EP20K200EFC484-2N - 200K Gate APEX-20KE FPGA, 484-FBGA | Intel
MPN: EP20K200EFC484-2N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $255 | $2,550.00 |
| 100 | $220 | $22,000.00 |
| 500 | $195 | $97,500.00 |
| 1,000 | $175 | $175,000.00 |
EP20K200EFC484-2N Overview
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit based on a matrix of configurable logic blocks (CLBs) connected via programmable interconnect, allowing hardware designers to implement custom digital logic without the cost of ASIC masks. Modern FPGAs sit in the hierarchy: programmable logic device (PLD) -> CPLD -> FPGA -> SoC FPGA (which adds hard processor cores), and belong to the broader category of programmable logic ICs. APEX-20KE is positioned as a high-density, system-level integration platform combining logic, memory, and dedicated I/O.
Key differentiating features include 376 programmable I/Os supporting multiple I/O standards (LVTTL, LVCMOS, PCI, GTL+, SSTL), 4 embedded Phase-Locked Loops (PLLs) for clock management, and an embedded memory bandwidth of up to 200 MHz. The MultiCore architecture integrates LUT-based logic with embedded system blocks (ESBs), allowing designers to implement RAM, ROM, FIFO, and CAM functions without sacrificing logic capacity.
The APEX-20KE architecture features a four-level hierarchical interconnect network (MegaLAB, LAB, FastTrack, and local interconnect), delivering predictable timing closure even in designs exceeding 100K gate equivalents. The 484-FBGA package with 1.0 mm ball pitch supports board-level integration while the 0.22 µm process balances logic density with I/O performance.
Typical applications include telecommunications infrastructure (ATM switches, SONET/SDH framer ICs), high-speed data acquisition, digital signal processing pipelines, custom peripheral glue logic, and PCI bridge implementations. The 376 I/Os make it especially suitable for bus-intensive designs requiring parallel data paths.
When designing with this FPGA, pay close attention to the I/O bank VCCIO configuration - mixing incompatible I/O standards on the same bank can damage the device. Use the Quartus II design software (or MAX+PLUS II for legacy projects) for synthesis and fitting; bitstream configuration is via the passive serial (PS), passive parallel async (PPA), or JTAG modes.
This page synthesizes distributor stock and pricing, same-brand APEX-20K-family drop-in alternatives from the Site MPN list, and practical design notes not assembled in any single manufacturer datasheet.
Drop-in alternatives for EP20K200EFC484-2N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP20K200EFC484-2N (same form factor and footprint) — differing in Package, Operating Temperature, Speed Grade, Family, System Gates.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K200EFC484-1N
✅ Drop-In✓ In Stock
$290 / Unit
View Datasheet →EP20K200EFC484-1X
✅ Drop-In✓ In Stock
$165 / Unit
View Datasheet →EP20K200EFC484-1
✅ Drop-In✓ In Stock
$68.4 / Unit
View Datasheet →EP20K200BC484-2X
✅ Drop-In✓ In Stock
$95 / Unit
View Datasheet →EP20K200BC484-1X
✅ Drop-In✓ In Stock
$75.1 / Unit
View Datasheet →EP20K200CF484C8N
✅ Drop-In✓ In Stock
$102.95 / Unit
View Datasheet →EP20K200EFC484-2N Maximum Ratings & Electrical Characteristics
| Family | APEX-20KE |
| Product Type | FPGA - Field Programmable Gate Array |
| System Gates | 200,000 |
| Logic Elements | 8,320 |
| Total RAM Bits | 106,496 |
| Embedded System Blocks (ESB) | 52 (True Dual-Port RAM) |
| Maximum User I/O | 376 |
| Package | 484-FBGA (FineLine BGA), 23x23 mm, 1.0 mm pitch |
| Core Voltage | 1.8 V |
| Supply Voltage Range | 1.71 V to 1.89 V |
| Process Technology | 0.22 µm CMOS |
| Logic Family | CMOS |
| Propagation Delay (typ.) | 2.5 ns |
| Operating Temperature | 0 °C to +85 °C (Commercial) |
| Configuration Modes | Passive Serial, Passive Parallel Async, JTAG |
| PLLs | 4 |
| Speed Grade | -2 |
| Mounting Type | Surface Mount (BGA) |
EP20K200EFC484-2N 484-fbga (fineline bga), 23x23 mm, 1.0 mm pitch Pin Configuration Guide
Pin configuration for EP20K200EFC484-2N (484-fbga (fineline bga), 23x23 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K200EFC484-2N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP20K200EFC484-2N is suitable for 6 applications: Telecommunications Infrastructure (SONET/SDH Framers), High-Speed Data Acquisition Front-End, Custom Peripheral and Bridge Logic (PCI/CompactPCI), Digital Signal Processing Pipelines, Network Switch Fabric and ATM Backplanes, Aerospace and Defense Long-Lifecycle Systems.
