EP20K200BC484-2X - APEX-20K FPGA 8320 LE, 382 I/O, 484-BBGA | Intel
MPN: EP20K200BC484-2X ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $132.5 | $1,325.00 |
| 100 | $118 | $11,800.00 |
| 500 | $105 | $52,500.00 |
| 1,000 | $95 | $95,000.00 |
EP20K200BC484-2X Overview
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that combines the high density of gate-array ASICs with the design flexibility of programmable logic. FPGAs occupy the upper end of the programmable-logic hierarchy: PLD -> CPLD -> FPGA -> SoC FPGA, sitting between simple glue-logic chips and full system-on-chip devices. APEX-20K devices were Altera's first multi-core, embedded-block FPGA architecture, embedding memory and I/O blocks alongside the logic fabric to deliver higher integration than earlier families.
Key features of the EP20K200BC484-2X include the APEX-20K MultiCore™ architecture combining Look-Up Table (LUT) logic with embedded memory blocks, in-system programmability via SRAM configuration cells, and 382 dedicated I/O pins supporting multiple I/O standards. The device operates from a 2.5 V core supply (2.375 V – 2.625 V) with separate VCCIO banks for I/O standard compatibility. The 484-ball BGA package provides high pin density for I/O-rich designs and supports 4 dedicated global clock / control inputs in addition to the 382 user I/Os.
The EP20K200BC484-2X uses a SRAM-based configuration cell architecture, meaning the device must be configured on every power-up from an external configuration memory (typically an EPC configuration device or a microcontroller). Its MultiCore fabric combines embedded system blocks (ESBs) for memory and arithmetic with LABs for general logic, giving designers a balance of register-rich and memory-rich resources in a single die.
Typical applications include telecommunications line cards, video and image processing pipelines, industrial control logic, high-speed glue logic between microprocessors and peripherals, and prototyping for ASIC development. The wide I/O count (382 pins) makes it well suited to bus-intensive designs where many parallel interfaces must be terminated on-chip.
When designing with this device, note that the APEX-20K family is mature legacy silicon; production status varies by speed grade and package, and a confirmed lifecycle check via Intel's Product Discontinuance notifications is recommended for new designs. Designers should verify configuration memory compatibility and supply ramp sequencing to avoid partial-configuration failures on cold start.
Drop-in alternatives for EP20K200BC484-2X — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP20K200BC484-2X (same form factor and footprint) — differing in Speed Grade, Series, Family, Operating Temperature, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K200BC484-1X
✅ Drop-In✓ In Stock
$75.1 / Unit
View Datasheet →EP20K200BC484-2
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP20K200BC484-3
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP20K200EBC484-2X
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP20K200BC484-2X Maximum Ratings & Electrical Characteristics
| Family | APEX-20K |
| Series | EP20K200 |
| Logic Elements | 8,320 |
| LABs/CLBs | 832 |
| Embedded RAM | 106,496 bits |
| User I/O Pins | 382 |
| Dedicated Inputs | 4 |
| Supply Voltage (VCCINT) | 2.375 V to 2.625 V |
| Operating Junction Temperature | 0 °C to 85 °C |
| Package | 484-ball PBGA (BBGA-484) |
| Mounting Type | Surface Mount |
| Architecture | MultiCore™ (LUT + Embedded System Blocks) |
| Configuration | SRAM-based (requires external configuration memory) |
| Speed Grade | -2X |
| RoHS Status | Compliant (per supplier listings) |
| Maximum Clock Frequency (reference) | 178.57 MHz (per Altera datasheet for family) |
EP20K200BC484-2X 484-ball pbga (bbga-484) Pin Configuration Guide
Pin configuration for EP20K200BC484-2X (484-ball pbga (bbga-484) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K200BC484-2X.
Refer to the datasheet for full pin configuration.
Typical Applications
EP20K200BC484-2X is suitable for 6 applications: Telecommunications Line Cards, Video and Image Processing Pipelines, Industrial Control Logic and Machine Interfaces, ASIC Prototyping and Emulation, High-Speed Glue Logic Between Microprocessors and Peripherals, Legacy Military and Avionics Retrofit Systems.
Telecommunications Line Cards
The EP20K200BC484-2X's 382 user I/O pins and 106,496-bit embedded RAM make it well-suited for legacy telecom line-card designs. The APEX-20K MultiCore fabric supports high-fanout bus aggregation across TDM backplanes, and 8,320 LEs allow protocol-conversion glue logic. Designers route LVTTL/LVCMOS I/O through VCCIO banks at 3.3 V to interface legacy bus transceivers; the 484-ball PBGA's 27x27 mm footprint delivers high pin density for 32+ channel serial backplane designs.
Recommended
Video and Image Processing Pipelines
The EP20K200BC484-2X's 106,496-bit embedded RAM (distributed across ESB/MegaLAB memory blocks) provides line-buffer and pixel-history storage for video processing pipelines. Its 8,320 LEs handle real-time pixel arithmetic at moderate resolutions. The 382 I/Os connect to external SDRAM controllers and parallel video DACs; the 484-ball BGA simplifies break-out of 16-32-bit wide video buses, and the 2.5 V core supply allows compatibility with 3.3 V video ADC/DAC devices through dedicated VCCIO banks.
Recommended
Industrial Control Logic and Machine Interfaces
The EP20K200BC484-2X fits mid-complexity industrial PLC and machine-control logic where deterministic parallel I/O handling matters. Its 382 I/O pins aggregate multi-axis motor-control signals, encoder feedback, and sensor arrays; the 8,320 LEs execute state machines and PID controllers. The 0 °C to 85 °C operating junction range covers factory-floor enclosures. Designers leverage the 484-ball PBGA's high pin density to consolidate what would otherwise require two or three CPLDs onto a single FPGA.
