Altera

EP2AGZ350FH29I3N - Arria II GZ FPGA, 350K LE, 780-FCBGA | Intel

MPN: EP2AGZ350FH29I3N ✓ Active

In Stock Ships in 1-3 business days

0.87 V to 0.93 V Vdss 780-BBGA, FCBGA Package 21,270,528 bits Memory

From $3550 USD / Unit

MOQ: 1 |

Price updated: 2026-09-08

Volume Pricing

Qty	Unit Price	Extended
1	$4850	$4,850.00
10	$4550	$45,500.00
100	$4125	$412,500.00
500	$3850	$1,925,000.00
1,000	$3550	$3,550,000.00

ℹ️ All prices are in USD

View Datasheet (PDF) View Alternatives

Quantity

EP2AGZ350FH29I3N Overview

The Intel (formerly Altera) EP2AGZ350FH29I3N is a high-density Arria II GZ Field-Programmable Gate Array (FPGA) featuring 348,500 logic elements, 21,270,528 bits of embedded memory, and 281 user I/O pins, fabricated on a 40 nm TSMC process node. Housed in a 780-ball FineLine BGA (FCBGA) package, this device integrates up to 24 transceivers supporting data rates suitable for high-speed serial interfaces. The part operates across an industrial temperature range of -40C to +100C (TJ) with a core voltage of 0.87 V to 0.93 V, delivering a balance of performance and power efficiency for mid- to high-end digital designs.

An FPGA (Field-Programmable Gate Array) is a type of integrated circuit whose logic function is defined by the customer after manufacturing, rather than at the wafer fab. FPGAs sit at the top of the programmable logic hierarchy, above CPLDs, and below fixed-function ASICs in cost-per-volume but above them in design flexibility. The Arria II GZ family is Intel's mid-range transceiver-equipped FPGA family, positioned between the lower-power Cyclone families and the high-end Stratix families, optimized for applications requiring integrated transceivers, DSP blocks, and significant on-chip memory.

Key features include 13,940 Logic Array Blocks (LABs), embedded 18x18 multipliers supporting digital signal processing, multiple PLLs for clock management, and hard PCIe Gen1/Gen2 IP blocks. The 24 transceiver channels support multiple gigabit-per-second data rates, enabling protocols such as Serial RapidIO, Gigabit Ethernet, and CPRI. The 780-ball FCBGA package is suitable for high-speed designs where signal integrity demands controlled-impedance vias and short bond-wire lengths.

Typical applications include wireless baseband processing, military radar signal processing, high-performance image processing, and high-speed serial protocol bridging. The transceiver channels and DSP blocks make the EP2AGZ350FH29I3N particularly well suited for protocols like OBSAI, CPRI, and Serial RapidIO used in telecom infrastructure.

When designing with this device, ensure a 12-layer or more PCB with continuous GND planes for transceiver signal integrity. The 780-ball FCBGA requires via-in-pad or microvia technology for fanout. Quartus II design software is required for synthesis, place-and-route, and timing closure.

This page synthesizes current distributor inventory, verified pricing, Arria II GZ family drop-in alternatives, and design notes specific to the FH29 package not found on standard distributor product pages.

Drop-in alternatives for EP2AGZ350FH29I3N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP2AGZ350FH29I3N (same form factor and footprint) — differing in Package, Operating Temperature, Speed Grade, RoHS Status, Logic Elements (LE).

EP2AGZ300FH29I3N

Intel

Package: 780-FCBGA (H-BGA, 29x29 mm)

Operating Temperature: -40C to +100C (Industrial)

Speed Grade: I3