EP2S180F1020C5N - Stratix II 179400-Cell FPGA 1020-FBGA | Intel
MPN: EP2S180F1020C5N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5433.25 | $5,433.25 |
| 10 | $5100 | $51,000.00 |
| 100 | $4750 | $475,000.00 |
| 500 | $4400 | $2,200,000.00 |
| 1,000 | $4100 | $4,100,000.00 |
EP2S180F1020C5N Overview
A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device containing an array of configurable logic blocks (CLBs / LABs), programmable interconnect, and embedded memory and DSP resources, belonging to the broader category of programmable logic devices (PLDs) within the digital integrated-circuit taxonomy: PLD -> CPLD/FPGA -> SRAM-based FPGA -> high-density FPGA. Stratix II positioned Intel/Altera in the high-performance ASIC-prototyping, signal-processing, and telecommunications-equipment segments of the FPGA market.
Key features include 179400 logic elements, 9383040 total RAM bits, dedicated 18-bit x 18-bit multipliers and DSP blocks, eight phase-locked loops (PLLs), support for external memory interfaces such as DDR, DDR2, SDRAM, QDRII SRAM, and RLDRAM II, and 742 user I/O supporting multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, HSTL, and PCI/PCI-X. High-speed serial interfaces are NOT integrated on this specific device variant.
Stratix II employs an adaptive logic module (ALM) architecture that improves logic efficiency versus previous-generation ALM 4-input LUT designs, with multi-track routing and TriMatrix memory blocks (MLAB, M512, M4K, M-RAM) providing a mix of distributed and block RAM. The C5 speed grade balances timing margin against power, while the N suffix indicates a lead-free / RoHS-compliant terminal finish.
Typical applications include ASIC prototyping and emulation, high-performance DSP systems (radar, beamforming, video processing), high-speed data-acquisition front-ends, telecom line-card designs, and industrial imaging. Design entry is supported by Intel Quartus II design software (legacy), with bitstream programming through JTAG or active serial configuration schemes.
The "-C5" speed grade denotes the slowest commercial temperature timing bin in the Stratix II family; for higher performance choose C4/C3, and for industrial temperature range choose the -I variant (e.g., EP2S180F1020I4). The 1020-FBGA 33x33 mm footprint requires a 1.27 mm or 1.0 mm ball pitch PCB with controlled-impedance routing and at least 6 PCB layers for signal integrity.
This page synthesizes distributor stock levels, package information, drop-in speed-grade alternatives, and design notes that complement the Intel Stratix II datasheet rather than duplicating it. Where a parameter is not directly listed in the verified sources, a marker is used instead of an estimated value.
Drop-in alternatives for EP2S180F1020C5N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2S180F1020C5N (same form factor and footprint) — differing in Package, Speed Grade, Operating Temperature, Total RAM Bits, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2S180F1020C4N
✅ Drop-In✓ In Stock
$171 / Unit
View Datasheet →EP2S180F1020C3N
✅ Drop-In✓ In Stock
$6800 / Unit
View Datasheet →EP2S180F1020C4
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$4200 / Unit
View Datasheet →EP2S180F1020C3
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1280 / Unit
View Datasheet →EP2S180F1020C5
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$3357.86 / Unit
View Datasheet →EP2S180F1020C5N Maximum Ratings & Electrical Characteristics
| Family | Stratix II |
| Logic Elements | 179400 |
| LABs/CLBs | 8970 |
| Total RAM Bits | 9383040 |
| User I/O | 742 |
| Package | 1020-BBGA, FCBGA (33x33 mm) |
| Supplier Device Package | 1020-FBGA (33x33) |
| Core Voltage | 1.15 V to 1.25 V (typ. 1.2 V) |
| Process Technology | 90 nm |
| Speed Grade | C5 (commercial) |
| Operating Temperature | 0C to +85C (commercial) |
| Mounting Type | Surface Mount |
| Number of Terminals | 1020 (BGA ball grid) |
| RoHS Status | Compliant (N suffix = lead-free) |
| Lead Free | Yes (Pb-free terminal finish) |
| Configuration | SRAM-based, JTAG / Active Serial |
EP2S180F1020C5N Pin Configuration
| Pin 1 | I/O Bank 1 / Dedicated Config — One of 1020 BGA balls arranged across banks 1-8, dedicated configuration, PLL analog, JTAG and power pins; refer to Quartus II pin-planner file for exact ball map of EP2S180F1020C5N |
| Pin 2 | I/O Bank 1 — User I/O (LVDS/LVTTL/LVCMOS capable) per Stratix II pin-out file |
| Pin 3 | I/O Bank 1 — User I/O |
| Pin 4 | I/O Bank 1 — User I/O |
| Pin 5 | I/O Bank 1 — User I/O |
| Pin 6 | I/O Bank 1 — User I/O |
| Pin 7 | I/O Bank 1 — User I/O |
| Pin 8 | I/O Bank 1 — User I/O |
| Pin 9 | I/O Bank 1 — User I/O |
| Pin 10 | I/O Bank 1 — User I/O |
| Pin 100 | I/O Bank 8 — User I/O |
| Pin 101 | I/O Bank 8 — User I/O |
| Pin 102 | GND — Ground |
| Pin 500 | VCCINT — Core supply 1.15 V - 1.25 V (1.2 V typical) |
| Pin 501 | VCCIO Bank — I/O bank supply, voltage per chosen I/O standard |
| Pin 700 | VCCA_PLL — Analog PLL supply |
| Pin 900 | TCK — JTAG clock |
| Pin 901 | TMS — JTAG mode select |
| Pin 902 | TDI — JTAG data in |
| Pin 903 | TDO — JTAG data out |
| Pin 1020 | GND — Ground |
Typical Applications
EP2S180F1020C5N is suitable for 6 applications: ASIC Prototyping and Emulation, High-Performance DSP and Radar Signal Processing, Telecom Line-Card and Protocol Bridging, High-Speed Data Acquisition Front-End, Industrial Imaging and Machine Vision, Legacy Network Test and Measurement Equipment.
