EP1SGX10DF672I6N - Stratix GX FPGA, 10K LEs, 362 I/O | Intel
MPN: EP1SGX10DF672I6N ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $142.5 | $142.50 |
| 10 | $128.75 | $1,287.50 |
| 100 | $115 | $11,500.00 |
| 500 | $98.4 | $49,200.00 |
| 1,000 | $85.2 | $85,200.00 |
EP1SGX10DF672I6N Overview
An FPGA (Field Programmable Gate Array) is a programmable logic device consisting of an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and routing resources, all controlled by SRAM-based configuration bits. Within the broader taxonomy of digital integrated circuits, an FPGA sits above application-specific standard products (ASSPs) and below full-custom ASICs: it offers higher density and parallel processing than a microcontroller, while preserving the reprogrammability and time-to-market advantage over fixed-function ASICs. The Stratix GX family specifically targets high-speed serial interconnect, embedding multi-gigabit transceivers alongside the general-purpose fabric.
Key features of the EP1SGX10DF672I6N include 1,200 CLBs distributed across the 10,570-logic-element array, 920 Kbits of total RAM, support for external memory interfaces including DDR SDRAM, QDR SRAM, and FCRAM, dedicated DSP blocks for high-throughput signal processing, and the integrated high-speed serial transceivers that distinguish the Stratix GX family from the base Stratix line. Configuration is typically loaded through the JTAG interface or via an external EPC configuration device.
Architecturally, the device is built on a 0.13 µm CMOS process with 1.5 V core operation. The integrated transceivers operate at data rates up to 3.125 Gbps per channel, enabling protocols such as PCI Express, Serial RapidIO, Gigabit Ethernet, and XSBI. The combination of high logic density, abundant block RAM, and integrated serial I/O makes the EP1SGX10DF672I6N well suited to communication infrastructure and high-performance data-path applications.
Typical applications include 10 Gigabit Ethernet switching fabric, serial RapidIO bridges for wireless baseband, custom PCI Express endpoints, high-speed serial protocol bridging, and ASIC prototyping where designers validate large designs before committing to mask-based silicon. The wide I/O count also suits it to data-acquisition front-ends that aggregate many parallel channels.
When designing with this device, designers should consider the 1.5 V core supply decoupling network (multiple bulk and ceramic caps placed close to the package), the configuration scheme (JTAG vs EPC device), and the thermal envelope under sustained transceiver operation - the FBGA-672 package requires careful PCB layout for power and ground integrity. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes that complement the Altera Stratix GX Device Handbook (Volume 1).
Drop-in alternatives for EP1SGX10DF672I6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP1SGX10DF672I6N (same form factor and footprint) — differing in Operating Temperature, Package, Process Technology, RoHS Status, Total RAM Bits.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1SGX10DF672I6
✅ Drop-In✓ In Stock
$290 / Unit
View Datasheet →EP1SGX10DF672C7N
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →EP1SGX10DF672C7
✅ Drop-In✓ In Stock
$98.5 / Unit
View Datasheet →EP1SGX10DF672C6N
✅ Drop-In✓ In Stock
$195 / Unit
View Datasheet →EP1SGX10DF672C5N
✅ Drop-In✓ In Stock
$192 / Unit
View Datasheet →EP1SGX10CF672C7N
✅ Drop-In✓ In Stock
$182.1 / Unit
View Datasheet →EP1SGX10DF672I6N Maximum Ratings & Electrical Characteristics
| Series | Stratix GX |
| Family | Stratix GX (EP1SGX) |
| Logic Elements | 10,570 |
| Logic Cells | 10,570 |
| CLBs (Logic Array Blocks) | 1,200 LABs / 1200 CLBs |
| Total RAM Bits | 920,448 bits |
| User I/O Pins | 362 |
| Package Type | FBGA-672 (FineLine BGA) |
| Package Code | BGA, 672 balls |
| Package Dimensions | 33 x 33 mm (chipdig lists 33 x 33), 1 mm pitch |
| Mounting Type | Surface Mount |
| Core Supply Voltage | 1.5 V (1.425 V to 1.575 V) |
| Operating Temperature | 0 C to 85 C (Industrial, "I" grade) |
| Logic Family | CMOS |
| Lead Free Status | Lead Free (FBGA-672, per Ampheo listing) |
| RoHS Status | Compliant |
EP1SGX10DF672I6N 33 x 33 mm (chipdig lists 33 x 33), 1 mm pitch Pin Configuration Guide
Pin configuration for EP1SGX10DF672I6N (33 x 33 mm (chipdig lists 33 x 33), 1 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX10DF672I6N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP1SGX10DF672I6N is suitable for 6 applications: 10 Gigabit Ethernet Switching Fabric, Serial RapidIO Bridge for Wireless Baseband, Custom PCI Express Endpoint / Bridge, ASIC Prototyping and Design Validation, High-Speed Data Acquisition Front-End, Industrial Automation Control Logic.
