EP20K1000CF672C8 - APEX 20KC FPGA 1M Gates 672-BGA | Altera
MPN: EP20K1000CF672C8 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $377.07 | $377.07 |
| 10 | $339.36 | $3,393.60 |
| 100 | $301.66 | $30,166.00 |
| 500 | $271.49 | $135,745.00 |
| 1,000 | $245.09 | $245,090.00 |
EP20K1000CF672C8 Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor device whose logic fabric, routing, and I/O behavior are defined by a user-supplied configuration bitstream rather than by hard-wired mask layers. FPGAs sit within the broader hierarchy of programmable logic devices (PLD -> CPLD -> FPGA -> SoC FPGA), bridging the gap between fixed-function ASICs and software-driven microcontrollers. The APEX 20KC family in particular targets high-density, parallel datapath designs where on-chip memory and a large number of user I/Os are required.
Key features of the EP20K1000CF672C8 include MultiCore architecture with embedded CAM blocks, support for LVDS, LVTTL, LVCMOS, SSTL, and GTL+ I/O standards, four phase-locked loops (PLLs) for clock management, and built-in boundary-scan (IEEE 1149.1 JTAG) support. The device supports in-system programmability via the Fast Passive Parallel (FPP) or Passive Serial (PS) configuration modes using Altera/Quartus configuration bitstreams, with EPC configuration devices or a microprocessor host.
The 672-ball FineLine BGA package is built around a 45 x 45 mm substrate with a 1.27 mm ball pitch. The 0.15-micrometer copper process enables a core voltage around 1.8 V, with the multi-voltage I/O banks supporting reference voltages appropriate to the standard in use. Designers can apply the device across wired telecom backplanes, industrial control planes, video processing pipelines, ASIC prototyping, and high-speed instrumentation front-ends.
When designing with the EP20K1000CF672C8, ensure proper power sequencing between VCCINT (core) and VCCIO (I/O) rails. Decoupling must follow Altera's recommended 0.1 uF + bulk capacitor topology adjacent to each power pin, and the JTAG chain must be terminated to avoid configuration failures. The APEX 20KC family is now legacy - long-term designs should consider migration to Stratix or Cyclone families for active lifecycle support. This page synthesizes distributor pricing, drop-in same-brand alternatives, and legacy FPGA design notes that the manufacturer datasheet alone does not consolidate.
Drop-in alternatives for EP20K1000CF672C8 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP20K1000CF672C8 (same form factor and footprint) — differing in Operating Temperature, Package, Process Technology, Speed Grade, System Gates.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K1000CF672C7
✅ Drop-In✓ In Stock
$158 / Unit
View Datasheet →EP20K1000CF672C7ES
✅ Drop-In✓ In Stock
$89.5 / Unit
View Datasheet →EP20K1000CF672C7GZ
✅ Drop-In✓ In Stock
$162.4 / Unit
View Datasheet →EP20K1000EFC672-2X
✅ Drop-In📋 Reference alternative (not in catalog)
EP20K1000CF672C8 Maximum Ratings & Electrical Characteristics
| Device Type | Field Programmable Gate Array (FPGA) |
| Series | APEX 20KC |
| System Gates | 1,000,000 |
| Logic Elements / Cells | 38,400 |
| Embedded RAM | 327,680 bits |
| User I/Os | 488 (datasheet), 508 (per some distributor listings) |
| Number of PLLs | 4 |
| Maximum User I/O Pins | 488 |
| Process Technology | 0.15 um all-layer copper CMOS |
| Core Voltage (VCCINT) | 1.8 V (typical) |
| I/O Voltage (VCCIO) | Multi-voltage (LVTTL/LVCMOS/LVDS/SSTL/GTL+ compatible) |
| Propagation Delay (typical) | 1.6 ns |
| Package | 672-ball FineLine BGA, 45 x 45 mm, 1.27 mm pitch |
| Operating Temperature | 0C to 85C (commercial) |
| Configuration Mode | FPP / Passive Serial / JTAG |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | unknown (legacy part, verify on lot) |
EP20K1000CF672C8 672-ball fineline bga, 45 x 45 mm, 1.27 mm pitch Pin Configuration Guide
Pin configuration for EP20K1000CF672C8 (672-ball fineline bga, 45 x 45 mm, 1.27 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K1000CF672C8.
Refer to the datasheet for full pin configuration.
Typical Applications
EP20K1000CF672C8 is suitable for 6 applications: Telecom Backplane Glue Logic, ASIC Prototyping and Emulation, Industrial Control Plane Logic, Video and Image Processing Pipeline, Test and Measurement Instrumentation, Legacy Industrial / Mil-Aero Sustainment.