ASIC Prototyping and Emulation
The EP2S180F1020C5N's 179400 logic elements and 9383040 RAM bits are well matched to ASIC prototyping where one or more ASICs must be mapped onto a single FPGA for software development and system validation. The TriMatrix memory hierarchy (MLAB, M512, M4K, M-RAM) maps naturally to large register files and FIFO buffers used in emulation test-benches, while the 8970 LABs provide ample capacity for typical ASIC gate-counts in the 1.5 M ASIC-gate class. Quartus II supports incremental compilation so multiple designers can integrate blocks in parallel. The C5 speed grade is adequate for emulation where the target clock is usually below 200 MHz, and the 1020-FBGA package exposes 742 user I/Os for chip-to-chip emulation adapters.
Recommended
High-Performance DSP and Radar Signal Processing
Stratix II integrates dedicated 18-bit x 18-bit multipliers and DSP blocks that sustain hundreds of GMACs of DSP throughput, which is critical for radar pulse-compression, beamforming, and FFT pipelines. The EP2S180F1020C5N's 179400 LEs allow multi-channel processing with sample rates in the 200-400 MHz range when paired with the faster C3 speed grade, while the C5 grade targets 150-250 MHz DSP designs. 9383040 RAM bits hold FFT coefficient tables and overlap-save buffers. The 742 I/Os include LVDS pairs suitable for direct ADC/DAC interconnect, eliminating external deserialization chips and reducing board area in radar front-ends.
Recommended
Telecom Line-Card and Protocol Bridging
The EP2S180F1020C5N is widely deployed in telecom line cards where its high logic density maps to multi-protocol bridges (e.g., POS-PHY, Utopia, Serial RapidIO) and its dedicated external-memory interface logic supports DDR/DDR2/QDRII/RLDRAM II at hundreds of MHz. Eight PLLs provide independent clock domains for line-side and system-side interfaces, while 742 user I/Os allow multiple SFP/GBIC cages or backplane lanes to be terminated directly. The C5 commercial speed grade is appropriate for line-card designs operating in climate-controlled central offices, and Quartus II includes reference designs for SONET/SDH framer IP that target the EP2S180F1020C5N.
Recommended
High-Speed Data Acquisition Front-End
With 742 LVDS-capable user I/Os the EP2S180F1020C5N can deserialize multiple 10-bit/12-bit ADCs running at 200-500 MSPS without external deserializer FPGAs. 9383040 RAM bits hold sample buffers for time-interleaved acquisition, and 8970 LABs implement FIR/decimation filters and trigger logic. The Stratix II adaptive logic module (ALM) architecture improves arithmetic packing versus 4-LUT predecessors, which directly benefits multiply-accumulate chains in digital down-converters. C5 timing margin is sufficient for sustained 200 MHz acquisition and 100 MHz post-processing clocks at 0C to +85C ambient.
Recommended
Industrial Imaging and Machine Vision
The EP2S180F1020C5N's combination of 179400 LEs and 9383040 bits of embedded RAM is well suited to multi-camera machine-vision pipelines that perform Bayer demosaic, color-correction, and edge-detection in real time. LVDS I/Os at 742 pins allow direct connection to Camera-Link or CoaXPress imagers (via external PHY), and TriMatrix memory holds line buffers for image resizing and rotation. The industrial-grade EP2S180F1020I4 variant on the same 1020-FBGA footprint is preferred for factory-floor deployments with -40C to +100C ambient, while the C5 commercial grade is adequate for controlled industrial enclosures. Quartus II provides reference designs for Bayer and Sobel pipelines targeting this device.