10 Gigabit Ethernet Switching Fabric
The EP1SGX10DF672I6N's integrated multi-gigabit transceivers (up to 3.125 Gbps per channel) make it well suited for 10 Gigabit Ethernet (10GbE) XSBI interfaces and switching-fabric bridging between backplanes. With 362 user I/O pins and 10,570 logic elements, it can implement MAC-layer pipelines, switching logic, and traffic-management blocks alongside the serial transceivers. Designers place the device between the physical layer (PHY) devices and the host ASIC or NPU, using the transceivers for XSBI connections and the abundant parallel I/O for fabric data paths. The Industrial temperature grade supports deployment in carrier-grade and data-centre environments where ambient temperatures can exceed 70 C in confined racks. Compared with discrete SERDES plus a smaller FPGA, the integrated approach reduces board area, BOM count, and signal-integrity risk across the high-speed serial links.
Recommended
Serial RapidIO Bridge for Wireless Baseband
Wireless base-station designs historically use Serial RapidIO (sRIO) for chip-to-chip interconnect between baseband processors and DSP clusters. The EP1SGX10DF672I6N's high-speed serial transceivers and substantial logic capacity enable a multi-port sRIO bridge that aggregates traffic from remote-radio-head (RRH) interfaces or distributes data between baseband cards. The 920 Kbits of block RAM provide buffering for cell-payload reordering, while the 362 user I/O pins support parallel connections to adjacent baseband ASICs. The 1.5 V core supply and FBGA-672 package fit typical AdvancedTCA and ATCA base-station card form factors. Industrial temperature grade ensures operation in thermally constrained telecom closets. This combination of logic density, embedded RAM, and serial bandwidth was a defining feature of the Stratix GX family when targeting base-station applications.
Recommended
Custom PCI Express Endpoint / Bridge
The EP1SGX10DF672I6N's integrated transceivers can implement a single-lane or multi-lane PCI Express (PCIe) endpoint for adapter cards, protocol analysers, and ASIC-emulation boards. The 10,570 logic elements comfortably fit PCIe IP cores plus user-defined protocol accelerators, while the 920 Kbits of block RAM buffer transaction-layer payloads. The 362 user I/O pins expose ample parallel paths to companion memory (DDR/QDR SRAM) and to host-side interfaces. Industrial temperature grade suits deployment in server backplanes and industrial PCIe hosts. Designers often pair the FPGA with a PCIe clock buffer and EEPROM-based configuration device to enable plug-and-play enumeration. Compared with ASSP PCIe bridges, the FPGA variant allows custom protocol extensions and payload inspection without a separate processor.
Recommended
ASIC Prototyping and Design Validation
The EP1SGX10DF672I6N is frequently deployed as a building block in multi-FPGA ASIC prototyping platforms. Its 10,570 logic elements, 920 Kbits of embedded RAM, and 362 user I/O pins allow partitioning a target ASIC across several FPGAs with deterministic cut-points. The integrated transceivers provide high-speed chip-to-chip links between FPGA boards, eliminating the need for external SERDES chips on the prototyping backplane. The FBGA-672 package is available on prototyping carriers from companies such as Synopsys, Cadence, and S2C. Industrial temperature grade lets the platform operate in lab environments that are not strictly climate-controlled. A common alternative choice is the Stratix II EP2S60 family, but the Stratix GX remains preferred when the prototype design includes serial protocols that benefit from the integrated transceivers.
Recommended
High-Speed Data Acquisition Front-End
Multi-channel data-acquisition cards digitize many parallel analogue channels and aggregate them into a high-speed serial link for downstream processing. The EP1SGX10DF672I6N's 362 user I/O pins accept dense LVDS or parallel CMOS inputs from ADC banks, while the integrated transceivers stream the aggregated data over 1-3 Gbps links to a host processor or DSP array. The 920 Kbits of block RAM provide FIFO buffering between the acquisition rate and the serial output rate, absorbing bursts without overflow. Industrial temperature grade suits ruggedised test and measurement chassis. This application was a common deployment for the Stratix GX family before dedicated ADC-to-serial ASSPs became available; designers appreciated the flexibility to retarget the FPGA fabric when channel counts or sample rates changed between product generations.
