EP3SE80F780I3 - 80K Logic Elements FPGA | Altera | Digital Systems
MPN: EP3SE80F780I3 ✓ Active| Qty | Unit Price | Extended |
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| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
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| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
EP3SE80F780I3 Overview
A field-programmable gate array is a programmable semiconductor containing configurable logic, memory resources, interconnect, and input/output blocks. FPGA devices sit within the broader hierarchy of programmable logic devices, digital integrated circuits, and semiconductors. Unlike a fixed-function application-specific integrated circuit, an FPGA can be configured after manufacturing, allowing designers to implement changing digital functions, interfaces, and data-processing pipelines without fabricating a new silicon device.
The headline capacity of EP3SE80F780I3 is its 80,000 logic elements, supported by 6,843,392 memory bits and 488 user I/O pins. The large I/O count is significant for parallel data acquisition, communications equipment, industrial controllers, and test systems that need many external connections. The 780-ball FCBGA package provides a high-density surface-mount solution, but it also requires controlled PCB assembly, exact land-pattern compliance, and careful signal-integrity planning.
The reported 800 MHz internal frequency indicates substantial digital processing capability, although the achievable system clock depends on the selected configuration, logic implementation, routing, and timing constraints. The 0.9 V supply voltage is consistent with a low-voltage, high-performance FPGA architecture. Designers must use the manufacturer power guidelines and perform board-level decoupling, distribution, and thermal analysis rather than assuming that the stated internal frequency can be sustained in every design.
Typical applications include high-performance digital signal processing, communications infrastructure, industrial automation, video and imaging interfaces, test and measurement equipment, and reconfigurable computing. Its 488 user I/Os make it particularly relevant when a design must bridge many buses, converters, memories, or control interfaces. The 80,000 logic elements and reported 6,843,392 memory bits provide a useful resource baseline for partitioning datapaths, control logic, packet processing, and protocol bridges.
A key design trade-off is package and power complexity. The 780-ball FCBGA footprint may create routing constraints, assembly yield concerns, and demanding power-delivery requirements. Engineers should validate pin assignments, configuration circuitry, clock distribution, decoupling, and thermal performance against the manufacturer documentation before beginning PCB layout. Secondary sources report an FBGA-1152 designation for the same search result, which conflicts with the primary distributor listing of 780-BBGA/FCBGA; the package designation must therefore be resolved from the official ordering information and package drawing.
This page combines verified distributor identification, package and capacity details, application context, and explicit uncertainty markers. It does not infer missing timing, transceiver, voltage, or compliance specifications. Engineers can use the comparison and design sections to organize validation work, while the official manufacturer datasheet remains the controlling source for pinout, electrical limits, timing, configuration, and assembly requirements.
Drop-in alternatives for EP3SE80F780I3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SE80F780I3 (same form factor and footprint) — differing in Package, Operating Temperature, Logic Elements, Process Technology, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3SE50F780I3
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1245.75 / Unit
View Datasheet →EP3SE110F780I3
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1395 / Unit
View Datasheet →EP3SE80F780C3
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$2050 / Unit
View Datasheet →EP3SE80F780I2
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP3SE80F780I4
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1620 / Unit
View Datasheet →EP3SE80F780I3 Maximum Ratings & Electrical Characteristics
| Device Type | Field Programmable Gate Array (FPGA) |
| Family | Stratix III E |
| Logic Elements | 80,000 |
| Memory Bits | 6,843,392 bit |
| User I/O | 488 |
| Package | 780-BBGA, FCBGA |
| Terminal Count | 780 ball |
| Package Code | BGA |
| Package Shape | Square |
| Pitch Of Terminal | 1 mm |
| Internal Frequency | 800 MHz |
| Supply Voltage | 0.9 V |
| Operating Temperature | 0 °C to 85 °C |
| Mounting Type | Surface Mount |
| Configuration Technology | Field programmable logic |
EP3SE80F780I3 square Pin Configuration Guide
Pin configuration for EP3SE80F780I3 (square package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SE80F780I3.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SE80F780I3 is suitable for 6 applications: High-Performance Digital Signal Processing, Communications Infrastructure Equipment, Industrial Automation and Control, Video and Imaging Interfaces, Test and Measurement Equipment, Reconfigurable Computing and Protocol Bridging.
