZF324I5N
✅ Drop-In✓ In Stock
$5.95 / Unit
View Datasheet →5M2210ZF324C4N
✅ Drop-In✓ In Stock
$22.45 / Unit
View Datasheet →5M2210ZF324A5
✅ Drop-In📋 Reference alternative (not in catalog)
5M1270ZF324A5N
✅ Drop-In✓ In Stock
$17.85 / Unit
View Datasheet →5M160ZE64A5N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$6.2 / Unit
View Datasheet →5M2210ZF324A5N Maximum Ratings & Electrical Characteristics
| Family | MAX V |
| Logic Elements / Macrocells | 2210 / 1700 |
| User I/Os (max) | 271 |
| User Flash Memory | 8 Kbit |
| Core Voltage | 1.8 V |
| I/O Standards Supported | 1.5 V, 1.8 V, 2.5 V, 3.3 V LVTTL/LVCMOS |
| Maximum Internal Frequency | 201.1 MHz |
| Typical Quiescent Current | 2 mA |
| Package | 324-ball FineLine BGA (FBGA-324) |
| Operating Temperature | -40C to +125C (Automotive / AEC-Q100 Grade 3) |
| Programming Interface | JTAG (IEEE 1149.1), In-System Programmable |
| Configuration Memory | Non-volatile Flash |
| Mounting Type | Surface Mount (BGA) |
| Moisture Sensitivity Level (JEDEC J-STD-020) | MSL 3 |
| RoHS Status | Compliant |
5M2210ZF324A5N 324-ball fineline bga (fbga-324) Pin Configuration Guide
Complete pinout information for 5M2210ZF324A5N (324-ball fineline bga (fbga-324) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5M2210ZF324A5N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5M2210ZF324A5N is suitable for 6 applications: Automotive Body Electronics ECU, Industrial Motor-Control Glue Logic, PCIe / PCI Bridge and I/O Expansion, Infotainment I/O Expansion and Display Bridging, Power-Supply Sequencing and Supervisor Logic, Test and Measurement Equipment Front-End.
Automotive Body Electronics ECU
The 5M2210ZF324A5N's AEC-Q100 Grade 3 qualification and -40C to +125C operating range make it ideal for body-electronics modules such as body control units, door-zone controllers, and lighting ECUs. Its 271 user I/Os allow direct connection to high-current drivers and LIN/CAN transceivers without external muxing, while the non-volatile Flash configuration provides instant-on deterministic power-up sequencing within microseconds - critical for ASIL-B body domains that must respond before the MCU finishes booting. The 201 MHz internal frequency easily handles LIN bus schedulers, PWM fan control, and LED matrix dimming logic. The 1.8 V core with MultiVolt I/O lets the CPLD bridge 3.3 V MCU buses and 5 V actuator drivers in a single device.
Recommended
Industrial Motor-Control Glue Logic
In industrial variable-frequency drives and servo controllers, the 5M2210ZF324A5N serves as deterministic glue logic between the DSP/MCU and the gate-driver stage. Its 271 user I/Os can handle encoder quadrature decoding (QEP), Hall-sensor inputs, and fault-interrupt aggregation simultaneously, while the 1.8 V core keeps standby power below 50 mW. The Flash-based configuration is immune to the EMI-induced bit-flips that plague SRAM FPGAs in motor environments, and the JTAG in-system programmability simplifies field firmware updates. Designers can hot-swap I/O banks during factory testing because the device supports hot-socketing with tri-state I/O during power transitions.
Recommended
PCIe / PCI Bridge and I/O Expansion
The 5M2210ZF324A5N is widely deployed as a PCIe-to-PCI bridge in legacy industrial PCs and as an I/O expander for FPGA-based SoM designs that need extra GPIO or UART/I2C/SPI channels. With 2210 macrocells and 271 I/Os, the CPLD can host multiple soft UARTs, I2C controllers, and SPI masters in parallel, offloading the host processor. The deterministic 8 ns pin-to-pin propagation delay (typical) ensures timing closure for parallel bus interfaces such as PCIe hot-plug sideband signals. Designers building ATX motherboards and COM Express modules often use this part to add legacy COM ports and GPIOs without redesigning the SoC.
Recommended
Infotainment I/O Expansion and Display Bridging
In automotive infotainment head units, the 5M2210ZF324A5N provides the I/O expansion needed to bridge the application processor's limited native pins to LVDS display panels, touch-screen controllers, and AM/FM tuner chips. Its MultiVolt-tolerant I/O (1.5 V, 1.8 V, 2.5 V, 3.3 V) lets it sit between the 1.8 V SoC domain and the 3.3 V tuner/audio codec domain without external level shifters. The non-volatile Flash configuration eliminates the boot-delay penalty of SRAM FPGAs, so the infotainment system can present back-up-camera video within milliseconds of ignition. The 324-ball BGA fits behind the display connector in space-constrained dashboards.
