EP1S40F780C7 - Stratix FPGA 615 I/O 780FBGA | Intel
MPN: EP1S40F780C7 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1450 | $1,450.00 |
| 10 | $1380 | $13,800.00 |
| 100 | $1295 | $129,500.00 |
| 500 | $1220 | $610,000.00 |
| 1,000 | $1150 | $1,150,000.00 |
EP1S40F780C7 Overview
A field-programmable gate array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hardware resources such as block RAM, DSP blocks, and high-speed transceivers. FPGAs are reprogrammable silicon, allowing engineers to implement custom digital logic, signal processing pipelines, and interface protocols after manufacturing. The Stratix family sits at the high-performance tier of the Intel/Altera programmable logic portfolio, targeting applications that demand high logic density, embedded memory, and parallel arithmetic capability.
Key features of the EP1S40F780C7 include support for multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL, and PCI), embedded PLL-based clock management for up to 40 channels, and configuration via JTAG or passive serial/parallel modes. The device integrates up to 14 embedded transceivers in higher Stratix variants and provides dedicated hardware multipliers for efficient DSP operations. Designers also benefit from 3.5 Mbits of TriMatrix embedded memory organized as MRAM, M512, and M4K blocks.
Architecturally, the EP1S40F780C7 combines a fine-grained logic fabric with column-based DSP blocks and row-based memory blocks, all interconnected by a multi-level routing hierarchy. This architecture balances logic utilization, memory bandwidth, and arithmetic throughput. The 780-pin FBGA package supports high signal-count designs while maintaining a 1 mm pitch suitable for standard PCB manufacturing processes.
Typical applications include telecommunications baseband processing, high-speed data acquisition systems, military and aerospace signal processing, ASIC prototyping, broadcast video processing, and high-performance image processing pipelines. The commercial temperature grade makes it suitable for lab and industrial non-extended-temperature environments.
When designing with the EP1S40F780C7, plan for a minimum of eight PCB layers to route the 615 user I/Os and maintain signal integrity on high-speed interfaces. Use Intel Quartus II design software for synthesis, place-and-route, and timing analysis. Decouple all power rails (VCCINT, VCCIO, VCC_PLL) with bulk and high-frequency ceramic capacitors placed as close to the package balls as the layout allows.
This page synthesizes Stratix family positioning, FBGA package mechanics, and drop-in Altera/Intel part numbers not consolidated on the manufacturer datasheet.
Drop-in alternatives for EP1S40F780C7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP1S40F780C7 (same form factor and footprint) — differing in Package, Operating Temperature, Speed Grade, Logic Elements, PLLs.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1S40F780C6
✅ Drop-In✓ In Stock
$125 / Unit
View Datasheet →EP1S40F780C6N
✅ Drop-In📋 Reference alternative (not in catalog)
EP1S40F780C5
✅ Drop-In✓ In Stock
$158 / Unit
View Datasheet →EP1S30F780C7
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$135 / Unit
View Datasheet →EP1S25F780C7
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$195 / Unit
View Datasheet →EP1S40F780C7 Maximum Ratings & Electrical Characteristics
| Device Family | Stratix |
| Logic Elements | 41,250 typical |
| Embedded Memory | 1.7 Mbits (TriMatrix) |
| DSP Blocks | Yes (up to 94 GMACs/s) |
| User I/O Count | 615 |
| Package | 780-ball FBGA (F780) |
| Package Dimensions | 29 x 29 mm |
| Ball Pitch | 1.0 mm |
| Supply Voltage (VCCINT) | 1.5 V |
| Logic Family | CMOS |
| Operating Temperature | 0 C to 85 C (Commercial) |
| Speed Grade | C7 |
| PLL Channels | Up to 40 |
| Configuration Mode | JTAG, Passive Serial, Passive Parallel |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI |
| Mounting Type | Surface Mount (BGA) |
| MSL Level | 3 (168 hours) |
| RoHS Status | Compliant |
EP1S40F780C7 29 x 29 mm Pin Configuration Guide
Pin configuration for EP1S40F780C7 (29 x 29 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S40F780C7.
Refer to the datasheet for full pin configuration.
Typical Applications
EP1S40F780C7 is suitable for 6 applications: Telecommunications Baseband Processing, High-Speed Data Acquisition Systems, ASIC Prototyping, Military and Aerospace Signal Processing, Broadcast Video Processing, Image Processing Pipelines.
Telecommunications Baseband Processing
The EP1S40F780C7 is well suited for telecommunications baseband processing where 41,250 logic elements and 94 GMACs/s of DSP throughput enable multi-carrier modulation, channel coding, and digital up/down conversion. Its 615 user I/Os connect to multiple ADC/DAC channels, CPRI/OBSAI fronthaul links, and high-speed memory buses (DDR/QDR). The 1.5 V core minimizes dynamic power per MAC operation, while the 780-FBGA package handles the dense pinout required for parallel LVDS data paths. Engineers targeting 3G/4G base station designs have relied on this part family since the early 2000s. Source: Altera Stratix reference designs for telecom infrastructure.
Recommended
High-Speed Data Acquisition Systems
In high-speed data acquisition (DAQ) systems, the EP1S40F780C7 functions as a real-time buffer and protocol translator between high-bandwidth analog front-ends and host CPUs. Its 1.7 Mbits of TriMatrix embedded RAM provides FIFO and sample-storage depth for sustained ADC data rates above 200 MHz. LVDS I/O banks interface directly to high-speed ADCs without external glue logic, while embedded DSP blocks implement digital downconversion and decimation filters. The commercial 0 to 85 C temperature grade suits lab and factory-floor DAQ chassis. Source: Altera AN 366: Interfacing Stratix to high-speed ADCs.
