EP1S80F1020C7GA - 80K LE Stratix FPGA, 1020-BGA, -40C | Intel
MPN: EP1S80F1020C7GA ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1725 | $17,250.00 |
| 100 | $1560 | $156,000.00 |
| 500 | $1425 | $712,500.00 |
| 1,000 | $1295 | $1,295,000.00 |
EP1S80F1020C7GA Overview
A Field Programmable Gate Array (FPGA) is a programmable logic device containing configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP blocks such as multipliers, memory, and transceivers. FPGAs sit in the broader taxonomy of programmable logic devices (PLD) within the semiconductor hierarchy, and Stratix devices specifically are positioned as high-end, ASIC-prototyping and DSP-optimized parts.
Key features of the EP1S80F1020C7GA include 79,040 logic elements, 6,747,840 total memory bits organized in TriMatrix architecture, 22 DSP blocks, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The 1020-BGA package supports commercial/industrial-grade temperature operation. The C7 speed grade balances performance against power, while the GA suffix typically denotes lead-free, RoHS-compliant packaging.
Architecturally, the Stratix family employs 1.5 V core logic with MultiTrack interconnect for predictable timing closure. Embedded RAM blocks come in three sizes (512 bits, 4 Kbits, 512 Kbits) to optimize storage efficiency, while dedicated 18x18 multipliers enable DSP operations without consuming general-purpose logic.
Typical applications include high-end telecommunications infrastructure (SONET/SDH framer, packet processor), ASIC prototyping, high-performance DSP (radar, medical imaging, software-defined radio), and test & measurement equipment requiring high gate counts and rich I/O.
When designing with this device, pay attention to power distribution - the 1020-BGA requires multiple power rails (VCCINT, VCCIO, VCCA, VCCD_PLL) and substantial decoupling. Thermal management is critical at high utilization; reference Intel AN 358 and the Stratix PowerPlay Early Power Estimator for accurate budgeting.
This page synthesizes distributor stock, parametric alternatives, and practical design notes beyond the manufacturer datasheet, helping engineers shorten sourcing and qualification cycles.
Drop-in alternatives for EP1S80F1020C7GA — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP1S80F1020C7GA (same form factor and footprint) — differing in Operating Temperature, Package, RoHS Status, Speed Grade, PLLs.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1S80F1020C7
✅ Drop-In✓ In Stock
$195 / Unit
View Datasheet →EP1S80F1020C6N
✅ Drop-In✓ In Stock
$110 / Unit
View Datasheet →EP1S80F1020C6
✅ Drop-In✓ In Stock
$1180 / Unit
View Datasheet →EP1S80F1020C5N
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →EP1S80F1020C5
✅ Drop-In✓ In Stock
$745 / Unit
View Datasheet →EP1S60F1020C7
✅ Drop-In✓ In Stock
$1750 / Unit
View Datasheet →EP1S60F1020C7N
✅ Drop-In✓ In Stock
$1580 / Unit
View Datasheet →EP1S80F1020C7GA Maximum Ratings & Electrical Characteristics
| Series | Stratix |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements (LE) | 79,040 |
| Equivalent Gates | 7,427,520 |
| Total RAM Bits | 6,747,840 |
| Number of I/O | 773 (maximum) |
| Number of Logic Elements/Cells | 79,040 |
| DSP Blocks | 22 |
| Speed Grade | C7 |
| Package / Case | 1020-BBGA, FCBGA (33x33 mm) |
| Supplier Device Package | 1020-FBGA |
| Mounting Type | Surface Mount |
| Voltage - Supply (Core) | 1.5 V nominal (Stratix VCCINT) |
| Operating Temperature | -40C to +85C (industrial / commercial extended) |
| RoHS Status | Lead-free / RoHS compliant (GA suffix) |
| MSL Level | 3 (per Stratix BGA typical) |
EP1S80F1020C7GA 1020-fbga Pin Configuration Guide
Pin configuration for EP1S80F1020C7GA (1020-fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S80F1020C7GA.
Refer to the datasheet for full pin configuration.
Typical Applications
EP1S80F1020C7GA is suitable for 6 applications: High-End Telecommunications Infrastructure, ASIC Prototyping and Verification, High-Performance DSP Systems, Test and Measurement Equipment, Industrial Imaging and Machine Vision, Military and Aerospace Signal Processing.
High-End Telecommunications Infrastructure
The EP1S80F1020C7GA's 79,040 logic elements and 22 DSP blocks make it well suited for SONET/SDH framers, packet processors, and multi-gigabit baseband units. Its 773 user I/Os accommodate wide parallel backplane buses (Utopia, POS-PHY, SPI-4.2) common in central-office line cards, while the TriMatrix memory (6.7 Mbits) provides on-chip buffering for cell/packet queues without external SRAM. The Stratix architecture supports high-speed LVDS and HSTL I/O, enabling direct connection to optical transceivers and SERDES devices. The 1.5 V core reduces power versus earlier 2.5 V FPGAs, important for densely-populated ATCA/AdvancedTCA shelves.
Recommended
ASIC Prototyping and Verification
Engineers use the EP1S80F1020C7GA as an ASIC prototype vehicle because its 7.4 M equivalent gates approximate mid-range ASIC designs while preserving pin-compatible FPGA prototyping flexibility. The 1020-ball BGA provides the high I/O count required for full boundary-scan emulation of ASICs with hundreds of signals, and 22 DSP blocks emulate hard multipliers common in DSP ASICs. Quartus II synthesis and the SOPC Builder environment support incremental compile, allowing multiple engineers to verify partitioned blocks simultaneously. Compared to ASICs, debug turnaround drops from weeks to hours via JTAG readback and SignalTap logic analyzer.
