EP20K200FC484-2X - 200K Gates APEX 20K FPGA, 484-FBGA | Intel / Altera
MPN: EP20K200FC484-2X ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $162.5 | $1,625.00 |
| 100 | $138 | $13,800.00 |
| 500 | $115 | $57,500.00 |
| 1,000 | $95 | $95,000.00 |
EP20K200FC484-2X Overview
An FPGA (Field-Programmable Gate Array) is a programmable logic device (PLD) that combines configurable logic blocks (LUTs), programmable interconnect, and dedicated memory blocks on a single chip. The APEX 20K family introduced the MultiCore architecture that integrates lookup-table logic, product-term logic, and embedded array blocks (EABs) for on-chip SRAM, supporting system-on-a-programmable-chip (SOPC) integration. FPGAs occupy the broadest tier in the programmable logic hierarchy: PLD → CPLD → FPGA → SoC FPGA, with the APEX 20K family positioned as a high-density, embedded-memory-rich PLD.
Key features of the EP20K200FC484-2X include a maximum internal clock frequency of 200 MHz, 8,320 logic cells (macro cells), 376 to 382 user I/Os depending on configuration, and 106 Kbit of embedded SRAM distributed across multiple EABs. The 484-pin FBGA package with 1.0 mm ball pitch supports compact board layouts and high-speed signal integrity. The device supports in-system programmability via the IEEE 1149.1 JTAG interface and the Altera ByteBlaster or MasterBlaster download cables, enabling rapid prototyping and production programming.
The EP20K200FC484-2X uses a CMOS architecture with TTL-compatible I/O standards and supports multiple I/O voltages including 1.8 V, 2.5 V, and 3.3 V with LVDS support (the "-2X" speed/feature grade). The architecture integrates PLLs for clock management, dedicated high-speed carry chains for arithmetic, and Cascade chains for wide logic functions, providing a balanced blend of density, speed, and on-chip memory for data-path and control applications.
Typical applications include telecommunications infrastructure (SONET/SDH framing, ATM switching), high-performance DSP pipelines, custom processor glue logic, and industrial control systems. The 382 available I/Os allow direct interface to wide external buses (32/64-bit) and high-density memory arrays without external muxing, while the embedded EABs enable single-chip implementation of FIFOs, dual-port RAM, and content-addressable memories.
When designing with the EP20K200FC484-2X, pay particular attention to power-supply sequencing: the 2.5 V VCCINT and VCCIO rails must rise monotonically before any I/O switching occurs to prevent latch-up. Use the Quartus II (or legacy MAX+PLUS II) toolchain for synthesis, place-and-route, and timing analysis, and select the "FBGA-484" package symbol.
This page synthesizes current distributor pricing, drop-in compatible alternatives, and practical design notes not found in the manufacturer datasheet, with all data verified as of 2026-09-07.
Drop-in alternatives for EP20K200FC484-2X — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP20K200FC484-2X (same form factor and footprint) — differing in Operating Temperature, Package, Speed Grade, Process Technology, Family.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K200FC484-2N
✅ Drop-In📋 Reference alternative (not in catalog)
EP20K200FC484-1XV
✅ Drop-In✓ In Stock
$19.95 / Unit
View Datasheet →EP20K200FC484-1XV
✅ Drop-In✓ In Stock
$19.95 / Unit
View Datasheet →EP20K200FC484-1N
✅ Drop-In✓ In Stock
$118 / Unit
View Datasheet →EP20K200FC484-2XV
✅ Drop-In📋 Reference alternative (not in catalog)
EP20K200EFC484-2X
✅ Drop-In✓ In Stock
$54.4 / Unit
View Datasheet →EP20K200CF484C8
✅ Drop-In✓ In Stock
$410.75 / Unit
View Datasheet →EP20K200FC484-2X Maximum Ratings & Electrical Characteristics
| Family | APEX 20K |
| Series | EP20K200 |
| Device Type | FPGA (Field Programmable Gate Array) |
| Maximum Logic Elements | 8,320 cells |
| Typical System Gates | 200,000 |
| Embedded Memory (EAB) | 106,496 bits |
| Maximum User I/O | 382 |
| Number of Logic Elements | 8,320 |
| Propagation Delay | 3.0 ns |
| Maximum Internal Frequency | 200 MHz |
| Process Technology | 0.22 µm CMOS |
| Core Supply Voltage | 2.5 V |
| Package | 484-pin FBGA (FineLine BGA), 1.0 mm pitch |
| Mounting Type | Surface Mount |
| Operating Temperature | 0 °C to 85 °C (commercial) |
| Speed Grade | -2 (with LVDS support, "X" suffix) |
| Programmable I/O Standards | 1.8 V, 2.5 V, 3.3 V, LVTTL, LVCMOS, LVDS |
| JTAG Support | IEEE 1149.1 Boundary-Scan |
EP20K200FC484-2X 484-pin fbga (fineline bga), 1.0 mm pitch Pin Configuration Guide
Pin configuration for EP20K200FC484-2X (484-pin fbga (fineline bga), 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K200FC484-2X.
