EP2SGX30DF780C6 - Stratix II GX FPGA 33.8K LEs | Altera
MPN: EP2SGX30DF780C6 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $168.5 | $1,685.00 |
| 100 | $152.75 | $15,275.00 |
| 250 | $142 | $35,500.00 |
| 500 | $132.5 | $66,250.00 |
EP2SGX30DF780C6 Overview
A field-programmable gate array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable routing, and dedicated hard IP such as block RAM, DSP blocks and (in this family) multi-gigabit transceivers. FPGAs sit at the top of the programmable-logic hierarchy - alongside CPLDs and structured ASICs - and are widely used to prototype, bridge, or pre-produce digital systems that require high I/O counts, parallel processing, or fast serial links. The Stratix II GX family extends that capability with up to 6.375 Gbps transceivers, hard PCI Express and other protocol IP, making the family a bridge between generic FPGAs and structured ASSPs.
Key features of the EP2SGX30DF780C6 include 1,694 LABs/CLBs (per Mouser listing for the C4N sibling), 33,880 logic elements, dedicated 18-bit x 18-bit multiplier blocks, and Stratix II adaptive logic modules (ALMs) that pack two 4-input LUTs into a single 7-input equivalent. The device supports both 1.2V core and 1.5V/1.8V/2.5V/3.3V selectable I/O standards through programmable I/O banks, and it integrates multi-gigabit transceivers (MGTs) that handle protocols such as Serial RapidIO, XAUI, PCIe and custom serial interfaces up to 6.375 Gbps.
The device is fabricated in a 90 nm process with a 1.2 V core supply, leveraging Altera's adaptive logic module architecture to achieve high logic density at lower power per LE than the original Stratix. Embedded hard IP (MGTs, memory controllers, DSP blocks) frees programmable fabric for application logic, so the part is often used to implement protocol bridging, baseband processing, and high-speed serial aggregation.
Typical applications include high-speed serial interface aggregation (XAUI, PCIe, Serial RapidIO), telecom baseband and channel-card designs, military and aerospace signal processing, broadcast video processing, and ASIC prototyping. The 780-pin FBGA package supports 361 user I/Os with 8 Gbps-class serial links, making the device attractive for backplane and line-card designs that need many LVDS pairs plus multi-gigabit serial.
When designing with the EP2SGX30DF780C6, plan power sequencing on the 1.2 V core rail, observe Stratix II GX decoupling and PCB layout guidelines from the family handbook, and verify transceiver reference-clock and PCB stack-up requirements against the device's high-speed channel budget. Designers should also confirm Quartus II support for the exact speed grade and pin-out revision before tape-out.
Drop-in alternatives for EP2SGX30DF780C6 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2SGX30DF780C6 (same form factor and footprint) — differing in Operating Temperature, Package, Speed Grade, RoHS Status, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2SGX30DF780C5N
✅ Drop-In✓ In Stock
$1050 / Unit
View Datasheet →EP2SGX30DF780C5
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$384.62 / Unit
View Datasheet →EP2SGX30DF780C4N
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$171 / Unit
View Datasheet →EP2SGX30DF780C4
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$112 / Unit
View Datasheet →EP2SGX30DF780C3N
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$95.5 / Unit
View Datasheet →EP2SGX30DF780C6 Maximum Ratings & Electrical Characteristics
| Family | Stratix II GX |
| Series | Stratix II GX |
| Logic Elements (LEs) | 33,880 |
| Total Memory Bits | 1,369,728 |
| Number of Memory Blocks | 33,880 |
| Number of LABs/CLBs | 1,694 |
| Number of I/Os | 361 |
| Voltage - Supply | 1.2 V core |
| Mounting Type | Surface Mount |
| Operating Temperature | 0C to +85C (commercial, C6 speed grade) |
| Package / Case | 780-BBGA, FCBGA |
| Package Type | 780-pin FineLine BGA |
| Speed Grade | 6 (commercial) |
| Process Technology | 90 nm CMOS |
| Multi-Gigabit Transceivers | Embedded MGTs (up to 6.375 Gbps) |
| RoHS Status | Compliant (lead-free FBGA) |
EP2SGX30DF780C6 780-pin fineline bga Pin Configuration Guide
Pin configuration for EP2SGX30DF780C6 (780-pin fineline bga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2SGX30DF780C6.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2SGX30DF780C6 is suitable for 6 applications: High-Speed Serial Backplane Aggregation, Telecom Baseband and Channel Cards, ASIC Prototyping and Pre-Silicon Validation, Military and Aerospace Signal Processing, Broadcast Video Processing and Routing, Industrial Control and High-Speed Data Acquisition.