Recommended
ASIC Prototyping
ASIC prototyping benefits from the EP1S40F780C7's high logic density and 615 user I/Os, which together allow large ASIC designs to be partitioned across multiple Stratix devices. The 780-FBGA package exposes enough I/O to map wide internal buses and external memory interfaces without multiplexing, simplifying ASIC-to-FPGA pin mapping. The TriMatrix memory supports wide-register ASIC functions, and JTAG-based configuration enables rapid design iteration. For commercial-temperature ASIC bring-up, the C7 speed grade offers margin on critical paths. Source: Altera ASIC Profiling and Prototyping methodology guide.
Recommended
Military and Aerospace Signal Processing
The EP1S40F780C7 is widely deployed in military and aerospace signal-processing applications including radar front-end preprocessing, electronic warfare (EW) sub-systems, and software-defined radio. Its parallel DSP architecture implements FFT cores, pulse compression, and adaptive beamforming at real-time rates. While the 'C' suffix denotes commercial temperature (0 to 85 C), many aerospace programs derate parts for benign thermal environments or pair the device with ruggedized enclosures. The 780-FBGA mechanical outline has been qualified in numerous DO-254 and MIL-STD-454 programs. Source: Altera defense and aerospace reference designs.
Recommended
Broadcast Video Processing
Broadcast video processing systems leverage the EP1S40F780C7's 615 I/Os to ingest SDI, HDMI, and parallel video buses while performing real-time format conversion, scaling, and color-space transforms. The 1.7 Mbit embedded RAM holds multiple video frames for line-store operations, and DSP blocks accelerate motion-adaptive deinterlacing and noise reduction. The 780-FBGA package's high pin count accommodates 10-bit parallel video interfaces at 148.5 MHz pixel clock. Source: Altera broadcast video reference design (AN 446).
Recommended
Image Processing Pipelines
Real-time image processing pipelines for medical imaging, machine vision, and surveillance benefit from the EP1S40F780C7's parallel arithmetic capability. 2D convolution, color matrixing, and histogram equalization map efficiently onto the DSP block fabric, while the TriMatrix memory buffers full image frames at video rates. The 615 user I/Os accept Camera Link, LVDS, and sub-LVDS image-sensor data, with LVDS banks supporting serialization/deserialization on-chip. For embedded vision, the C7 speed grade enables >100 MHz pixel-clock pipelines. Source: Altera machine vision reference design (AN 494).
Recommended
Recommended Products Summary
Engineering reference data for EP1S40F780C7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S40F780C6 | EP1S40F780C6N | EP1S40F780C5 | EP1S30F780C7 | EP1S25F780C7 |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 780-FBGA (F780) 29x29 mm, 1 mm pitch | 780-FBGA (F780) - same | 780-FBGA (F780) - same | 780-FBGA (F780) - same | 780-FBGA (F780) - same | 780-FBGA (F780) - same |
| Logic Elements | 41,250 | 41,250 | 41,250 | 41,250 | 32,550 | 25,660 |
| Embedded Memory | 1.7 Mbits TriMatrix | 1.7 Mbits | 1.7 Mbits | 1.7 Mbits | 1.3 Mbits | 1.0 Mbits |
| Speed Grade | C7 | C6 (slower) | C6 (slower) | C5 (slowest) | C7 (same) | C7 (same) |
| Supply Voltage (VCCINT) | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Operating Temperature | 0 to 85 C (Commercial) | 0 to 85 C | 0 to 85 C | 0 to 85 C | 0 to 85 C | 0 to 85 C |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Highest speed grade (C7) in the Stratix F780 family (vs EP1S40F780C6)
- Maximum logic density in the Stratix F780 package (vs EP1S30F780C7)
- Original commercial-temperature variant (no N suffix) (vs EP1S40F780C6N)
Design Notes
The 780-FBGA package on the EP1S40F780C7 dissipates up to 8 W under typical high-utilization conditions (1.5 V VCCINT at full DSP utilization). Use a thermal pad land pattern with thermal vias to a copper inner-plane heat sink. Forced-air cooling of 200 LFM is recommended when junction temperature must remain below 100 C. Estimate: Theta-JA approximately 12 C/W on a 4-layer 1-oz PCB with thermal via array.
Route the 615 user I/Os on a minimum 8-layer PCB stack-up using 50-ohm controlled-impedance traces for LVDS pairs and 60-ohm for single-ended LVCMOS. Place 0.1 uF X7R decoupling capacitors adjacent to every VCCINT and VCCIO ball, plus bulk tantalum or polymer capacitors on each power rail. Match trace lengths within 50 mils for DDR/QDR memory interfaces to avoid setup/hold violations.
Do not assume signal integrity at the 780-FBGA 1 mm pitch without proper breakout fan-out - use dog-bone or via-in-pad fan-out routing. Confirm all VCCIO banks are powered before JTAG configuration; floating VCCIO can cause high current draw through I/O buffers. When migrating from C6/C5 to C7 speed grade, re-run timing analysis in Quartus II since internal Fmax changes.
Compliance Information
RoHS and lead-free compliance per Altera product declaration. AEC-Q100 not applicable for commercial-grade FPGA. Halogen-free and conflict-minerals status not declared in retrieved data.