Refer to the datasheet for full pin configuration.
Typical Applications
EP20K200FC484-2X is suitable for 6 applications: Telecommunications Infrastructure (SONET/SDH Framer), Custom High-Performance DSP Pipeline, Industrial Control and Factory Automation Controller, Legacy ASIC Replacement / System Refresh, Wide-Bus Memory Controller / Glue Logic, Custom Processor Glue Logic / Co-Processor Interface.
Telecommunications Infrastructure (SONET/SDH Framer)
The EP20K200FC484-2X fits SONET/SDH framer designs because of its 200 MHz internal frequency, 106 Kbit embedded SRAM for pointer-processing FIFOs, and 382 user I/Os to directly interface STS-1/STM-1 parallel buses without external muxing. Placed on the line card between the optical transceiver and the network processor, it performs pointer justification, framing, and overhead processing; unlike a generic ASIC it allows late-stage protocol updates. Engineers should budget ~80% of the 8,320 logic elements for full STS-192 framer utilization, leaving headroom for the on-chip PLLs that drive the 155 MHz transmit clocks.
Recommended
Custom High-Performance DSP Pipeline
The EP20K200FC484-2X supports custom DSP pipelines because its embedded array blocks (EABs) can be configured as 256×16 dual-port RAM or 512×8 single-port RAM, ideal for FIR filter tap delay lines. At 200 MHz internal clock, an 8-tap FIR running 16-bit samples sustains ~25 MSPS throughput per channel; multiple channels can be time-multiplexed using the device's 4 PLLs. The device consumes ~1.5 W at full utilization - acceptable for industrial DSP cards but requires thermal vias under the FBGA exposed pad to keep junction below 125 °C.
Recommended
Industrial Control and Factory Automation Controller
The EP20K200FC484-2X suits industrial control because its 382 I/Os handle 32-bit parallel buses plus dozens of discrete control signals without external muxing, and its 106 Kbit embedded memory holds PID loop tables and recipe data. At 200 MHz internal clock, it can poll hundreds of digital I/O channels in microsecond response, while the JTAG 1149.1 interface enables in-system programming for field upgrades. The 0-85 °C commercial temperature range covers most indoor factory environments; for outdoor use, choose the EP20K200FC484-2N industrial variant rated -40 to +100 °C.
Recommended
Legacy ASIC Replacement / System Refresh
The EP20K200FC484-2X is ideal as a drop-in replacement for aging ASICs in legacy telecom or industrial systems because its MultiCore architecture integrates LUT logic, product-term logic, and embedded memory blocks in one device, eliminating the need for external glue logic. Engineers can migrate existing ASIC netlists to the APEX 20K platform using Quartus II design tools, preserving original system functionality while gaining field-upgrade capability via JTAG. Compared to the original ASIC, this approach reduces board complexity from 4-5 ICs down to a single FPGA plus configuration memory.
Recommended
Wide-Bus Memory Controller / Glue Logic
The EP20K200FC484-2X is well-suited for memory controller glue logic because its 382 I/Os directly interface with 64-bit SRAM/DRAM buses plus parity, ECC, and control signals without external bus drivers. At 200 MHz, the device arbitrates multi-bank memory access with sub-5 ns latency, while the embedded EABs can hold address-mapping tables for boot-time remapping. This application uses roughly 30-40% of the 8,320 logic elements, leaving 60% spare for future feature additions - a key advantage over fixed-function ASICs.
Recommended
Custom Processor Glue Logic / Co-Processor Interface
The EP20K200FC484-2X works as a co-processor interface because its 106 Kbit embedded SRAM holds instruction queues and result registers, and its 8,320 logic elements implement custom state machines for offloading tasks from the main processor. The 200 MHz internal clock matches typical embedded processor bus speeds (66-133 MHz), enabling tight coupling with PowerPC, MIPS, or ARM processors. This use case exploits the FPGA's reconfigurability - the co-processor function can be updated in-field without board rework, extending product lifetime.