Telecommunications Infrastructure (SONET/SDH Framers)
The EP20K200EFC484-2N's 200K system gates, 376 I/Os, and four on-chip PLLs make it well-suited for SONET/SDH framer and mapper implementations in telecom line cards. The 484-FBGA package provides the high pin count required for parallel STS-1/STM-1 datapaths plus overhead interfaces. Compared to ASICs, designers can iterate on framing and pointer-processing algorithms in firmware, accelerating time-to-market. The 106,496 bits of embedded RAM support efficient pointer queue buffering. Engineers typically pair it with external serializer/deserializer (SERDES) devices for optical transport.
Recommended
High-Speed Data Acquisition Front-End
The 376 user I/Os and 2.5 ns propagation delay of the EP20K200EFC484-2N enable parallel sampling front-ends in data acquisition systems. The device routes data from multiple ADCs (10 to 14-bit, 100+ MSPS) into on-chip ESBs configured as FIFO buffers, with the PLLs generating synchronous clock domains. The 0.22 µm CMOS MultiCore architecture delivers deterministic latency for time-correlated acquisition. Designers use this FPGA to pre-process data and reduce downstream DSP load. Industrial test equipment is a typical target application.
Recommended
Custom Peripheral and Bridge Logic (PCI/CompactPCI)
The 484-FBGA package and 200K-gate capacity of the EP20K200EFC484-2N support PCI 32/64-bit bridge implementations between host processors and custom peripherals. The 1.8V core with 3.3V-tolerant I/Os is directly compatible with PCI signalling. APEX-20KE devices include dedicated PCI-compliant I/O buffers meeting the 33 MHz PCI 2.2 specification. This FPGA is commonly used as a 'glue logic' replacement for legacy ASICs in industrial CompactPCI and VMEbus systems, especially in long-lifecycle aerospace and defense programs.
Recommended
Digital Signal Processing Pipelines
The 8,320 logic elements and 106,496 bits of ESB memory in the EP20K200EFC484-2N enable FIR filters, FFT engines, and correlator implementations with up to 200 MHz clocking in true dual-port RAM mode. The MultiCore architecture lets designers partition DSP blocks into dedicated ESB-backed pipeline stages. Compared to discrete DSP processors, FPGAs deliver higher throughput per MHz for fixed-coefficient filters. The 376 I/Os allow parallel data exchange with multiple DSPs and external memory buses (e.g., ZBT SRAM or DDR SDRAM controllers).
Recommended
Network Switch Fabric and ATM Backplanes
The EP20K200EFC484-2N is well-matched to ATM and small-to-medium Gigabit Ethernet switch fabrics, providing 200K gates for cell/packet buffering and queue management. The 376 I/Os drive parallel backplane buses, while the embedded RAM bits implement per-port queue tables. The four PLLs support independent port frequencies in mixed-rate (10/100/1000) switches. APEX-20KE devices were widely deployed in late-1990s and early-2000s enterprise switches and remain in service today for legacy infrastructure support.
Recommended
Aerospace and Defense Long-Lifecycle Systems
The EP20K200EFC484-2N is found in aerospace and defense platforms requiring multi-decade support, including avionics data concentrators, mission computers, and signal-intelligence subsystems. The industrial temperature variant (EP20K200EFC484-1X) extends operation to –40 °C to +100 °C. Defense contractors maintain APEX-20KE bitstream compatibility for program continuity, leveraging the 376 I/Os for MIL-STD-1553, ARINC 429, and custom backplane interfaces. The 484-FBGA's 1.0 mm pitch supports standard 4 to 6 layer PCB stack-ups common in ruggedized chassis.