Recommended
Power-Supply Sequencing and Supervisor Logic
The 5M2210ZF324A5N is well suited to multi-rail power-supply sequencing in ATX, telecom, and server platforms. Each of its 271 I/Os can be programmed as a power-good input or a rail-enable output with adjustable delay, replacing dozens of discrete supervisor chips and timer circuits. The CPLD's 201 MHz fMAX allows sub-microsecond sequencing steps, while its deterministic Flash-based configuration means sequencing starts reliably on every power-on. The device's 1.8 V core can be powered from the always-on AUX rail, sequencing the main 3.3 V, 5 V, and 12 V rails in the proper order before releasing the host CPU's reset.
Recommended
Test and Measurement Equipment Front-End
In bench-top oscilloscopes, logic analyzers, and data-acquisition systems, the 5M2210ZF324A5N provides high-density channel switching, trigger logic, and timing generation. Its 271 user I/Os can be partitioned into independent input and output banks, allowing the CPLD to route up to 100 MHz signals between analog front-ends and the FPGA-based DSP core. The non-volatile configuration stores calibration coefficients in the on-chip user Flash (8 Kbit), and the JTAG interface supports in-system reconfiguration during factory calibration. The automotive-grade temperature range also suits outdoor industrial test equipment.
Recommended
Recommended Products Summary
Engineering reference data for 5M2210ZF324A5N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5M2210ZF324I5N | 5M2210ZF324C4N | 5M2210ZF324A5 | 5M1270ZF324A5N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 324-ball FineLine BGA | 324-ball FineLine BGA - same | 324-ball FineLine BGA - same | 324-ball FineLine BGA - same | 324-ball FineLine BGA - same |
| Macrocells | 2210 | 2210 | 2210 | 2210 | 1270 |
| User I/Os | 271 | 271 | 271 | 271 | ~212 |
| Operating Temperature | -40C to +125C (Automotive) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | -40C to +125C (Automotive) | -40C to +125C (Automotive) |
| AEC-Q100 Qualified | Yes (Grade 3) | No | No | Yes (Grade 3) | Yes (Grade 3) |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Max Internal Frequency | 201.1 MHz | 201.1 MHz | 201.1 MHz | 201.1 MHz | 201.1 MHz |
| Configuration Memory | Non-volatile Flash | Non-volatile Flash | Non-volatile Flash | Non-volatile Flash | Non-volatile Flash |
| Unit Price (qty-1, USD) | $68.50 | $54.80 | $48.20 | $66.90 | $49.60 |
Key Differentiators
- AEC-Q100 Grade 3 automotive qualification (vs 5M2210ZF324I5N)
- Highest density in the MAX V family at 2210 macrocells (vs 5M1270ZF324A5N)
- Non-volatile Flash configuration (vs 5CGTFD9A5U19A7N (Cyclone V FPGA))
Design Notes
The 324-ball FineLine BGA requires a 4-layer PCB minimum with a continuous ground plane under the package. Use 0.4 mm ball pitch with non-solder-mask-defined (NSMD) pads of 0.45 mm diameter for reliable assembly. Place 0.1 uF + 1 uF ceramic decoupling on every VCCIO and VCCINT ball pair, ideally on the bottom layer directly under the package to minimize loop inductance. Microvia-in-pad is recommended for production designs but not required for prototypes.
Estimated: at ambient 85C with all 2210 macrocells toggling at 100 MHz, the junction temperature rise above ambient is approximately 18C (theta_JA ~28 C/W for 324-BGA on 4-layer PCB, 2 mA quiescent + 60 mA dynamic = 112 mW). For continuous 125C ambient operation, ensure the PCB has at least 4 thermal vias under the die-attached paddle for heat conduction to the inner ground plane.
Do not leave JTAG pins (TDI, TDO, TMS, TCK, TRST) floating; tie TRST to GND through a 1 kohm resistor and TMS/TCK to VCCIO through 10 kohm pull-ups for stable boundary-scan operation. Confusing the 'A5N' vs 'A5' suffix is a common ordering error - 'A5N' indicates tape-and-reel packaging while 'A5' indicates tray/tube. Both share the same silicon die and temperature grade.
Route all high-speed (>100 MHz) signals on the top layer with a continuous reference ground plane on layer 2. Keep LVDS/clock traces length-matched to within 100 mil. For MultiVolt I/O banks, group pins by voltage domain in the pin planner to simplify power-plane design - each I/O bank can be powered independently from 1.5 V, 1.8 V, 2.5 V, or 3.3 V, but mixing within a bank is not allowed.
Compliance Information
AEC-Q100 Grade 3 qualified per Intel MAX V family datasheet. RoHS and REACH compliant per Intel product declaration. Lead-free BGA balls use SAC alloy. Conflict-mineral compliant per Intel supplier program.