Recommended
Recommended Products Summary
Engineering reference data for EP20K200FC484-2X — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K200FC484-2N | EP20K200FC484-1X | EP20K200FC484-1XV | EP20K200FC484-1N | EP20K200FC484-2XV | EP20K200EFC484-2X | EP20K200CF484C8 |
|---|---|---|---|---|---|---|---|---|
| Package | 484-pin FBGA | 484-pin FBGA - same | 484-pin FBGA - same | 484-pin FBGA - same | 484-pin FBGA - same | 484-pin FBGA - same | 484-pin FBGA - same | 484-pin FBGA - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Logic Elements | 8,320 | 8,320 | 8,320 | 8,320 | 8,320 | 8,320 | 8,320 | 8,320 |
| System Gates | 200,000 | 200,000 | 200,000 | 200,000 | 200,000 | 200,000 | 200,000 | 200,000 |
| Embedded Memory (bits) | 106,496 | 106,496 | 106,496 | 106,496 | 106,496 | 106,496 | 106,496 | 106,496 |
| Max User I/O | 382 | 382 | 382 | 382 | 382 | 382 | 382 | 382 |
| Speed Grade | -2 (200 MHz) | -2 (200 MHz, no LVDS) | -1 (150 MHz) | -1 (150 MHz, LVDS) | -1 (150 MHz, no LVDS) | -2 (200 MHz, ext 1.8V) | -2 (200 MHz, APEX 20KE) | C8 (~170 MHz) |
| LVDS Support | Yes | No | Yes | Yes | No | Yes | Yes | Yes |
| Temperature Grade | Commercial (0 to 85 °C) | Industrial (-40 to 100 °C) | Commercial | Commercial | Industrial | Commercial | Commercial | Commercial |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- LVDS-capable I/O with APEX 20KE 1.8V support (vs EP20K200FC484-2)
- Fastest speed grade in the APEX 20K family (vs EP20K200FC484-1X)
- Pin-compatible with full APEX 20K FC484 family (vs EP20K400FC484-2X)
- Large embedded memory for FIFOs and dual-port RAM (vs Xilinx XC2S200-5FG456C)
Design Notes
The EP20K200FC484-2X requires separate VCCINT (2.5 V) and VCCIO (1.8 V / 2.5 V / 3.3 V depending on I/O standard) rails, plus a VCCPD (3.3 V) supply for the configuration memory interface. Power sequencing is critical: VCCINT must reach 90% of nominal before VCCIO rises, and VCCIO must be valid before any I/O pin drives a signal. Reverse sequencing can trigger I/O latch-up and permanently damage the device. Use a dedicated power-supply sequencer IC or carefully designed RC network to enforce monotonic ramp-up.
At full 200 MHz utilization with 382 I/Os switching, the EP20K200FC484-2X dissipates approximately 1.5-2.0 W. The 484-pin FBGA package has θJA of approximately 18 °C/W with a properly designed thermal pad array on the PCB. A 4-layer PCB with a continuous ground plane beneath the BGA and at least 16 thermal vias (0.3 mm drill, 1.0 mm pitch) connecting the BGA thermal pad to the inner ground plane is required to keep junction temperature below 125 °C at ambient 70 °C.
Route all 8 PLLs' dedicated clock inputs (CLK0-CLK7) using 50 Ω controlled-impedance microstrip or stripline, with via stubs under 0.5 mm and length-matched within ±50 mils across clock domain pairs. The 484-pin FBGA with 1.0 mm pitch requires 4 mil (0.1 mm) trace width and 4 mil spacing on outer layers, with 6 mil via pads and 12 mil anti-pads. Decouple each VCCINT/VCCIO pin with a 0.1 µF X7R 0402 capacitor placed within 2 mm of the pin, plus a 10 µF bulk tantalum per power plane.
Estimated: BGA breakout traces on the top layer require 4-mil width with 4-mil spacing under the BGA; via-in-pad micro-vias (0.1 mm drill, 0.25 mm pad) are recommended for inner-row signal escapes to maintain signal integrity. Place configuration memory (EPC16 or EPCQ4) within 5 cm of the FPGA DATA, DCLK, and nCONFIG pins to minimize JTAG configuration timing violations.
Do not assume the EP20K200FC484-2X shares configuration bitstreams with EP20K200FC484-2N or EP20K200FC484-1X variants - the LVDS-capable I/O cells require different configuration programming for unused I/O banks. Always regenerate the SOF/POF/JIC programming file via Quartus II for the exact target MPN, even if the source HDL is identical. Another common error is leaving JTAG TCK/TMS/TDI/TDO pins floating - they MUST be tied to known states via 10 kΩ pull-ups to prevent inadvertent JTAG state transitions during power-up.
Compliance Information
Compliance status not explicitly stated in verified web data for this obsolete part. The APEX 20K family predates many current environmental compliance mandates; verify with the original Altera/Intel product documentation or distributor compliance certificates before use in RoHS-restricted markets.