Recommended
Recommended Products Summary
Engineering reference data for EP20K200EFC484-2N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K200EFC484-1N | EP20K200EFC484-1X | EP20K200EFC484-1 | EP20K200BC484-2X | EP20K200BC484-1X | EP20K200CF484C8N |
|---|---|---|---|---|---|---|---|
| Package | 484-FBGA (23x23 mm, 1.0 mm pitch) | 484-FBGA (same) | 484-FBGA (same) | 484-FBGA (same) | 484-BGA (same footprint) | 484-BGA (same footprint) | 484-FBGA (same footprint, VCC ball differences) |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Family | APEX-20KE (Enhanced) | APEX-20KE | APEX-20KE | APEX-20KE | APEX 20K (original) | APEX 20K (original) | APEX 20K (original) |
| System Gates | 200,000 | 200,000 | 200,000 | 200,000 | 200,000 | 200,000 | 200,000 |
| Logic Elements | 8,320 | 8,320 | 8,320 | 8,320 | 8,320 | 8,320 | 8,320 |
| Embedded RAM Bits | 106,496 | 106,496 | 106,496 | 106,496 | 106,496 | 106,496 | 106,496 |
| Maximum User I/O | 376 | 376 | 376 | 376 | 376 | 376 | 376 |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 2.5 V (NOT drop-in) | 2.5 V (NOT drop-in) | 2.5 V (NOT drop-in) |
| Speed Grade | –2 (fastest APEX-20KE) | –1 (~15% slower) | –1 (~15% slower) | –1 (~15% slower) | –2 | –1 | C8 (commercial 8) |
| Operating Temperature | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C | –40 °C to +100 °C (Industrial) | 0 °C to +85 °C | 0 °C to +85 °C | –40 °C to +100 °C | 0 °C to +85 °C |
| Lifecycle Status | Obsolete (EOL) | Obsolete (EOL) | Obsolete (EOL) | Obsolete (EOL) | Obsolete (EOL) | Obsolete (EOL) | Obsolete (EOL) |
Key Differentiators
- Highest speed grade (–2) in the 484-FBGA APEX-20KE family (vs EP20K200EFC484-1N)
- Industrial temperature range available in same package (vs EP20K200EFC484-1X)
- Enhanced MultiCore architecture vs original APEX 20K (vs EP20K200BC484-2X (original APEX 20K))
- Single-vendor pinout compatibility across all 484-FBGA APEX-20KE options (vs Cross-brand alternatives (none identified in verified web data))
Design Notes
The EP20K200EFC484-2N requires a 1.8V core supply (±5%, i.e., 1.71V–1.89V) and a separate VCCIO per I/O bank, typically 3.3V for PCI compatibility or 2.5V for SSTL. Decoupling: place 0.1 µF X7R ceramic capacitors within 5 mm of every VCC/VCCIO ball (the 484-FBGA has dozens of VCC balls distributed across the package periphery and center); add four 10 µF bulk tantalum or ceramic capacitors around the package. Power-on reset (POR) requires VCC ramp time within the MAX+PLUS II / Quartus II specification – consult APEX 20K datasheet section 'Power-On Reset' for ramp-rate limits.
Estimated: at 200 MHz toggle rate, full I/O switching, the APEX-20K family dissipates approximately 1.5 W to 2.5 W depending on utilization. The 484-FBGA junction-to-ambient thermal resistance (θJA) is approximately 11 °C/W with a JEDEC 4-layer test board. Estimated junction temperature rise is therefore ~22 °C to 28 °C above ambient, leaving comfortable margin at 85 °C ambient. For industrial –40 °C to +100 °C operation (EP20K200EFC484-1X variant), verify with the manufacturer's characterization report. Stencil design for the 1.0 mm pitch FBGA must follow IPC-7525 guidelines.
The 484-FBGA uses 1.0 mm ball pitch and a 23x23 mm body, which is routable on a standard 0.8 mm-pitch microvia or 0.4 mm-pitch HDI PCB process. Use 4 to 6 layer stack-up with continuous GND plane adjacent to the FPGA layer for return-path integrity. Matched-length routing (±50 mil) is required for LVDS and SSTL interfaces. JTAG chain layout should include a 4.7 kΩ pull-up on TCK, TMS, TDI, and a pull-down on TDO per IEEE 1149.1. Power-trace widths must support up to 3 A peak on VCC cores.
Common mistakes: (1) Mixing incompatible I/O standards on the same bank (e.g., LVTTL and GTL+) — this is undefined per the APEX 20K datasheet and may damage the I/O. (2) Using the original APEX 20K (non-KE) bitstream on a KE device, or vice versa — they are NOT bitstream-compatible. (3) Forgetting that the EP20K200BC* variants use 2.5V core vs 1.8V on KE parts, so substituting them without changing the power supply is destructive. (4) Configuring JTAG chain order incorrectly when the FPGA shares the bus with other devices. (5) Failing to set the MSEL pins correctly for the chosen configuration mode (PS, PPA, or JTAG).
Compliance Information
RoHS/REACH compliance data not available in verified sources. Device is commercial-grade only (not AEC-Q100 qualified); industrial variant EP20K200EFC484-1X available for extended temperature.