High-Performance Digital Signal Processing
EP3SE80F780I3 fits high-performance digital signal processing where configurable parallel logic and substantial memory resources are required. The verified device listing reports 80,000 logic elements and 6,843,392 memory bits, giving designers a resource baseline for filters, FFT stages, encoders, decoders, and real-time control logic. Its reported 800 MHz internal frequency may support demanding datapaths, but it is not a guaranteed system-clock target. Implementations should be timed with the selected configuration and the manufacturer timing model. The 780-BBGA FCBGA package also supports dense interconnect between processing blocks, memory interfaces, and high-speed I/O. Use careful pipelining and resource sharing to meet timing and power goals.
Recommended
Communications Infrastructure Equipment
EP3SE80F780I3 can be used in communications infrastructure equipment that needs programmable packet processing, protocol conversion, traffic management, and multiple external interfaces. The reported 488 user I/Os are useful for aggregating data from network processors, memory devices, optical modules, clocks, and management controllers. The 80,000 logic elements and 6,843,392 memory bits can support parallel queues, framing logic, error handling, and adaptive datapaths. Because the supplied data does not verify transceiver count, lane rate, or I/O standards, designers must consult the official device handbook before selecting this FPGA for a communications interface. Validate signal integrity, reference clocks, and I/O-bank constraints during board planning.
Recommended
Industrial Automation and Control
EP3SE80F780I3 is potentially suitable for industrial automation controllers, motion systems, and high-channel-count data acquisition platforms. The verified 488 user I/Os allow the device to connect many sensors, encoders, motor-control peripherals, digital I/O modules, and communication interfaces. Its programmable architecture enables custom control algorithms, protocol bridges, and deterministic processing without a fixed-function controller. The reported 0°C to 85°C operating range is relevant for many controlled industrial environments, but the supplied data does not establish environmental qualification or compliance. Confirm the exact temperature grade, I/O voltage support, package drawing, and lifecycle status. Use isolated interfaces and robust power sequencing where factory electrical transients are possible.
Recommended
Video and Imaging Interfaces
EP3SE80F780I3 can support video and imaging systems that require pixel processing, frame buffering, format conversion, timing generation, and multiple camera or display interfaces. The reported 80,000 logic elements and 6,843,392 memory bits provide resources for line buffers, color-space conversion, filtering, and synchronization logic. The 488 user I/Os may accommodate parallel image sensors, serializers, memory buses, and control channels. The 800 MHz internal-frequency value is a secondary specification and should not be treated as a guaranteed pixel-clock rate. Confirm supported I/O standards, memory interfaces, clock networks, and electrical timing in the manufacturer documentation. PCB design should control impedance, clock jitter, and simultaneous-switching noise.
Recommended
Test and Measurement Equipment
EP3SE80F780I3 is a plausible programmable platform for test and measurement equipment requiring parallel acquisition, waveform analysis, protocol emulation, and flexible trigger logic. The reported 488 user I/Os can connect analog-to-digital converters, digital-to-analog converters, memories, clocks, and instrument buses. The 80,000 logic elements and 6,843,392 memory bits can hold capture pipelines, statistical processing, and real-time measurement functions. The reported 800 MHz internal frequency should be validated through timing analysis and the specific instrument clocking scheme. High-density 780-ball FCBGA construction requires controlled impedance, low-noise power distribution, and a verified footprint. Include calibration, reference-clock, and deterministic-latency planning in the architecture review.
Recommended
Reconfigurable Computing and Protocol Bridging
EP3SE80F780I3 can serve as a reconfigurable computing engine or protocol bridge when a design must connect mismatched buses, processing units, memory systems, or custom peripherals. The reported 80,000 logic elements and 6,843,392 memory bits support adaptable datapaths, buffering, arbitration, and control functions. Its 488 user I/Os are useful when many independent interfaces must coexist. The programmable architecture can also reduce hardware revision risk by allowing late-stage logic changes. The supplied data does not specify the number or performance of transceivers, PLLs, memory controllers, or supported I/O standards, so these capabilities must be confirmed from the official datasheet. Use versioned configuration management and board-level bring-up procedures for production deployments.
