Intel

EP20K1000CF672C8N - 1M Gate APEX 20KC FPGA, 672-BGA | Intel

MPN: EP20K1000CF672C8N ✗ End of Life

In Stock Ships in 1-3 business days

1.8 V Vdss 672-ball FC-FBGA (Fine-pitch Chip-Scale BGA), 45 x 45 mm, 1.27 mm pitch Package 301.21 MHz Speed 327,680 Memory

From $178.4 USD / Unit

MOQ: 1 |

Price updated: 2026-09-07

Volume Pricing

Qty	Unit Price	Extended
1	$285	$285.00
10	$252.5	$2,525.00
100	$220.75	$22,075.00
500	$195	$97,500.00
1,000	$178.4	$178,400.00

ℹ️ All prices are in USD

View Datasheet (PDF) View Alternatives

Quantity

EP20K1000CF672C8N Overview

The Intel EP20K1000CF672C8N is a 1,000,000-gate APEX 20KC Field Programmable Gate Array (FPGA) from the MultiCore architecture family, packaged in a 672-ball Fine-pitch Chip-Scale Ball Grid Array with 1.27 mm pitch and 45 x 45 mm body. According to the manufacturer datasheet, it integrates 38,400 logic cells, 327,680 bits of embedded SRAM, and 508 user I/O pins, fabricated on a 0.15 µm all-layer copper process that delivers 25-35% higher performance than the original APEX 20K family.

An FPGA (Field Programmable Gate Array) is a programmable logic device that uses a matrix of configurable logic blocks (CLBs), embedded memory, and programmable interconnects. The APEX 20KC series is part of the broader PLD (Programmable Logic Device) hierarchy: FPGA -> PLD -> programmable logic -> digital IC -> semiconductor. It evolved from simple SPLDs/CPLDs into high-density MultiCore devices combining look-up-table (LUT) logic with embedded memory blocks for high-performance system-on-chip prototyping and high-bandwidth datapath designs.

Key features of the EP20K1000CF672C8N include up to 301 MHz internal operation, 1.6 ns propagation delay across LUT logic paths, dedicated high-speed embedded memory (EAB/MegaLAB), MultiCore architecture merging LUT and product-term logic, low-power copper interconnect, and pin-compatibility with APEX 20KE devices in the same 672-ball BGA package. The 0.15 µm copper process reduces dynamic power while maintaining high toggle rates, making the device suitable for both high-speed DSP pipelines and parallel I/O expansion designs.

Architecturally, the device is organized around MegaLAB structures, each combining 16 Logic Elements (LEs), an Embedded System Block (ESB) implementing memory or product terms, and an associated local interconnect. The 508 user I/Os support multiple I/O standards including LVTTL, LVCMOS, PCI, and LVDS, enabling flexible interface bridging. The 327,680-bit embedded memory can be configured as RAM, ROM, dual-port RAM, or content-addressable memory without consuming logic resources, which is a distinguishing feature versus pure-logic FPGAs.

Typical applications of the EP20K1000CF672C8N include high-speed telecommunications backplanes, parallel DSP coprocessor engines, network interface cards, broadcast video processing, and PCI/CompactPCI bus bridging. The combination of high gate density, embedded memory, and 508 user I/Os makes it a strong fit for designs that previously required gate-array ASICs, while still retaining in-system reprogrammability for prototype and low-volume production runs.

When designing with this device, ensure your tool flow targets the APEX 20KC family specifically (Quartus II 5.0+ or the legacy MAX+PLUS II baseline). Verify BGA layout escape routing for the 1.27 mm ball pitch; the package is pin-compatible with APEX 20KE devices so existing PCBs in that family can accept the EP20K1000CF672C8N with updated firmware. Plan power decoupling across each VCC rail and consider thermal copper-pour reinforcement to dissipate the moderate power of a 1M-gate fabric at 301 MHz.

This page synthesizes distributor pricing, lifecycle status, drop-in alternatives (including APEX 20KE cross-family variants on the Site MPN list), and practical design notes not found in the manufacturer datasheet alone - giving an engineer a single source for sourcing, replacement, and integration guidance.

Drop-in alternatives for EP20K1000CF672C8N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP20K1000CF672C8N (same form factor and footprint) — differing in Operating Temperature, Package, Process Technology, Speed Grade, System Gates.

EP20K1000CF672C7

Intel

Operating Temperature: 0 °C to +85 °C (commercial, C suffix)

Package: 672-ball FC-FBGA (45 × 45 mm, 1.27 mm pitch)

Process Technology: 0.15 µm all-layer copper CMOS