Recommended
ASIC Prototyping and Emulation
The EP20K200BC484-2X is widely used for ASIC prototyping and architectural emulation because its 8,320 LEs and 832 LABs map cleanly to gate-level netlists of moderate-complexity ASICs. The 106,496-bit embedded RAM allows designers to emulate SRAM blocks within the FPGA fabric, and 382 I/Os support prototype-break-out to external ASIC pin pads. The -2X speed grade provides adequate timing margin for synchronous ASIC emulation at sub-100 MHz. Configuration time is seconds via JTAG or passive serial.
Recommended
High-Speed Glue Logic Between Microprocessors and Peripherals
The EP20K200BC484-2X bridges microprocessors/microcontrollers with high-bandwidth peripherals such as DDR memory controllers, custom DMA engines, and parallel DSP clusters. Its 8,320 LEs deliver register-rich custom-bus protocols and FIFOs, while the 106,496-bit embedded RAM implements dual-clock FIFO buffers between async processor and peripheral domains. The 382 I/O pins comfortably route 32-bit wide data buses plus address, control, and status signals on a single FPGA, eliminating multiple CPLDs.
Recommended
Legacy Military and Avionics Retrofit Systems
The EP20K200BC484-2X supports long-life-cycle military and avionics retrofit systems where fielded equipment must be supported for decades. Although Intel lists the part NRND for new designs, the APEX-20K family continues to ship through authorized distributors for ongoing defense and aerospace maintenance programs. The 484-ball PBGA's robust mechanical construction withstands vibration environments, and the 8,320 LEs allow functional replacement of multiple obsolete ASICs with a single modern-equivalent FPGA design.
Recommended
Recommended Products Summary
Engineering reference data for EP20K200BC484-2X — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K200BC484-1X | EP20K200BC484-2 | EP20K200BC484-3 | EP20K200EBC484-2X |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Package | 484-ball PBGA (BBGA-484) | 484-ball PBGA (BBGA-484) - same | 484-ball PBGA (BBGA-484) - same | 484-ball PBGA (BBGA-484) - same | 484-ball PBGA (BBGA-484) - same |
| Logic Elements | 8,320 | 8,320 | 8,320 | 8,320 | 8,320 |
| LABs/CLBs | 832 | 832 | 832 | 832 | 832 |
| Embedded RAM | 106,496 bits | 106,496 bits | 106,496 bits | 106,496 bits | 106,496 bits |
| User I/O Pins | 382 | 382 | 382 | 382 | 382 |
| Speed Grade | -2X | -1X (one bin slower) | -2 (one step slower than -2X) | -3 (slowest bin) | -2X (matched) |
| Supply Voltage | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 2.375 V to 2.625 V |
| Operating Temperature | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C |
| Drop-In Compatible | Reference part | Yes (slower speed grade) | Yes (slower speed grade) | Yes (slowest speed grade) | Yes (enhanced feature set) |
Key Differentiators
- Highest available logic capacity in the APEX-20K family in 484-ball BGA (vs EP20K100FC484-3)
- Highest speed grade in 484-ball BGA at this logic density (vs EP20K200BC484-1X)
- Maximum I/O density for bus-intensive applications (vs EP20K200BC356-3)
Design Notes
The EP20K200BC484-2X requires a tightly regulated 2.5 V core supply within 2.375 V to 2.625 V; design the regulator with at least 10% headroom above worst-case ICC. VCCINT and VCCIO banks must ramp together within the datasheet-specified sequence to avoid partial-configuration latch-up. Use bulk decoupling (47 µF to 100 µF tantalum or polymer) near the BGA plus 0.1 µF and 1 µF ceramic capacitors distributed under the package footprint.
Estimated: at maximum toggle rate and 100% I/O switching, the EP20K200 in 484-ball PBGA dissipates ~2-3 W steady-state. The 27x27 mm BGA's thermal resistance (theta_JA) is approximately 15 C/W with a 4-layer JEDEC board, so junction rise above ambient is 30-45 C. Provide a thermal pad array under the BGA's center ground balls and stitch vias on the inner layers to keep the die below 85 °C at the upper end of the commercial temperature range.
The 484-ball PBGA requires a 4-layer minimum PCB with microvia-in-pad or laser-drilled vias on inner pads. Route the 382 user I/Os through at least two breakout layers; critical high-speed buses should escape directly under the BGA on the top layer with the remaining I/Os breaking out on layer 3. Match clock-pair lengths within ±50 mils and isolate global clock traces from asynchronous I/O to avoid crosstalk. Reserve one inner ground plane adjacent to the signal layers for return-path integrity.
Configuration failure is the most common APEX-20K board-bring-up issue. Ensure nSTATUS, CONF_DONE, and nCONFIG pull-ups are correctly sized (typically 10 kΩ) and verify configuration clock frequency stays within the 10-66 MHz range for passive-serial mode. A missing or mis-programmed EPC configuration device will leave all I/Os tri-stated; always validate the bitstream CRC before declaring the device functional. For JTAG programming, ensure TDI/TDO chain integrity on the board before connecting the USB-Blaster.
Compliance Information
RoHS compliance per supplier listings (MicrochipUSA, DigiKey, Alibaba). AEC-Q100 is not applicable — FPGAs are not automotive-qualified logic ICs in this legacy family. Halogen-free status and conflict-minerals reporting not stated explicitly in the verified supplier data.