Recommended
High-Performance DSP Systems
The EP1S80F1020C7GA's 22 dedicated DSP blocks (each containing four 18x18 multipliers) deliver up to 88 multipliers operating at hundreds of MHz, ideal for radar, software-defined radio, and medical imaging front-ends. TriMatrix memory provides three block sizes (512 bits, 4 Kbits, 512 Kbits) allowing efficient line-buffer and coefficient storage for FIR/FFT pipelines. Combined with the LVDS I/O capability, the device can interface directly to high-speed ADCs and DACs used in digital oscilloscopes and spectrum analyzers. Compared with DSP microprocessor alternatives, Stratix delivers 10-50x throughput per watt for fixed-function DSP kernels.
Recommended
Test and Measurement Equipment
The 79,040 logic elements plus 773 I/O let designers implement deep logic-analyzer channels, protocol analyzers, and arbitrary waveform generators in a single chip. Embedded TriMatrix memory stores multi-million-sample capture buffers with deterministic read access, while dedicated DSP blocks accelerate FFT and digital down-conversion in real-time signal analyzers. The 1020-FBGA package supports high pin-count edge-finger connectors used in PXI/PCIe instrumentation modules. Industrial-grade -40C to +85C temperature range (with the I6 industrial speed grade equivalents) suits bench and field-deployed test gear.
Recommended
Industrial Imaging and Machine Vision
Real-time image processing in factory automation benefits from the EP1S80F1020C7GA's DSP blocks (Sobel, Laplacian, FFT preprocessing) and large embedded memory buffers for line-scan image accumulation. The 773 I/Os accept multiple parallel Camera Link or LVDS camera channels without external FPGAs, while the industrial temperature grade supports factory-floor environments. Compared with discrete DSP+FPGA solutions, a single Stratix device cuts board area 50% and reduces BOM cost by consolidating control, pre-processing, and protocol glue logic in one chip.
Recommended
Military and Aerospace Signal Processing
Defense systems (electronic warfare, radar, secure communications) historically relied on Stratix-class FPGAs for their combination of gate count, DSP density, and rugged-package availability. The EP1S80F1020C7GA provides 79,040 LEs and 22 DSP blocks capable of running channelizer and pulse-compression algorithms in a single chip, while its industrial temperature range and BGA package meet the mechanical and thermal requirements of airborne platforms. For new programs requiring legacy code reuse, this part continues to be qualified through standard defense supply chains despite commercial-obsolete status on Intel's portfolio.
Recommended
Recommended Products Summary
Engineering reference data for EP1S80F1020C7GA — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S80F1020C7 | EP1S80F1020C6N | EP1S80F1020C5 | EP1S60F1020C7 |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1020-FBGA (33x33 mm) | 1020-FBGA - same | 1020-FBGA - same | 1020-FBGA - same | 1020-FBGA - same |
| Logic Elements | 79,040 | 79,040 | 79,040 | 79,040 | 57,120 |
| Speed Grade | C7 | C7 | C6 (slower) | C5 (slowest) | C7 |
| Lead-Free / RoHS | Yes (GA suffix) | No (SnPb) | Yes (N suffix) | No (SnPb) | No (SnPb) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- RoHS-compliant lead-free finish (GA suffix) (vs EP1S80F1020C7)
- C7 speed grade offers fast timing closure (vs EP1S80F1020C5)
- Maximum 79,040 LE for full-density designs (vs EP1S60F1020C7)
Design Notes
Estimated: At 50% logic utilization, 50% toggle rate, and 100 MHz operation, the EP1S80F1020C7GA draws approximately 4-6 W from VCCINT (1.5 V) plus 2-3 W distributed across VCCIO banks. Use the Stratix PowerPlay Early Power Estimator (EPE) for accurate budgeting. Place at least 8 bulk 22 uF/4.7 uF ceramic capacitors under the BGA, plus one 0.1 uF decoupling cap per VCC pin pair. Power-rail sequencing: VCCINT must rise before VCCIO; reference AN 358 for sequencing circuit.
The 1020-FBGA at 33x33 mm uses 1.0 mm ball pitch requiring 4-6 layer PCB with microvia stackups (laser-drilled 0.1 mm vias preferred). Escape routing requires via-in-pad or dog-bone fanout to inner signal layers; plan at least 4 routing layers for signals alone, plus 2 dedicated power/ground planes. Match differential pair lengths to within 150 mil for LVDS channels. Exposed die pads require thermal via array to inner copper plane for heat dissipation.
Estimated: theta_JA for 1020-FBGA package with adequate thermal vias is approximately 8-12 C/W. At 6 W total dissipation, junction temperature rise above ambient is 50-70 C, requiring case temperature monitoring and possible forced-air cooling in closed enclosures. Always measure with thermocouple on package top during qualification, and validate against the Stratix Thermal Characterization Report.
Do not configure the device with an MSEL pin setting that mismatches the configuration scheme (AS, AP, PS, FPP, JTAG). Ensure all unused I/O are tri-stated and pulled to a defined level to avoid shoot-through. Always include a CRC-error-checking configuration scheme for safety-critical designs. When migrating designs between Stratix speed grades, re-run TimeQuest timing analysis with the appropriate SDC constraints - the C7, C6, and C5 grades have different timing models.
Compliance Information
GA suffix per Altera/Intel ordering code indicates lead-free ball finish and RoHS compliance. Halogen-free and conflict-minerals status not explicitly stated in available distributor data; set to unknown rather than guess.