Recommended
Recommended Products Summary
Engineering reference data for EP3SE80F780I3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SE50F780I3 | EP3SE110F780I3 | EP3SE80F780C3 | EP3SE80F780I2 |
|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera |
| Package | 780-BBGA, FCBGA | 780-BBGA, FCBGA | 780-BBGA, FCBGA | 780-BBGA, FCBGA | 780-BBGA, FCBGA |
| Reported Logic Elements | 80,000 | 50,000 | 110,000 | 80,000 | 80,000 |
| Temperature or Speed Suffix | I3 | I3 | I3 | C3 | I2 |
| Verified Drop-in Status | Target MPN | Not validated; capacity differs | Not validated; capacity differs | Not validated; speed suffix differs | Not validated; speed suffix differs |
Key Differentiators
- Higher reported logic capacity than EP3SE50F780I3 (vs EP3SE50F780I3)
- Lower reported capacity than EP3SE110F780I3 (vs EP3SE110F780I3)
- I3 temperature and speed suffix (vs EP3SE80F780C3)
- Large reported user-I/O count (vs EP3SE80F1152I3)
Design Notes
Use the official Altera power-estimation flow for EP3SE80F780I3 because the verified data reports only a 0.9 V supply and does not provide complete rail, current, sequencing, or tolerance specifications. Place local decoupling close to the package supply balls, use a low-impedance power plane, and separate noisy interfaces from sensitive reference-clock and configuration networks. The 800 MHz internal-frequency value is a secondary specification, so do not size the power supply from that number alone. Include configuration, PLL, I/O, and memory-interface loads in the worst-case estimate. Review startup sequencing and inrush behavior with the manufacturer reference design before PCB fabrication.
The supplied data reports a 0°C to 85°C operating range but does not provide junction-to-ambient thermal resistance, power dissipation, or derating curves. Estimate total FPGA power from the synthesized design, including logic, memory, clock, I/O, and static losses, then compare the resulting junction temperature with the applicable manufacturer limit. Use a conservative thermal model for the 780-ball FCBGA package and account for board copper, airflow, nearby heat sources, and assembly conditions. Avoid relying on the package name or the 80,000 logic elements as a thermal proxy. Thermal analysis should be repeated after place-and-route and after the final clock and I/O configuration is known.
Resolve the package conflict before layout: the primary DigiKey result identifies 780-BBGA FCBGA, while a secondary result labels the part FBGA-1152. Obtain the official package drawing, ball map, land pattern, and assembly recommendations for the exact ordering code. Preserve continuous reference and ground planes where allowed, keep high-speed routes short, provide controlled impedance for critical interfaces, and place bypass components adjacent to the associated supply balls. Do not derive a 780-ball pinout from the conflicting secondary text. Record the approved package revision and footprint source in the design documentation to prevent an unreviewed land-pattern change.
The reported 800 MHz internal frequency makes signal integrity a first-order concern for clocks, memory interfaces, and high-speed parallel I/O. Confirm supported I/O standards, slew rates, termination, and bank constraints from the official datasheet rather than assuming that every package pin supports every interface. Simulate or measure critical nets with the final stack-up, connector, via, and load configuration. Keep reference-clock routing away from fast switching outputs, maintain return-path continuity, and budget jitter and skew at the receiving device. Use the FPGA timing analyzer with the selected configuration and I/O assignments to establish the actual operating margin.
Do not treat the secondary 800 MHz, 0.9 V, 0°C to 85°C, and FBGA-1152 values as a complete or internally consistent electrical specification. Confirm all values against the official Altera/Intel documentation and the exact MPN ordering table. Before schematic release, verify the pinout, configuration connections, clock inputs, I/O-bank voltage rules, decoupling, programming interface, reset behavior, and power-up sequence. Keep the configuration bitstream under revision control and plan a board bring-up procedure covering JTAG, clock, configuration, memory, and external I/O. Any substitute must demonstrate package and pin compatibility, not merely similar logic capacity.
Compliance Information
The supplied web data does not verify RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status. The I3 temperature suffix is reported as an ordering designation, not proof of automotive qualification.