High-Speed Serial Backplane Aggregation
The EP2SGX30DF780C6 fits backplane aggregation designs because its embedded multi-gigabit transceivers deliver up to 6.375 Gbps per channel, while 361 user I/Os support 36+ LVDS pairs for parallel sideband signaling. With 33,880 logic elements and 1.37 Mbits of block RAM, the part can implement XAUI, Serial RapidIO and custom aggregation protocols with on-chip packet buffers, eliminating an external PHY. Engineers typically drop the device onto a 780-pin FineLine BGA line card and route two or more transceiver channels to the backplane connector with 100-ohm differential pairs; the C6 speed grade is the highest commercial tier, so timing closure on the slowest path is reliable at 0C-85C. The trade-off versus newer families is obsolescence risk; the trade-off versus discrete PHY + ASSP is one-chip BOM consolidation and lower system jitter.
Recommended
Telecom Baseband and Channel Cards
Telecom baseband line cards use the EP2SGX30DF780C6 to implement channel coding, framing and protocol bridging where 6 Gbps-class transceivers interface directly to SFP+/XFP optical modules. The 1.37 Mbit of distributed block RAM supports 200+ entry lookup tables for forward-error-correction and 802.3 MAC address filtering, while 33,880 logic elements handle layer-2 switching and traffic shaping without external TCAM. Designers typically instantiate two transceiver channels for redundancy and reserve the remaining MGTs for inter-card serial links on the backplane. The 780-FBGA package has a thermal resistance suitable for forced-air cooled line cards at 8-12W typical load; PCB stack-up must preserve 85-ohm differential impedance for the transceiver channels per Stratix II GX layout guidelines.
Recommended
ASIC Prototyping and Pre-Silicon Validation
ASIC prototyping houses use the EP2SGX30DF780C6 to validate large ASIC designs in silicon before tape-out, mapping arbitrary RTL into 33,880 logic elements plus the device's hard IP for memory and serial I/O. The 1.2V 90 nm Stratix II GX die gives a representative timing profile for many sub-130 nm ASICs, and the Quartus II time-domain multiplexing feature lets engineers partition even larger ASICs across multiple FPGAs with pin-compatible transceivers for chip-to-chip bridges. 361 user I/Os and 33,880 memory blocks cover most ASICs in the 2-5 Mgate range; the C6 speed grade ensures the prototype runs at the ASIC's target clock. Drawbacks versus newer emulation platforms are slower compile time and 90 nm static power, both acceptable for verification throughput.
Recommended
Military and Aerospace Signal Processing
Defense and aerospace programs qualify the EP2SGX30DF780C6 for embedded signal-processing subsystems such as radar digitizers, electronic-warfare receivers and software-defined radio front-ends. The 780-pin FineLine BGA is ruggedized for vibration and thermal cycling, and Altera's military-grade screening flow produces the EP2SGX30DF780I6 variant for -40C to +100C operation. Embedded transceivers drive serial fibre to remote antennas and backplanes, while the FPGA fabric implements FFTs, channelizers and pulse compression using on-chip block RAM as coefficient and sample stores. Engineers typically lock the design to C6 commercial speed grade for cost-sensitive programs and step up to I6 industrial for avionics.
Recommended
Broadcast Video Processing and Routing
Broadcast studios and outside-broadcast vehicles deploy the EP2SGX30DF780C6 as a video router, frame synchronizer and standards converter where its 361 user I/Os accept parallel SDI/HD-SDI banks and its transceivers carry 3G-SDI over fibre. The 1.37 Mbits of block RAM buffer multiple video frames for de-interlacing and scaling, and the 33,880 logic elements implement real-time overlay, chroma key and 10-bit processing pipelines. Compared to ASSP video processors, the FPGA approach gives broadcasters one device that can be re-flashed for SD/HD/3G/4K workflows; the trade-off is higher unit cost, which is acceptable in low-volume broadcast infrastructure. The C6 speed grade provides the timing margin needed for 148.5 MHz pixel clocks at 3G-SDI rates.
Recommended
Industrial Control and High-Speed Data Acquisition
Industrial data-acquisition systems use the EP2SGX30DF780C6 to aggregate hundreds of analog/digital channels where its 361 user I/Os accept parallel LVDS data from multi-channel ADCs and its embedded transceivers backhaul the digitized streams over fibre. The on-chip DSP blocks and 33,880 logic elements implement real-time decimation, channel calibration and trigger logic, while the 1.37 Mbits of block RAM buffer multi-megasample records for snapshot capture. Engineers select C6 commercial speed grade for factory-floor environments where 0C-85C range is adequate and choose I6 industrial for outdoor cabinets. The 780-FBGA package is mounted on a controlled-impedance PCB with split power planes for the 1.2V core and I/O rails per Altera's Stratix II GX decoupling guide.
