EP1S20F780I6N - Stratix 18460-LE FPGA 780-FBGA Industrial | Intel
MPN: EP1S20F780I6N ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $881.32 | $881.32 |
| 10 | $820 | $8,200.00 |
| 100 | $760 | $76,000.00 |
| 250 | $705 | $176,250.00 |
| 500 | $660 | $330,000.00 |
EP1S20F780I6N Overview
A Field-Programmable Gate Array (FPGA) is a reprogrammable integrated circuit whose logic fabric is composed of look-up tables (LUTs), embedded memory blocks (M512/M4K/M-RAM), DSP blocks, and high-speed I/O that can be configured in the field after PCB assembly. Within the broader programmable-logic taxonomy, an FPGA sits between CPLDs (smaller, non-volatile, deterministic timing) and ASICs (full-custom, NRE, high unit cost). The Stratix family in particular targets high-performance digital signal processing, parallel processing, and high-throughput glue logic, and is the precursor family to Stratix II/III/IV at Intel PSG.
The EP1S20F780I6N exposes 1,846 Logic Array Blocks (LABs) and 6 embedded DSP blocks, plus 12 PLLs and 4 DLLs for fine-grained clock synthesis. The 1.5 V core is paired with selectable I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI-X) across 586 I/O pins, with up to 80 LVDS channels. Designers use the Altera Quartus II / Quartus Prime toolchain (legacy versions up to v13.1) along with SOPC Builder for embedded-processor integration. Memory-rich blocks (TriMatrix memory: M512, M4K, M-RAM) make this device well-suited to buffering, FIFO, and packet-processing roles.
Typical applications include high-speed data acquisition front-ends, telecommunication line cards, video-broadcast infrastructure, industrial vision and machine control, and legacy defense/aerospace DSP backplanes. The 586 I/O and abundant LVDS capability make it attractive for parallel ADC/DAC interfaces and asynchronous sample-rate conversion. The industrial temperature grade extends applicability to outdoor telecom and factory-floor equipment.
When designing with this part, ensure the PCB footprint follows the 780-BBGA, FCBGA land pattern with 1.0 mm pitch and a multi-layer PCB with a continuous via-in-pad or microvia stack to manage routing and thermal dissipation. JTAG pins (TCK, TMS, TDI, TDO) must be brought out to a 10-pin or ByteBlaster header for in-system configuration via EPC16/EPCS configuration devices or passive serial.
This page synthesizes distributor pricing, datasheet citations, drop-in Altera/Intel same-family alternatives, and engineering design notes not consolidated on a single DigiKey or Mouser listing.
Drop-in alternatives for EP1S20F780I6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP1S20F780I6N (same form factor and footprint) — differing in Operating Temperature, Speed Grade, Package, Process Technology, Configuration Method.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1S20F780I5N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$150 / Unit
View Datasheet →EP1S20F780I6
✅ Drop-In✓ In Stock
$720.38 / Unit
View Datasheet →EP1S20F780C6N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$188.75 / Unit
View Datasheet →EP1S20F780C7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$158.4 / Unit
View Datasheet →EP1S20F780C5N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$92 / Unit
View Datasheet →EP1S20F780I6N Maximum Ratings & Electrical Characteristics
| Series | Stratix |
| Logic Elements (LE) | 18460 |
| Logic Array Blocks (LABs) | 1846 |
| Total Memory Bits | 1669248 |
| User I/O Count | 586 |
| Number of LABs/CLBs | 1846 |
| Core Voltage | 1.5 V |
| Package | 780-BBGA, FCBGA |
| Package Pin/Ball Count | 780 |
| Ball Pitch | 1.0 mm |
| Mounting Type | Surface Mount |
| Operating Temperature | -40 °C to +85 °C (Industrial) |
| Speed Grade | -6 |
EP1S20F780I6N 780 Pin Configuration Guide
Pin configuration for EP1S20F780I6N (780 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S20F780I6N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP1S20F780I6N is suitable for 6 applications: High-Speed Data Acquisition Front-End, Telecommunication Line Card / Backplane, Video Broadcast Infrastructure, Industrial Machine Vision and Control, Legacy Defense / Aerospace DSP Backplane, ASIC Prototyping and Emulation.
