EP1K100FC484-3 - 100K Gates ACEX-1K FPGA | Altera | 484-FBGA
MPN: EP1K100FC484-3 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $72 | $720.00 |
| 100 | $64.5 | $6,450.00 |
| 500 | $58 | $29,000.00 |
| 1,000 | $52.5 | $52,500.00 |
EP1K100FC484-3 Overview
An FPGA (Field Programmable Gate Array) is a semiconductor device containing programmable logic blocks, interconnect, and I/O that can be configured by the customer after manufacture. FPGAs sit in the programmable logic category between fixed-function ASICs and general-purpose processors: they offer hardware-level parallelism and deterministic timing without the NRE cost of an ASIC. The ACEX-1K family specifically targets cost-sensitive, medium-density applications where designers need 10K-100K gates with embedded memory and PLL support, falling into the broader taxonomy: FPGA → programmable logic → programmable device → digital IC → semiconductor.
Key features of the EP1K100FC484-3 include an internal configuration of 4,992 logic elements organized into 624 LABs, 12 embedded array blocks (EABs) for dual-port RAM/ROM, up to 49,152 bits of on-chip RAM, six clock input pins and four dedicated clock outputs, plus multi-volt I/O support for 2.5V, 3.3V, and 5V interfacing via dedicated VCCIO banks. The device also integrates a robust embedded array block architecture for efficient memory and specialized logic functions, and supports in-system programmability through the serial configuration scheme.
Architecturally, the EP1K100FC484-3 uses an enhanced embedded array that combines dedicated dual-port RAM blocks (EABs) with fine-grained logic elements (LEs). Each EAB can be configured as 4,096 bits of RAM (with parity) or 2048 bits of true dual-port RAM, while each LE contains a 4-input LUT, a programmable register, and a carry chain for fast arithmetic. The FC484 package is part of Altera's SameFrame migration path with other FineLine BGA packages, allowing drop-in compatibility across density points within the family.
Typical applications include telecommunications line cards, industrial control systems, consumer electronics with custom glue logic, low-volume prototyping for ASIC replacement, and embedded DSP preprocessing. The wide I/O count and embedded RAM make it suitable for bus interfacing, FIFO buffering, and state-machine-heavy control logic. The 484-FBGA package is suitable for high-density designs where signal integrity and board space are priorities.
Design consideration: the EP1K100FC484-3 is an older 2.5V core device requiring level shifters to interface with modern 1.8V or 1.2V logic. Designers should also plan for an external configuration PROM (such as EPC2 or EPC8) or a microprocessor-driven configuration scheme, as SRAM-based FPGAs lose their configuration on power-down. The FC484 BGA footprint is the largest in the ACEX-1K family and should be matched against PCB manufacturing capability.
This page synthesizes distributor availability data, drop-in compatible family members, and practical design notes that complement the official Altera ACEX-1K datasheet for sourcing and design-in decisions.
Drop-in alternatives for EP1K100FC484-3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP1K100FC484-3 (same form factor and footprint) — differing in Speed Grade, Package, Configuration Method, Process Technology, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1K100FC484-2N
✅ Drop-In✓ In Stock
$58.4 / Unit
View Datasheet →EP1K100FC484-2
✅ Drop-In✓ In Stock
$33.4 / Unit
View Datasheet →EP1K100FC484-1N
✅ Drop-In✓ In Stock
$58.4 / Unit
View Datasheet →EP1K100FC484-1
✅ Drop-In✓ In Stock
$52.1 / Unit
View Datasheet →EP1K100FC484-3N
✅ Drop-In✓ In Stock
$65.1 / Unit
View Datasheet →EP1K100FC484-3F
✅ Drop-In📋 Reference alternative (not in catalog)
EP1K100FC484-3 Maximum Ratings & Electrical Characteristics
| Family | ACEX-1K |
| Logic Elements | 4,992 |
| System Gates | 100,000 |
| Maximum Equivalent Gates | 257,000 |
| Embedded RAM Bits | 49,152 bits |
| Embedded Array Blocks (EABs) | 12 |
| Logic Array Blocks (LABs) | 624 |
| Maximum User I/O | 333 |
| Core Voltage | 2.5 V |
| MultiVolt I/O Support | 2.5V / 3.3V / 5V |
| Process Technology | 0.18 µm CMOS |
| Package | 484-Ball FineLine BGA (FC484) |
| Configuration Method | SRAM, serial or parallel |
| Speed Grade | -3 |
| RoHS Status | Compliant |
EP1K100FC484-3 484-ball fineline bga (fc484) Pin Configuration Guide
Pin configuration for EP1K100FC484-3 (484-ball fineline bga (fc484) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1K100FC484-3.
