10M50DAF484I7P - MAX 10 FPGA 50K LE, 484-BGA | Intel / Altera
MPN: 10M50DAF484I7P ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $174.73 | $174.73 |
| 10 | $162.5 | $1,625.00 |
| 100 | $145 | $14,500.00 |
| 500 | $128 | $64,000.00 |
| 1,000 | $112 | $112,000.00 |
Drop-in alternatives for 10M50DAF484I7P — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →10M50DAF484I7P Maximum Ratings & Electrical Characteristics
| Product Family | MAX 10 |
| Logic Elements (LE) | 50,000 |
| Embedded Memory (bits) | 1,677,312 |
| Embedded Memory Blocks | M9K (and M144K) |
| 18x18 Multipliers | 312 |
| User I/O Pins (max) | 360 |
| Package | 484-ball FineLine BGA (F484) |
| Pitch | 1.0 mm |
| Process Node | 55 nm embedded flash (TSMC) |
| On-die Configuration Flash | Yes (non-volatile, instant-on) |
| On-die ADC | Dual 12-bit SAR, 1 MSPS, up to 16 analog inputs |
| PLLs | 8 (general-purpose, fractional on selected devices) |
| Global Clock Networks | 20 |
| Speed Grade | 7 (slowest industrial bin, highest margin) |
| Operating Temperature | -40C to +100C (Tj, industrial) |
| Configuration Modes | Internal flash, JTAG, dual-boot image support |
| RoHS Status | Compliant |
10M50DAF484I7P 484-ball fineline bga (f484) Pin Configuration Guide
Complete pinout information for 10M50DAF484I7P (484-ball fineline bga (f484) package) with 360 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M50DAF484I7P.
Refer to the datasheet for full pin configuration.
Estimated pin count: 360 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M50DAF484I7P is suitable for 6 applications: Industrial Motor Control, Factory Automation I/O Expansion, Video Bridging and Display Aggregation, Portable Medical Instrument Front-End, IoT Edge Aggregation Node, Glue-Logic and CPLD Replacement.
Industrial Motor Control
The 10M50DAF484I7P is well-suited to industrial motor control because it combines 312 18x18 multipliers for field-oriented control (FOC) math with on-die dual 12-bit 1 MSPS ADCs that sample shunt current and back-EMF directly. Industrial grade -40C to +100C operation tolerates factory-floor enclosures, while the 360 user I/Os of the F484 BGA expose enough PWM channels and encoder inputs to drive multi-axis servo stages. Estimated: at 100 MHz the 50K-LE fabric can run a 3-axis FOC loop with PWM frequencies up to 50 kHz and current-loop update rates above 20 kHz, replacing a discrete MCU + external ADC stack with a single non-volatile chip.
Recommended
Factory Automation I/O Expansion
The 10M50DAF484I7P acts as a non-volatile I/O expander for PLC and distributed I/O nodes, using its 360 user I/Os in the F484 BGA to fan out 24 V opto-isolated field signals and protocol gateways (Modbus RTU, EtherCAT, PROFINET) on a single chip. Industrial temperature grade ensures operation in unconditioned control cabinets, while embedded configuration flash lets the unit boot and start scanning within milliseconds of power-up without an external PROM. Estimated: 50K logic elements map roughly to 200 24-bit registers per protocol instance, sufficient for a 32-channel digital input card plus on-card diagnostics LEDs.
Recommended
Video Bridging and Display Aggregation
The 10M50DAF484I7P bridges legacy parallel RGB / BT.656 / LVDS video sources to MIPI or DisplayPort sinks in industrial HMI and medical imaging panels. Its 1.677 Mbit embedded memory buffers a full frame at 800x600 resolution while the 312 hardware multipliers handle color-space conversion and chroma resampling in real time. The 360 user I/Os of the F484 BGA expose enough LVDS pairs to drive WXGA panels; industrial temperature grade suits clinical and outdoor kiosks. Estimated: at 65 MHz pixel clock the fabric runs color-space conversion with 4 video pipelines consuming under 60% of LE capacity.
Recommended
Portable Medical Instrument Front-End
Battery-powered patient monitors and handheld ultrasound probes use the 10M50DAF484I7P to combine front-end DSP (312 18x18 multipliers for FIR/IIR filtering), control logic, and on-die 12-bit ADC for sensor readout into a single 55 nm non-volatile part. The F484 BGA's 1.0 mm pitch fits compact PCBs and the industrial temperature range suits body-worn applications. Instant-on from internal flash supports clinician-grade fast power-up behavior without an external boot PROM. Estimated: a 4-channel ECG path with 250 Hz bandwidth fits in roughly 12K LE, leaving 38K LE for application firmware and BLE stack glue logic.
Recommended
IoT Edge Aggregation Node
The 10M50DAF484I7P aggregates multiple sensor interfaces (SPI, I2C, UART, Modbus) and runs local edge analytics before forwarding data to a wireless SoC, eliminating the external boot PROM typical of discrete-CPLD-plus-MCU designs. Integrated dual 12-bit ADCs monitor rail voltages and battery health in the same chip, while the 360 user I/Os support 8+ sensor buses simultaneously. Estimated: at 50 MHz fabric frequency the device can handle up to 16 sensor channels with 100 Hz sampling and a small TensorFlow Lite for Microcontrollers inference workload.