High-Speed Data Acquisition Front-End
The EP1S20F780I6N fits high-speed data-acquisition front-ends thanks to its 586 user I/O and up to 80 LVDS channels that aggregate parallel ADC outputs at hundreds of MSPS. The 1,669,248 bits of TriMatrix embedded memory absorb pre-trigger sample buffering, while 12 PLLs and 4 DLLs derive multiple independent sample clocks for time-interleaved ADC arrays. With 18,460 logic elements the device can run digital down-conversion, FIR filtering, and packet framing inline, offloading the host processor. Industrial temperature grade and abundant I/O simplify routing on multi-board digitizers.
Recommended
Telecommunication Line Card / Backplane
Stratix devices are widely deployed in telecom line cards and backplane bridging, where the EP1S20F780I6N's combination of 586 I/O, 80 LVDS pairs, and 1.5 V core makes it suitable for Switch-Fabric bridging, UTOPIA / POS-PHY interfaces, and SERDES-side framing glue. The 1,669,248-bit embedded memory holds packet descriptors and small lookup tables without external SSRAM. Industrial temperature support (-40 to +85 C) and the mature Quartus II toolchain keep legacy line-card platforms supportable. The 780-FBGA footprint allows dense routing on standard telecom backplane PCBs.
Recommended
Video Broadcast Infrastructure
Broadcast video routers and format converters rely on FPGA parallelism to handle uncompressed SDI, DVB-ASI, and HD-SDI streams. The EP1S20F780I6N delivers 586 I/O at LVDS/LVTTL rates suitable for multiple parallel video buses, while 6 embedded DSP blocks support real-time scaling and de-interlacing. Its industrial temperature grade supports equipment-room and outdoor head-end installations. Designers pair it with serializer/deserializer companion parts to extend reach over coax or fiber, leveraging Quartus II IP cores for SDI framer/deframer logic.
Recommended
Industrial Machine Vision and Control
Machine-vision controllers use FPGA parallelism to aggregate data from Camera-Link, GigE Vision, or LVDS-based image sensors and run pipelined image-processing algorithms. The EP1S20F780I6N provides 586 I/O for multi-camera head interfaces plus 18,460 logic elements for Sobel filtering, FFT, and histogram pipelines. Industrial temperature grade and the 780-FBGA footprint let designers place the FPGA close to high-speed image sensors on the same PCB. Quartus II SOPC Builder allows integration of a Nios-II soft-core for higher-level camera management.
Recommended
Legacy Defense / Aerospace DSP Backplane
Defense radar and electronic-warfare subsystems built in the 2000s deployed Stratix FPGAs as DSP co-processors, and the EP1S20F780I6N remains an active retrofit part on those platforms. Its 6 DSP blocks provide hundreds of 18x18 multipliers for FFT, FIR, and pulse-compression kernels; the 1.5 V core and 586 I/O support legacy VME/VXS backplane interfaces. Industrial temperature grade accommodates ground-mobile and sheltered-aerospace installations. The 780-BBGA FCBGA footprint matches existing card designs, allowing drop-in replacement during sustainment overhauls.
Recommended
ASIC Prototyping and Emulation
The EP1S20F780I6N is also used as a building block in multi-FPGA ASIC prototyping platforms. Its 18,460 logic elements can map a portion of an ASIC RTL, while 586 user I/O create the high-fanout channels that stitch adjacent FPGAs in the prototyping array. The 1,669,248-bit embedded memory emulates SRAM blocks of the target ASIC. Quartus II provides timing-driven place-and-route, and developers can partition an ASIC across several EP1S20F780 boards connected through 780-FBGA high-speed headers for early software bring-up.