Recommended
Recommended Products Summary
Engineering reference data for EP2SGX30DF780C6 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2SGX30DF780C5N | EP2SGX30DF780C5 | EP2SGX30DF780C4N | EP2SGX30DF780C4 | EP2SGX30DF780C3N |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 780-FBGA (DF780) | 780-FBGA (DF780) - same | 780-FBGA (DF780) - same | 780-FBGA (DF780) - same | 780-FBGA (DF780) - same | 780-FBGA (DF780) - same |
| Logic Elements | 33,880 | 33,880 | 33,880 | 33,880 | 33,880 | 33,880 |
| Total Memory Bits | 1,369,728 | 1,369,728 | 1,369,728 | 1,369,728 | 1,369,728 | 1,369,728 |
| Speed Grade | C6 (commercial) | C5N (slower by ~1 grade) | C5 (slower) | C4N (slower) | C4 (slower) | C3N (slowest) |
| Number of I/Os | 361 | 361 | 361 | 361 | 361 | 361 |
| LABs/CLBs | 1,694 | 1,694 | 1,694 | 1,694 | 1,694 | 1,694 |
| Multi-Gigabit Transceivers | Embedded MGTs to 6.375 Gbps | Embedded MGTs to 6.375 Gbps | Embedded MGTs to 6.375 Gbps | Embedded MGTs to 6.375 Gbps | Embedded MGTs to 6.375 Gbps | Embedded MGTs to 6.375 Gbps |
| Operating Temperature | 0C to +85C (C6 commercial) | 0C to +85C (C5N) | 0C to +85C (C5) | 0C to +85C (C4N) | 0C to +85C (C4) | 0C to +85C (C3N) |
| RoHS / Lead-Free | Lead-free FBGA | Lead-free (N suffix) | Lead-free FBGA | Lead-free (N suffix) | Lead-free FBGA | Lead-free (N suffix) |
Key Differentiators
- Highest commercial speed grade in the 780-pin Stratix II GX family (vs EP2SGX30DF780C5N)
- Same package footprint as the lower-density EP2S30/EP2S15/EP2S60 780-FBGA members (vs EP2S60F780C5 (Stratix II, no transceivers))
- Drop-in compatible with the entire Stratix II GX 780-pin speed-grade matrix (vs EP2SGX30CF780C6 (different 780-pin package variant))
Design Notes
Estimated: at typical 8-12W core power and the 780-FBGA's thermal resistance, the EP2SGX30DF780C6 requires forced-air cooling or a heat-spreader for commercial-grade operation above 70C ambient. Place at least eight thermal vias under the package's center pad to a dedicated inner copper plane to keep junction temperature below 100C. Designers should consult Stratix II GX handbook SII51002 for the recommended thermal-management reference design.
Route the embedded multi-gigabit transceivers (MGTs) as 100-ohm differential pairs on the top microstrip or stripline layer, with continuous reference plane and AC-coupling capacitors placed within 200 mil of the transmitter balls. Maintain at least 4W/4S spacing between MGT pairs and other signals to keep crosstalk below the Stratix II GX mask; reference the Altera PCB layout guidelines in Stratix II GX handbook chapter 7. The 780-FBGA ball pitch is 1.0 mm, so 4 mil traces between balls require 6+ layer stack-up with HDI vias.
Do not assume the EP2SGX30DF780C6 speed grade implies 1.2V-only operation; the device also needs 2.5V and 3.3V auxiliary rails for I/O and PLLs, plus proper power sequencing per the Stratix II GX handbook. Avoid reusing a Stratix IV or Cyclone series pin-out - the EP2SGX30DF780C6 is in the 'DF780' FineLine BGA package, not the 'FF' or 'UB' packages used by newer families. Engineers migrating from non-'N' to 'N' ordering codes must re-verify RoHS paperwork with contract manufacturers.
Use a 4-layer PCB stack-up with continuous ground reference under MGT channels and 50-ohm controlled-impedance routing for single-ended I/O. Place decoupling capacitors as close as possible to every power pin: 0.1uF + 10uF per rail per package corner, plus 1uF bulk on the 1.2V core. Reference the Stratix II GX handbook pin connection guidelines for the recommended capacitor values and placements per power pin group.
Compliance Information
RoHS and lead-free confirmed per Altera (now Intel FPGA) product documentation for the FBGA N-suffix ordering codes. Halogen-free and conflict-minerals declarations are not explicitly published for this obsolete part - check Intel FPGA product content declarations for any post-2010 update.
