EP1SGX10CF672C7N - Stratix GX FPGA 10K LE 672-FBGA | Intel
MPN: EP1SGX10CF672C7N ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $248 | $248.00 |
| 10 | $232.5 | $2,325.00 |
| 100 | $215.8 | $21,580.00 |
| 250 | $198.4 | $49,600.00 |
| 500 | $182.1 | $91,050.00 |
EP1SGX10CF672C7N Overview
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated I/O cells that allow a designer to implement arbitrary digital logic after fabrication. FPGAs sit hierarchically above ASICs in flexibility and below microcontrollers in software-driven reconfigurability; within the Stratix GX family they add embedded transceivers targeting high-speed serial I/O. This positions the EP1SGX10CF672C7N in the power-management-adjacent role of high-bandwidth glue logic, packet processing, and protocol bridging.
Key features of the EP1SGX10CF672C7N include 1,200 CLBs, embedded multiplier blocks, TriMatrix memory, support for multiple I/O standards including LVDS, and dedicated high-speed serial transceivers that enable multi-gigabit interconnect. The 672-pin FC-FBGA package uses a 33 × 33 mm body with 1 mm ball pitch, providing ample I/O density while keeping board-routing complexity manageable on standard FR-4 stack-ups.
Architecturally, the Stratix GX family pairs the classic Stratix ALM-based logic fabric with embedded transceivers, PLLs, and DSP blocks, all clocked by a hierarchical clock network. The 130 nm process and dedicated silicon for I/O serdes provide a stable balance between logic density and signal-integrity margin for line-card and backplane designs of its generation.
Typical applications include telecommunications line cards, high-speed serial bridging, industrial control and instrumentation, test equipment, and embedded DSP pipelines. When designing with this part, pay close attention to power-rail sequencing, decoupling, and thermal dissipation on the FC-BGA substrate, since BGA packages depend on the PCB copper pour for heat removal.
Drop-in alternatives for EP1SGX10CF672C7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP1SGX10CF672C7N (same form factor and footprint) — differing in Package, Operating Temperature, Family, Package Dimensions, Total RAM Bits.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1SGX10CF672C7
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View Datasheet →EP1SGX10CF672C6N
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View Datasheet →EP1SGX10CF672C7N Maximum Ratings & Electrical Characteristics
| Series | Stratix GX |
| Logic Elements | 10,570 |
| Number of LABs/CLBs | 1057 |
| Total RAM Bits | 920448 |
| Number of I/O | 362 |
| Supply Voltage | 1.5 V |
| Operating Temperature | 0 °C to 85 °C |
| Package / Case | 672-BBGA (FC-FBGA), 33 × 33 mm, 1 mm pitch |
| Mounting Type | Surface Mount |
| Process Technology | 130 nm CMOS |
| Maximum Frequency | 4385.97 MHz |
| Logic Family | CMOS |
| RoHS Status | Compliant |
| Lead-Free Terminal Finish | Yes (N suffix) |
EP1SGX10CF672C7N 672-bbga (fc-fbga), 33 × 33 mm, 1 mm pitch Pin Configuration Guide
Pin configuration for EP1SGX10CF672C7N (672-bbga (fc-fbga), 33 × 33 mm, 1 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX10CF672C7N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP1SGX10CF672C7N is suitable for 6 applications: Telecommunications Line Cards, High-Speed Serial Protocol Bridging, Industrial Control and Instrumentation, Test and Measurement Equipment, Embedded DSP Pipelines, Legacy System Maintenance and Drop-In Replacement.
Telecommunications Line Cards
The EP1SGX10CF672C7N fits telecommunications line cards because its Stratix GX architecture integrates multi-gigabit transceivers alongside 10,570 logic elements in a single 672-FBGA package. With 362 user I/Os and embedded transceiver channels, the device can terminate backplane SERDES links and process framer payloads without external PHY chips. Compared to a discrete transceiver-plus-FPGA solution, this single-chip integration reduces board area and BOM cost. Designers should follow Stratix GX reference designs for jitter-cleaning PLLs and AC-coupling caps.
Recommended
High-Speed Serial Protocol Bridging
The EP1SGX10CF672C7N excels at high-speed serial protocol bridging — for example, converting between Aurora, Serial RapidIO, and custom proprietary links. The embedded transceivers run at multi-gigabit data rates, while the 10,570 LEs provide generous headroom for state machines, FIFOs, and link-layer logic. The 672-FBGA package keeps critical RX/TX traces short and matched. Use the Quartus II transceiver toolkit for eye-diagram validation during bring-up.
Recommended
Industrial Control and Instrumentation
In industrial control and instrumentation, the EP1SGX10CF672C7N is well suited for motor-control DSP, multi-axis data acquisition, and protocol conversion. Its 130 nm CMOS process provides mature, well-characterized timing closure, while the 1.5 V core keeps power dissipation manageable. Note the commercial 0 °C to 85 °C operating range; for harsher environments, choose an 'I' grade variant or migrate to a Cyclone IV/V GX with industrial qualification.
Recommended
Test and Measurement Equipment
Test and measurement equipment leverages the EP1SGX10CF672C7N's combination of 362 LVDS-capable I/Os, embedded transceivers, and 10,570 LEs to build protocol analyzers, bit-error-rate testers, and arbitrary waveform generators. The 672-FBGA package supports the dense routing required for high-channel-count instruments. Quartus II synthesis with SignalTap II logic analyzer enables real-time waveform capture for validation. Plan adequate thermal dissipation on the PCB since BGA packages rely on copper pour.