Refer to the datasheet for full pin configuration.
Typical Applications
EP1K100FC484-3 is suitable for 6 applications: Telecommunications Line Cards, Industrial Control and Factory Automation, ASIC Prototyping and Logic Replacement, Legacy Military and Avionics Interfaces, Test and Measurement Instrumentation, Consumer Electronics Glue Logic and Bridging.
Telecommunications Line Cards
The EP1K100FC484-3 fits telecom line-card designs where 100K gates of programmable logic handle channelized framing, HDLC/PPP processing, and TDM bus multiplexing. Its 12 EABs provide 49 Kbits of dual-port RAM for buffer descriptors and small FIFOs between serial framers and a host CPU, while 333 user I/Os route the wide parallel backplane and TDM data buses. Compared to an ASIC, the ACEX-1K allows last-minute protocol changes (e.g., E1/T1 vs DS3) without re-spinning silicon. Design trade-off: the 2.5V core adds level-shifters for modern 1.8V framers, but MultiVolt I/O simplifies legacy 5V interface bridging.
Recommended
Industrial Control and Factory Automation
In industrial PLCs and motor-control boards, the EP1K100FC484-3 is used for glue logic, encoder decoding, PWM generation, and high-speed sensor fusion. The 4,992 LEs handle state machines and protocol stacks (Modbus, PROFIBUS, EtherCAT) while the EABs store lookup tables for sensor linearization and field-weakening curves. The 484-FBGA package offers the thermal headroom needed for factory-floor ambient temperatures up to 85C, though designers should verify the device's industrial temperature grade. Trade-off: SRAM-based configuration requires a watchdog to detect bitstream corruption in high-EMI environments.
Recommended
ASIC Prototyping and Logic Replacement
Engineers use the EP1K100FC484-3 as a fast-turnaround prototype for ASIC designs up to ~100K gates, allowing firmware and validation teams to work in parallel with mask preparation. The SameFrame migration path means a single PCB footprint supports multiple ACEX-1K density points, so the EP1K100 can be swapped for a smaller EP1K10 or EP1K30 during bring-up. The 200 MHz internal performance (speed grade -3) handles most glue-logic and bus-interface emulation scenarios. Trade-off: the BGA package complicates hand-rework and rework cost must be factored into prototype budgets.
Recommended
Legacy Military and Avionics Interfaces
The EP1K100FC484-3 historically appeared in defense and avionics subsystems where Mil-Std-1553, ARINC 429, or custom parallel backplane interfaces needed programmable glue logic. The 333 user I/Os accommodate multi-channel serial buses, while the embedded RAM implements protocol lookup tables and error counters. Although obsolete for new defense designs, the part remains supported in long-lifecycle sustainment programs where design re-validation cost outweighs component obsolescence. Designers should plan for last-time-buy acquisition and qualified-hold inventory.
Recommended
Test and Measurement Instrumentation
Bench-top instruments such as protocol analyzers, logic-state sequencers, and custom pattern generators use the EP1K100FC484-3 for pattern storage, timing generation, and bus capture. The 12 EABs implement deep capture FIFOs between the high-speed sampling front-end and the slower host processor, while 333 I/Os drive front-panel displays, parallel buses, and trigger logic. The -3 speed grade provides margin for 100+ MHz internal event timing. Trade-off: the 0.18 µm CMOS process consumes more power than modern 28/40 nm FPGAs, so thermal design must account for the 484-FBGA junction-to-ambient thermal resistance.
Recommended
Consumer Electronics Glue Logic and Bridging
The EP1K100FC484-3 is well suited to consumer-electronics products requiring custom video processing, format conversion, or multi-standard bridging where ASIC NRE costs are unjustified. The MultiVolt I/O bank architecture allows the FPGA to bridge 5V legacy buses, 3.3V media processors, and 2.5V DDR memory interfaces on a single device. Embedded RAM blocks store line buffers and deinterlacing tables for video scaling applications. Trade-off: the obsolete lifecycle status means consumer designs should plan a migration path to Cyclone IV or Cyclone 10 LP before the part enters shortage.