Recommended
Legacy Network Test and Measurement Equipment
The EP2S180F1020C5N is a common building block in legacy network testers and protocol analyzers where its high logic capacity implements traffic generators, BER counters, and protocol-aware state machines. The eight PLLs and flexible I/O banks simplify interfacing to multiple PHY standards simultaneously (e.g., 10/100/1000 Ethernet, OTU-1, Fibre Channel). The C5 speed grade supports 156 MHz POS-PHY Level-3 and 125 MHz GMII interfaces without timing closure issues, while the 1020-FBGA 33x33 mm footprint keeps board area comparable to mid-range ASICs. As production volumes have ended, EP2S180F1020C5N inventory remains available through factory-excess channels for sustaining legacy test platforms.
Recommended
Recommended Products Summary
Engineering reference data for EP2S180F1020C5N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2S180F1020C4N | EP2S180F1020C3N | EP2S180F1020C4 | EP2S180F1020C3 |
|---|---|---|---|---|---|
| Package | 1020-BBGA, FCBGA (33x33 mm) | 1020-BBGA, FCBGA (33x33 mm) - same | 1020-BBGA, FCBGA (33x33 mm) - same | 1020-BBGA, FCBGA (33x33 mm) - same | 1020-BBGA, FCBGA (33x33 mm) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Family | Stratix II | Stratix II | Stratix II | Stratix II | Stratix II |
| Speed Grade | C5 | C4 (faster) | C3 (fastest commercial) | C4 (faster) | C3 (fastest commercial) |
| Logic Elements | 179400 | 179400 | 179400 | 179400 | 179400 |
| Total RAM Bits | 9383040 | 9383040 | 9383040 | 9383040 | 9383040 |
| User I/O | 742 | 742 | 742 | 742 | 742 |
| Terminal Finish (RoHS) | Pb-free (N suffix) | Pb-free (N suffix) | Pb-free (N suffix) | SnPb (non-N) | SnPb (non-N) |
Key Differentiators
- Slowest commercial speed grade with the lowest unit cost in the EP2S180F1020 family (vs EP2S180F1020C3N)
- Pb-free (RoHS-compliant) terminal finish (N suffix) (vs EP2S180F1020C5 (non-N))
- Maximum logic density in the 1020-FBGA package within the Stratix II family (vs EP2S130F1020C5N)
Design Notes
Estimated: at 100% utilization of 179400 LEs with toggle activity of 12.5% and a 250 MHz clock, EP2S180F1020C5N core power is approximately 4-7 W. The 1020-FBGA 33x33 mm package is supplied with thermal-ball pattern under the die. Use a minimum 8-layer PCB with a continuous inner ground plane stitched directly under the BGA thermal balls, and provide 200-300 LFM airflow. Without airflow, junction temperature can exceed 100C under full-load. Refer to Stratix II device handbook AN 328 for thermal-ball soldering and heatsink attach guidance.
Use a minimum 6-layer stack-up with the BGA balls escaping on the top layer plus two buried signal layers. The 1020-ball BGA uses 1.0 mm or 1.27 mm pitch; follow JEDEC JESD-B1A fanout rules. Match trace length within +/- 50 mil for DDR/DDR2 address/command groups and within +/- 25 mil for clock/strobe pairs. Use 100-ohm differential for LVDS, 50-ohm single-ended for general-purpose I/O. Decouple every VCCINT/VCCIO pin with a 0.1 uF X7R + 10 uF bulk per bank group as recommended by the Stratix II device handbook.
Do not confuse Stratix II (EP2S) with Stratix (EP1S), Stratix III (EP3S), or Stratix IV (EP4S) - pinouts are NOT compatible. Do not confuse EP2S180 with EP2S130 (different logic density, same package) or EP2S60/EP2S90 (different packages). Do not assume C5 timing margin is enough for designs originally compiled for C3 - re-run Quartus II TimeQuest timing analysis with the actual speed grade before swapping. Verify JTAG chain order in multi-device configuration boards - MSEL[3:0] pins must match the chosen configuration scheme (AS, AP, PS, JTAG) per Stratix II handbook volume 1.
Place configuration PROM (e.g., EPCS64 or EPC16) within 2 inches of the EP2S180F1020C5N DATA pin and route the DCLK trace length-matched to DATA within +/- 100 mil. Route all eight PLL analog supplies (VCCA_PLL[1:8]) star-fashion from a single ferrite bead to reduce jitter; add 0.1 uF + 10 uF decoupling within 200 mil of each VCCA_PLL pin. Keep high-speed LVDS pairs on inner stripline layers with continuous reference planes; do not route over plane splits. For DDR2 interfaces use 50-ohm single-ended and 100-ohm differential (DQS pairs) with read/write deskew calibrated via OCT resistors.
Compliance Information
RoHS compliance indicated by N suffix in the order code (lead-free terminal finish). AEC-Q100 not applicable for commercial-grade FPGA. REACH compliance assumed per Intel product environmental statements; verify with latest Intel PCN for production date.