Recommended
Embedded DSP Pipelines
Embedded DSP pipelines — such as baseband processing, software-defined radio front-ends, and real-time image processing — fit naturally on the EP1SGX10CF672C7N. The Stratix GX family includes dedicated multiplier blocks and DSP slices that accelerate FIR filters and FFTs far beyond what 10K general-purpose LEs can achieve alone. The 672-FBGA package supports high-bandwidth memory interfaces for streaming data. Target pipelining with parallel sample streams to fully exploit the architecture.
Recommended
Legacy System Maintenance and Drop-In Replacement
The EP1SGX10CF672C7N is widely used as a drop-in replacement for legacy Stratix GX-based line cards in long-lifecycle programs such as defense, aerospace, and industrial automation. Its 672-BGA footprint and pinout allow board-level substitution without redesign. Lead-time planning is critical — the family is in last-time-buy — so engineers should qualify C6 and I7 variants in parallel and stockpile Pb-free inventory. Migration to Cyclone V GX is recommended for new designs with extended support windows.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX10CF672C7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX10CF672C7 | EP1SGX10CF672C7GA | EP1SGX10CF672C6N | EP1SGX10CF672C6 | EP1SGX10CF672C6NGA |
|---|---|---|---|---|---|---|
| Package | 672-BBGA (FC-FBGA), 33×33 mm, 1 mm pitch | 672-BBGA (FC-FBGA), 33×33 mm, 1 mm pitch | 672-BBGA (FC-FBGA), 33×33 mm, 1 mm pitch | 672-BBGA (FC-FBGA), 33×33 mm, 1 mm pitch | 672-BBGA (FC-FBGA), 33×33 mm, 1 mm pitch | 672-BBGA (FC-FBGA), 33×33 mm, 1 mm pitch |
| Brand | Intel | Intel (Altera legacy) | Intel (Altera legacy) | Intel (Altera legacy) | Intel (Altera legacy) | Intel (Altera legacy) |
| Logic Elements | 10,570 | 10,570 | 10,570 | 10,570 | 10,570 | 10,570 |
| Speed Grade | C7 | C7 | C7 | C6 (slower Fmax) | C6 (slower Fmax) | C6 (slower Fmax) |
| Lead-Free Finish | Yes (N suffix) | No (SnPb) | Yes (N in GA suffix) | Yes (N suffix) | No (SnPb) | Yes (N in GA suffix) |
| User I/O Count | 362 | 362 | 362 | 362 | 362 | 362 |
| Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Operating Temperature | 0 °C to 85 °C (Commercial) | 0 °C to 85 °C (Commercial) | 0 °C to 85 °C (Commercial) | 0 °C to 85 °C (Commercial) | 0 °C to 85 °C (Commercial) | 0 °C to 85 °C (Commercial) |
| Process Technology | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS |
Key Differentiators
- Speed grade C7 gives the highest Fmax in the EP1SGX10CF672 672-FBGA family (vs EP1SGX10CF672C6N)
- Lead-free (Pb-free) ball finish for RoHS-compliant assembly (vs EP1SGX10CF672C7)
- Stratix GX architecture with integrated multi-gigabit transceivers (vs EP1S10F672C7N)
Design Notes
The EP1SGX10CF672C7N requires multiple supply rails (1.5 V core, 3.3 V/2.5 V/1.8 V VCCIO, and an isolated transceiver supply). Per the Stratix GX handbook, sequence the rails so VCCINT comes up first and VCCIO follows after — failing to do so can cause latch-up during configuration. Decouple each rail with a 0.1 µF X7R close to every ball-pair plus bulk polymer capacitors at the supply input. Estimated: at 50% resource utilization with active transceivers, expect 1.5–2.0 A on the 1.5 V core.
The 672-FBGA package dissipates heat almost entirely through the PCB copper pour and internal vias — there is no exposed thermal pad. Per Stratix GX guidance, maximize the ground-plane area under the device and use a minimum 1 oz copper layer on outer planes plus a 2 oz inner layer if possible. Estimated: at full utilization with all transceivers active, junction-to-ambient (θJA) on a 4-layer JEDEC board is approximately 12 °C/W, giving roughly a 60 °C rise at 5 W dissipation. Forced airflow is required for sustained full-load operation in sealed enclosures.
Route high-speed transceiver differential pairs (RX/TX) with 100 Ω differential impedance and length-matched within 150 mil per the Stratix GX device family datasheet. Use AC-coupling capacitors (typically 100 nF X7R 0402) on each RX pair close to the receiver. Reference plane continuity under transceivers is critical — never route signals over plane splits. Pin 1A1 identification follows the chamfered corner of the 672-FBGA package; the Quartus II pin-planner .qsf file provides the full ball map.
Common pitfalls when designing with the EP1SGX10CF672C7N include: (1) forgetting the JTAG TCK/TMS/TDO/TDI pull-ups, which can leave the device unconfigurable; (2) using the wrong configuration mode (AS/PS/Fast Passive) without the correct companion EEPROM; (3) ignoring the MSEL pin settings during PCB layout; and (4) assuming 'C7N' and 'C7' parts are interchangeable — the C7N is lead-free only. Quartus II 13.0sp1 is the last officially supported software; newer Quartus versions will not program this legacy device.
Compliance Information
Lead-free per N suffix and RoHS compliant per Intel/Alteray product page. Halogen-free status not explicitly stated in verified data; AEC-Q100 not applicable to commercial-grade FPGAs.