Recommended
Recommended Products Summary
Engineering reference data for EP1K100FC484-3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1K100FC484-2N | EP1K100FC484-2 | EP1K100FC484-1N | EP1K100FC484-1 | EP1K100FC484-3N | EP1K100FC484-3F |
|---|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 484-Ball FineLine BGA (FC484) | 484-Ball FineLine BGA (FC484) - same | 484-Ball FineLine BGA (FC484) - same | 484-Ball FineLine BGA (FC484) - same | 484-Ball FineLine BGA (FC484) - same | 484-Ball FineLine BGA (FC484) - same | 484-Ball FineLine BGA (FC484) - same |
| Speed Grade | -3 (fastest) | -2 | -2 | -1 | -1 | -3 | -3 |
| System Gates | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 |
| Logic Elements | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 |
| Embedded RAM Bits | 49,152 | 49,152 | 49,152 | 49,152 | 49,152 | 49,152 | 49,152 |
| Maximum User I/O | 333 | 333 | 333 | 333 | 333 | 333 | 333 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Lead-Free / RoHS | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant (Pb-free) |
Key Differentiators
- Highest-density ACEX-1K family member (vs EP1K30FC256 (lower-density sibling))
- SameFrame pin-compatible across speed grades (vs EP1K100FC484-2N)
- MultiVolt I/O bank architecture (vs Earlier Altera FLEX 10K family)
Design Notes
The EP1K100FC484-3 requires four separate power rails: VCCINT (2.5V core), VCCIO (2.5V/3.3V/5V per bank), VCC_PLL (2.5V analog for PLLs), and VCC_CONFIG (2.5V for configuration logic). Decouple each rail with 0.1 µF ceramic capacitors placed within 5 mm of each power pin, plus 10 µF bulk capacitors on each supply. Estimated: at 100% logic utilization the VCCINT rail draws roughly 200-400 mA depending on toggle rate; use a switching regulator rated for at least 1.5x this current to handle inrush during configuration.
The 484-ball FineLine BGA has a θJA of approximately 12 C/W with a standard 4-layer JEDEC test board. Estimated: at 1W total power dissipation (typical for moderate-density designs) the junction rises ~12°C above ambient. For industrial-temperature designs, keep total power below 1.5W to maintain junction below 100°C at 70°C ambient. Add thermal vias under the central BGA ball grid to improve heat conduction to inner copper planes.
The FC484 FineLine BGA uses 1.00 mm ball pitch, which requires laser-drilled or precision-mechanical-drilled micro-vias on a 4-layer or 6-layer PCB stack-up. Per Altera layout guidelines, route all signal traces on inner layers with micro-via fanouts to outer-layer pads, and provide continuous GND planes on layers 2 and (N-1) for return-path integrity. For high-speed clocks (>100 MHz) use differential pair routing with matched lengths within 50 mils.
Common pitfalls when designing with the EP1K100FC484-3 include: (1) forgetting the external configuration PROM (EPC2/EPC8) — SRAM-based FPGAs lose their bitstream on every power-down; (2) mixing VCCIO bank voltages without isolating buses — connecting a 5V output to a 3.3V bank will damage the I/O; (3) using the wrong JTAG pin order on the 10-pin header — Altera uses the .sof program file format, not .jed; (4) ignoring the nCONFIG and nSTATUS pull-up resistors — without these, configuration will fail to start.
For LVDS or HSTL signaling on the EP1K100FC484-3, follow Altera's High-Speed I/O Design Guidelines: route differential pairs with 100 Ω differential impedance and match trace lengths within 20 mils. Add 100 Ω termination resistors near the receiver end. Estimated: at 200 MHz toggle rate, expect ~3-5 ns propagation skew across the BGA ball field; include this margin in timing-constraint setup windows. Use ground-cutout voids sparingly around high-speed signals to avoid impedance discontinuities.
Compliance Information
RoHS and lead-free compliant per Altera/Intel product records. AEC-Q100 qualification does not apply to commercial/industrial FPGAs. Halogen-free status not stated in available datasheets.