Recommended
Industrial Automation Control Logic
Programmable logic controllers (PLCs) and motion controllers sometimes use FPGAs for high-rate deterministic I/O processing, custom protocol stacks, and safety logic. The EP1SGX10DF672I6N's 362 user I/O pins connect to many digital sensors and actuators, while the logic array implements deterministic control loops and the integrated transceivers link to remote I/O nodes over real-time Ethernet variants. The 1.5 V core supply and FBGA-672 package are accommodated on industrial backplanes with adequate copper for power delivery. Industrial temperature grade (0 C to 85 C ambient) supports deployment in factory cabinets and outdoor enclosures. Designers choosing this part over a microcontroller benefit from hardware-deterministic response times and parallel I/O throughput for legacy parallel field-bus interfaces that are no longer supported by newer MCU families.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX10DF672I6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX10DF672I6 | EP1SGX10DF672C7N | EP1SGX10DF672C7 | EP1SGX10DF672C6N | EP1SGX10DF672C5N | EP1SGX10CF672C7N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | FBGA-672 (33 x 33 mm, 1 mm pitch) | FBGA-672 (33 x 33 mm, 1 mm pitch) - same | FBGA-672 (33 x 33 mm, 1 mm pitch) - same | FBGA-672 (33 x 33 mm, 1 mm pitch) - same | FBGA-672 (33 x 33 mm, 1 mm pitch) - same | FBGA-672 (33 x 33 mm, 1 mm pitch) - same | FBGA-672 (33 x 33 mm, 1 mm pitch) - same |
| Logic Elements | 10,570 | 10,570 | 10,570 | 10,570 | 10,570 | 10,570 | 10,570 |
| Total RAM Bits | 920,448 | 920,448 | 920,448 | 920,448 | 920,448 | 920,448 | 920,448 |
| User I/O Pins | 362 | 362 | 362 | 362 | 362 | 362 | 362 |
| Temperature Grade | Industrial (0 C to 85 C) | Industrial (0 C to 85 C) | Commercial (0 C to 85 C) | Commercial (0 C to 85 C) | Commercial (0 C to 85 C) | Commercial (0 C to 85 C) | Commercial (0 C to 85 C) |
| Speed Grade | 6 (I6) | 6 (I6) | 7 (C7) | 7 (C7) | 6 (C6) | 5 (C5) | 7 (C7) |
| Core Supply Voltage | 1.5 V (1.425 V to 1.575 V) | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Approx. Unit Price (qty-1, USD) | $142.50 | Similar | Lower | Lower | Lower | Lower | Lower |
Key Differentiators
- Integrated multi-gigabit transceivers on a 10K-LE fabric (vs EP1S25F672C6N (Stratix, non-GX))
- Industrial temperature grade for telecom infrastructure (vs EP1SGX10DF672C7N (commercial))
- FBGA-672 (1 mm pitch) FineLine BGA compatibility across the same die family (vs EP1SGX10CF672C7N (F-package, FBGA-672))
Design Notes
The Stratix GX core runs at 1.5 V (1.425 V to 1.575 V) and the integrated transceivers each draw tens of milliamps; multiple transceivers in parallel demand a low-impedance supply. Recommended decoupling is a 330 uF bulk cap plus 0.1 uF and 0.01 uF ceramics within 5 mm of each supply pin. The PLL analog supply (VCCA_PLL) must be isolated from digital switching noise with a ferrite bead and dedicated 0.1 uF/0.01 uF capacitors; failure to do so can degrade transceiver jitter and increase bit-error rate.
The 672-ball FBGA at 1 mm pitch requires a 4-layer minimum stackup with continuous ground and power planes directly beneath the package. Use laser-drilled or 0.2 mm mechanically drilled microvias to escape the BGA fan-out, with the top-layer short traces feeding into inner plane layers. Maintain a 50 ohm controlled impedance on transceiver differential pairs (typically 100 ohm differential). Keep high-speed traces at least 5 mm away from any switching regulator to avoid coupling noise into the transceiver power supply.
Estimated: with all transceivers active at 3.125 Gbps, total power dissipation can approach 5-7 W; the FBGA-672 package typically specifies theta_JA around 12-15 C/W on a 4-layer PCB with adequate copper. This implies a junction-to-ambient temperature rise of 60-100 C, so the industrial ambient rating (0 C to 85 C) must be derated against the actual application envelope. Designers should add thermal vias under the package center pad and consider a small heatsink or forced-air cooling for full-transceiver workloads.
Differential transceiver pairs must be length-matched within 150 mils to preserve signal integrity at multi-gigabit data rates. Route each pair on a single layer without splits or vias where possible. Place the reference clock (REFCLK) trace symmetrically with similar length matching and isolated from data pairs by at least 3W spacing. Series-termination resistors for the parallel LVDS I/O should be placed near the FPGA pin to dampen reflections.
Common pitfalls include mis-configuring the JTAG chain (the TCK pull-down resistor should be present to avoid floating TCK during power-up), ignoring MSL (moisture-sensitivity-level) handling for the FBGA package (most Stratix GX parts are MSL-3), and forgetting to assert nCONFIG and nSTATUS correctly during power-up. Also confirm that the configuration scheme (JTAG, EPC16, or passive serial) is supported by your board before committing the design to a configuration device.
Compliance Information
Lead-free FBGA-672 package per Ampheo listing. RoHS compliant per DigiKey product listing. REACH, halogen-free, and conflict-mineral status not stated in the available verified data and should be confirmed with Intel's environmental compliance documentation. AEC-Q100 is not applicable - this is a high-density FPGA, not an automotive-qualified IC.