Recommended
Recommended Products Summary
Engineering reference data for EP1S20F780I6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S20F780I5N | EP1S20F780I6 | EP1S20F780C6N | EP1S20F780C7N | EP1S20F780C5N |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 780-BBGA, FCBGA | 780-BBGA, FCBGA (same) | 780-BBGA, FCBGA (same) | 780-BBGA, FCBGA (same) | 780-BBGA, FCBGA (same) | 780-BBGA, FCBGA (same) |
| Logic Elements | 18460 | 18460 | 18460 | 18460 | 18460 | 18460 |
| Speed Grade | -6 | -5 (faster) | -6 (same) | -6 (same) | -7 (slower) | -5 (faster) |
| Operating Temperature | -40 to +85 C (Industrial) | -40 to +85 C (Industrial) | -40 to +85 C (Industrial) | 0 to +70 C (Commercial) | 0 to +70 C (Commercial) | 0 to +70 C (Commercial) |
| Lead-Free / Pb-Free | Yes (N suffix) | Yes (N suffix) | No (leaded balls) | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) |
| User I/O Count | 586 | 586 | 586 | 586 | 586 | 586 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Lifecycle | Last time buy | Last time buy | Last time buy | Last time buy | Last time buy | Last time buy |
Key Differentiators
- Faster speed grade -5 upgrade path within the same die (vs EP1S20F780I6)
- Lead-free Pb-free finish compliance (vs EP1S20F780I6)
- Industrial temperature range vs commercial siblings (vs EP1S20F780C6N)
- High I/O count 586 plus 80 LVDS pairs (vs EP1S20F484I6N (484-ball sibling))
Design Notes
The 780-BBGA FCBGA package uses a 1.0 mm ball pitch and requires a multi-layer PCB with via-in-pad or microvia technology to escape the inner balls. Designers should follow the Altera Stratix Hardware Reference Manual land-pattern dimensions, including a 0.6 mm pad diameter and 1.0 mm pitch. Power decoupling requires at least eight 0.1 uF ceramic capacitors placed immediately under or beside the BGA, plus bulk 47-100 uF tantalum or polymer capacitors on each VCCINT and VCCIO plane.
Although the EP1S20F780I6N is a 1.5 V device and dissipates less than its 3.3 V predecessors, sustained workloads on the 6 DSP blocks plus 80 LVDS channels can drive junction temperature into the high 70s C without airflow. The 780-FBGA thermal pad must be soldered to a continuous copper pour on the top layer connected to an internal ground plane through a thermal via array (0.3 mm vias on 1.0 mm grid). For sealed enclosures, derate by 25% above ambient or use 1-2 m/s forced airflow.
Configuration mode pins MSEL[2:0] must be tied to the correct logic levels for the chosen configuration scheme (AS, AP, PS, JTAG). A common pitfall is leaving MSEL floating, which prevents the device from reliably entering user mode. Also, when migrating from the EP1S20F780I6 to the EP1S20F780I6N (lead-free balls), ensure the PCB is rated for the higher reflow peak temperature (245 C vs 220 C for leaded) - otherwise the BGA will not fully collapse and joint reliability will be compromised.
LVDS channels on the Stratix EP1S20F780I6N require matched 100 ohm differential traces and external 100 ohm termination across the receiver pair. The Stratix Device Handbook specifies a maximum LVDS data rate of 840 Mbps per channel; running faster causes signal-integrity failures. Keep LVDS pairs within the same routing layer and avoid layer transitions on a single differential pair. Series AC-coupling capacitors on LVDS inputs must be 100 nF and placed near the receiver.
Compliance Information
The EP1S20F780I6N carries the 'N' suffix indicating lead-free ball finish per legacy Altera naming. RoHS, REACH, halogen-free, and conflict-mineral status were not explicitly stated in the verified web data; these are marked 'unknown' rather than assumed.