Recommended
Glue-Logic and CPLD Replacement
The 10M50DAF484I7P is a popular CPLD replacement for legacy designs that have outgrown 5V CPLD pin counts and need more complex state machines, FIFOs, or bus arbitration. Its 50K logic elements, 1.677 Mbit memory, and 360 user I/Os in the F484 BGA let engineers consolidate multiple 84-pin CPLDs into one part. Non-volatile configuration flash preserves design state through power cycles, simplifying factory programming. Estimated: at typical 8-bit data-path utilization, the 50K-LE fabric is roughly equivalent to 6-8 large legacy CPLDs combined.
Recommended
Recommended Products Summary
Engineering reference data for 10M50DAF484I7P — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M50DAF484I7G | 10M50DAF484C7G | 10M40DAF484C7G | 10M50DCF484I7G | 10M40DCF484I7G |
|---|---|---|---|---|---|---|
| Package | F484 BGA (1.0 mm pitch) | F484 BGA (1.0 mm pitch) - same | F484 BGA (1.0 mm pitch) - same | F484 BGA (1.0 mm pitch) - same | F484 BGA (1.0 mm pitch) - same | F484 BGA (1.0 mm pitch) - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 50,000 | 50,000 | 50,000 | 40,000 (-20%) | 50,000 | 40,000 (-20%) |
| Embedded Memory (bits) | 1,677,312 | 1,677,312 | 1,677,312 | 1,235,000 (-26%) | 1,677,312 | 1,235,000 (-26%) |
| 18x18 Multipliers | 312 | 312 | 312 | 125 (-60%) | 312 | 125 (-60%) |
| User I/O Pins | 360 | 360 | 360 | 360 | 360 | 360 |
| Temperature Grade | Industrial -40C to +100C | Industrial -40C to +100C | Commercial 0C to +85C | Commercial 0C to +85C | Industrial -40C to +100C | Industrial -40C to +100C |
| On-die Configuration Flash | Yes (single image) | Yes (single image) | Yes (single image) | Yes (single image) | Yes (dual image) | Yes (dual image) |
| On-die ADC | Dual 12-bit, 1 MSPS | Dual 12-bit, 1 MSPS | Dual 12-bit, 1 MSPS | Dual 12-bit, 1 MSPS | Dual 12-bit, 1 MSPS | Dual 12-bit, 1 MSPS |
| Carrier / Pack | Tray | Tape & Reel | Tape & Reel | Tape & Reel | Tape & Reel | Tape & Reel |
Key Differentiators
- On-die configuration flash eliminates external boot PROM (vs Lattice ECP5)
- Integrated dual 12-bit ADC replaces companion analog IC (vs Xilinx Spartan-7)
- Tray carrier option aligned with low-volume prototyping (vs 10M50DAF484I7G (Tape & Reel))
- Industrial temperature grade on identical silicon (vs 10M50DAF484C7G (Commercial 0C..+85C))
Design Notes
The F484 FineLine BGA at 1.0 mm pitch requires at least an 8-layer PCB with 0.5 oz copper outer layers and 1 oz inner planes for power; the 360 user I/Os need via-in-pad (VIPPO) escape routing on the top layer to break out cleanly. Use microvias rather than through-hole vias for inner row signals to keep BGA breakout congestion manageable. Maintain continuous GND planes under the device - the MAX 10 uses the package's center balls as additional ground returns, and missing ground vias will degrade signal integrity on high-speed LVDS pairs.
MAX 10 devices in the F484 BGA rarely need a heatsink unless the design sustains >70% logic utilization with all DSP blocks active; estimated junction-to-ambient thermal resistance is approximately 14 C/W on a JEDEC 8-layer test board (per Altera thermal characterization), so a 2 W sustained dissipation produces roughly a 28C junction rise above ambient. Place thermal vias in the package center-ball grid to pull heat into the inner copper plane; surface-mount copper pours on top side directly under the device improve dissipation by an estimated 20-30%.
Bring CONF_DONE, nCONFIG, nSTATUS, MSEL, and JTAG (TCK/TMS/TDO/TDI) to test points or a 0.1 inch header for in-system programming and factory recovery - these signals are the only path to recover a bricked MAX 10 after a bad bitstream. Place the configuration flash dual-boot image selector (if used) on a dedicated GPIO that defaults to a known state with external pull-up. Estimated: re-spinning a board to recover from a locked-out configuration takes 4-6 weeks; the test header avoids this entirely.
Do not connect the MAX 10 ADC analog inputs directly to noisy digital rails - the SAR ADC needs a clean analog supply, so a ferrite bead + decoupling network from VCCA to the digital rails is recommended. Avoid using ADC channels in the same package bank as a switching PWM output; the coupling can degrade ADC SNR by 6-10 dB. Estimated: a 4-layer PCB with proper analog/digital split keeps ADC ENOB above 10.5 bits; a poorly partitioned layout typically drops below 9 ENOB.
Compliance Information
RoHS-compliant per Altera (now Intel) product page for the MAX 10 family. Not AEC-Q100 qualified; for AEC-Q100 automotive applications engineers should consider the Cyclone 10 LP automotive family. Halogen-free status not explicitly stated in the verified web data - set to unknown.