Telecom Backplane Glue Logic
The EP20K1000CF672C8's 1M-gate capacity, 488 user I/Os, and MultiCore architecture with embedded CAM blocks make it a strong fit for telecom backplane glue logic bridging framer/serializer ASICs. The 4 PLLs provide the multiple clock domains required for TDM bus aggregation, and 327 Kbits of embedded RAM absorb the small cell/payload FIFOs without external SSRAM. Placed on a line card between a framer's parallel data port and the backplane SERDES, the APEX 20KC's 1.6 ns propagation delay keeps ingress latency in the low nanoseconds. Versus an ASIC this FPGA offers immediate redesign for new framing protocols, at the cost of higher per-unit power than a hard-wired cell.
Recommended
ASIC Prototyping and Emulation
With 38,400 logic cells, 488 I/Os, and a large embedded RAM pool, the EP20K1000CF672C8 is a classic platform for ASIC prototyping where the design exceeds the capacity of a single lower-density FPGA. The 1.8 V core and 0.15 um copper process are mature, so Quartus II timing closure is predictable and well-documented. Designers map ASIC RTL into the MultiCore LABs, with the 4 PLLs synthesizing clocks at ASIC-equivalent frequencies. Compared to newer Cyclone V or Stratix parts, the APEX 20KC's 488 I/Os and 672-BGA footprint make it a high-visibility lab workhorse for full-chip emulation, though power dissipation per MHz is higher than a modern 28 nm equivalent.
Recommended
Industrial Control Plane Logic
The EP20K1000CF672C8's commercial 0C to 85C range, abundant LVTTL/LVCMOS I/O, and JTAG-driven in-system programmability make it well-suited to industrial control-plane designs that aggregate field-bus interfaces, encoder counters, and safety interlocks. The 4 PLLs synthesize independent clocks for PROFIBUS, CAN, and a local servo loop. The 327 Kbits of embedded RAM buffer encoder pulse trains without external memory. In a typical PLC backplane, the APEX 20KC sits between the field wiring terminals and the main CPU, offloading the deterministic I/O scan. Engineers moving to a -40C industrial design should migrate to the EP20K1000CF672I8N industrial variant of the same die.
Recommended
Video and Image Processing Pipeline
The EP20K1000CF672C8's embedded RAM, embedded CAM blocks, and 488 user I/Os handle real-time video processing tasks such as color-space conversion, frame-rate conversion, and simple motion-vector estimation. The LVDS-capable I/O banks can directly receive serializer-deserializer data from a camera link, while the 4 PLLs synthesize the pixel clock and the output display clock. The 1.6 ns propagation delay keeps pixel-domain combinational paths well under a 74 MHz pixel clock period. Designers today typically migrate active production to Cyclone V or Arria 10 SoC parts, but the APEX 20KC remains useful for legacy broadcast equipment repair and lab prototyping.
Recommended
Test and Measurement Instrumentation
The EP20K1000CF672C8's combination of 488 I/Os, embedded RAM, and 4 PLLs enables digital test instruments such as logic analyzers, protocol exercisers, and pattern generators where the FPGA sequences stimulus and captures response. The MultiCore architecture supports fine-grained timing control across many channels, and the 1.8 V core with multi-voltage I/O banks interfaces directly to TTL, LVCMOS, and LVDS instruments. In a logic-analyzer front-end, the APEX 20KC demultiplexes and timestamps 32+ channels at 200 MHz. The commercial temperature range suits bench instruments, and the 672-BGA allows the dense routing needed for high-channel-count probe pods.
Recommended
Legacy Industrial / Mil-Aero Sustainment
Because the EP20K1000CF672C8 is widely deployed in long-life defense, avionics, and process-control systems, sustaining legacy production through the aftermarket is a real engineering use case. The 672-BGA footprint is shared with the entire APEX 20KC and APEX 20K families, enabling one board layout to source multiple speed grades or density bins. Sustainment engineers build reliability history around the 0.15 um copper process, the commercial temp range, and the proven Quartus II tool flow. When sustaining these systems, plan for last-time-buy replacement of EP20K1000CF672C8 stock with the faster C7 or C7ES drop-in alternatives before distributor inventory dries up.
Recommended
Recommended Products Summary
Engineering reference data for EP20K1000CF672C8 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K1000CF672C7 | EP20K1000CF672C7ES | EP20K1000CF672C7GZ | EP20K1000EFC672-2X |
|---|---|---|---|---|---|
| Package | 672-ball FineLine BGA (45 x 45 mm, 1.27 mm pitch) | 672-ball FineLine BGA - same | 672-ball FineLine BGA - same | 672-ball FineLine BGA - same | 672-ball FC-FBGA - same |
| Brand | Altera (Intel Programmable Solutions Group) | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same |
| Family | APEX 20KC | APEX 20KC - same | APEX 20KC - same | APEX 20KC - same | APEX 20K (non-20KC) - within 35% performance delta |
| System Gates | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 |
| Logic Cells / Elements | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 |
| Embedded RAM (bits) | 327,680 | 327,680 | 327,680 | 327,680 | 327,680 |
| User I/Os | 488 (datasheet) / 508 (some listings) | 488 | 488 | 488 | 488 |
| Speed Grade | C8 (commercial, 8th speed bin) | C7 (faster) | C7 with ES marking | C7 with GZ marking | -2X (APEX 20K, slightly slower generation) |
| Operating Temperature | 0C to 85C (commercial) | 0C to 85C (commercial) | 0C to 85C (commercial) | 0C to 85C (commercial) | 0C to 85C (commercial) |
| Lifecycle Status | Obsolete (aftermarket only) | Obsolete (aftermarket only) | Obsolete (aftermarket only) | Obsolete (aftermarket only) | Obsolete (aftermarket only) |
Key Differentiators
- Same-package drop-in with faster speed grade (C7) (vs EP20K1000CF672C7)
- Same 1M-gate APEX 20K die in a slightly older non-20KC family (vs EP20K1000EFC672-2X)
- Higher I/O count than legacy ACEX 1K alternatives (vs EP1K100FC484 (ACEX 1K))
Design Notes
Power the EP20K1000CF672C8 from a clean 1.8 V VCCINT rail with bulk decoupling of 100 uF + 0.1 uF ceramic at every VCCINT pin, and decouple each VCCIO bank separately because the I/O voltages are independently selected (3.3 V / 2.5 V / 1.8 V). Altera's APEX 20KC family datasheet recommends a power-on sequence where VCCINT ramps before VCCIO; violating this can trigger I/O latch-up. Estimated: at 100 MHz core with 50% I/O toggling, a typical 1M-gate design draws 1.5-2.5 A from VCCINT, so budget the regulator for at least 3 A peak with adequate thermal headroom on the power-stage FETs.
The 672-BGA FineLine package has a junction-to-ambient thermal resistance in the 14-20 C/W range with 1 oz copper and standard JEDEC test conditions. Estimated: a 1.8 V x 2 A core draw dissipates ~3.6 W, which produces a 50-72 C junction rise over ambient - within the 0C-85C commercial rating but with no margin in enclosed chassis. For sealed enclosures, replace the 0.15 um APEX 20KC with a 60 nm or 28 nm Cyclone V equivalent, or attach a small heatsink directly to the BGA lid. Always measure the actual junction temperature with the on-die thermal diode (DTEMP pins) during qualification.
Route the 672-BGA escape on a 1.27 mm pitch with microvia stack-ups - the 45 x 45 mm body has inner rows that cannot be reached by through-hole vias on a 4-layer board. Use 0.1 uF decoupling placed within 100 mils of every VCCINT/VCCIO/GND ball pair, and a continuous ground plane on layer 2 to provide return paths. The 1.27 mm ball pitch supports a dog-bone fan-out or alternatively a via-in-pad design (preferred for inner rows). Ensure the BGA land-pattern solder mask sliver meets IPC-7351 minimums to avoid solder-ball bridging during reflow.
Common pitfalls on the EP20K1000CF672C8: (1) forget the JTAG chain termination resistor (4.7 k on TCK/TMS/TDO/TDI) - this is the leading cause of configuration failure in production. (2) Use the wrong EPC configuration PROM (e.g. EPC2LC20 vs EPC4QC100) - verify the PROM's voltage and FPP/PS mode match the FPGA's mode pins MSEL[2:0]. (3) Mistake the industrial 'I' suffix - the EP20K1000CF672C8 is COMMERCIAL (0-85C), not industrial; for -40C operation use the CF672I8N. (4) Do not apply LVDS inputs before VCCIO ramps; the APEX 20KC I/O cells require VCCIO within spec before LVDS bias networks are valid.
Compliance Information
Legacy Altera part produced before RoHS mandates were uniform; compliance depends on the specific manufacturing lot. The industrial-grade CF672I8N variant is not AEC-Q100 qualified - AEC-Q100 qualification is not standard for FPGA product lines. Always request the CoC/CoO for the specific lot before claiming compliance in regulated end products.
