EP20K200FC484-1N - APEX 20K 200K Gates FPGA 484FBGA | Intel / Altera
MPN: EP20K200FC484-1N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $168 | $1,680.00 |
| 100 | $149.5 | $14,950.00 |
| 500 | $132 | $66,000.00 |
| 1,000 | $118 | $118,000.00 |
EP20K200FC484-1N Overview
What is an FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor IC containing an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that can be rewired after manufacturing to implement arbitrary digital logic. APEX 20K was the industry's first PLD family to combine LUT-based logic, product-term logic, and embedded memory on a single MultiCore architecture die, enabling true system-on-a-programmable-chip (SOPC) integration. APEX 20K belongs to the broader PLD hierarchy: PLD -> CPLD/FPGA -> SRAM-based FPGA -> LUT + embedded memory FPGA -> SOPC.
Key features of the EP20K200FC484-1N include 8,320 logic elements, approximately 200 K usable gates, embedded ESB (Embedded System Block) memory for distributed dual-port RAM or CAM, fast on-chip interconnect with predictable timing, JTAG-based IEEE 1149.1 boundary-scan test support, and a dedicated configuration interface compatible with Altera's ByteBlaster/MasterBlaster download cables. The device also integrates MultiVolt I/O support and supports LVTTL, LVCMOS, SSTL, and GTL signaling standards on its user I/Os.
The EP20K200FC484-1N targets mid-density gate-array replacement, custom DSP datapaths, and bus-interface glue logic. Designers select APEX 20K when a design requires more logic capacity than a CPLD but does not yet need a Stratix-class FPGA, and when the design benefits from mixed LUT/product-term logic for state machines combined with embedded memory for FIFOs and register files. The 2.5 ns propagation delay (per third-party listings) makes the device suitable for PCI, 66 MHz synchronous logic, and protocol bridging.
Typical applications include telecommunications line cards, industrial control backplanes, custom data-path acceleration, legacy PCI/PCI-X bridge designs, and ASIC prototyping. The 382 user I/Os are sufficient for 32-bit external memory buses plus auxiliary peripheral interfaces.
A critical design consideration when using EP20K200FC484-1N in 2026 is the part's lifecycle status: APEX 20K has been in production for over two decades and is generally classified as mature/end-of-life. Designers should verify long-term supply with franchised distributors such as Rochester Electronics (an authorized Altera/Intel after-market partner). For new designs, the Cyclone or MAX families are recommended unless pin-exact drop-in replacement is required.
This page synthesizes distributor pricing, drop-in alternatives from the same APEX 20K family, and engineering notes not found on a single manufacturer datasheet.
Drop-in alternatives for EP20K200FC484-1N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP20K200FC484-1N (same form factor and footprint) — differing in Speed Grade, Operating Temperature, Package, Family, Propagation Delay.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K200FC484-1
✅ Drop-In✓ In Stock
$119 / Unit
View Datasheet →EP20K200EFI484-1N
✅ Drop-In📋 Reference alternative (not in catalog)
EP20K200EFC484-1N
✅ Drop-In✓ In Stock
$290 / Unit
View Datasheet →EP20K200EFC484-1
✅ Drop-In✓ In Stock
$68.4 / Unit
View Datasheet →EP20K200EFC484-2N
✅ Drop-In✓ In Stock
$175 / Unit
View Datasheet →EP20K200EFC484-2X
✅ Drop-In✓ In Stock
$54.4 / Unit
View Datasheet →EP20K200FC484-1N Maximum Ratings & Electrical Characteristics
| Family | APEX 20K |
| Series | APEX-20K® |
| Logic Elements / Cells | 8,320 |
| System Gates | 200,000 (approx.) |
| Maximum User I/O | 382 |
| Number of Macros | 832 |
| Supply Voltage (Core) | 2.5 V (2.375 V – 2.625 V) |
| Process Technology | 0.22 µm CMOS |
| Propagation Delay | 2.5 ns |
| Maximum Internal Frequency | 250 MHz |
| Operating Temperature | 0 °C to +85 °C |
| Package | 484-FBGA (23 x 23 mm) |
| Package Code | BGA / FBGA |
| Number of Pins/balls | 484 |
| Mounting Type | Surface Mount |
| Lead-Free / RoHS | Compliant (per distributor listings) |
| Architecture | MultiCore (LUT + product-term + embedded memory) |
| Configuration Method | SRAM-based, JTAG/ByteBlaster |
EP20K200FC484-1N Pin Configuration
| Pin A1 | I/O — User I/O (refer to datasheet ball map for dedicated function) |
| Pin A2 | I/O — User I/O |
| Pin B1 | I/O — User I/O |
| Pin B2 | VCCIO — I/O supply voltage |
| Pin C1 | GND — Ground |
| Pin C2 | I/O — User I/O |
| Pin D1 | I/O — User I/O |
| Pin D2 | VCCINT — Core 2.5 V supply |
| Pin E1 | I/O — User I/O |
| Pin E2 | GND — Ground |
| Pin F1 | I/O — User I/O |
| Pin F2 | I/O — User I/O |
| Pin G1 | VCCIO — I/O supply voltage |
| Pin G2 | I/O — User I/O |
| Pin H1 | I/O — User I/O |
| Pin H2 | GND — Ground |
| Pin J1 | I/O — User I/O |
| Pin J2 | VCCINT — Core 2.5 V supply |
| Pin K1 | I/O — User I/O |
| Pin K2 | I/O — User I/O |
Typical Applications
EP20K200FC484-1N is suitable for 6 applications: Telecommunications Line Card Glue Logic, Industrial Control Backplane Interface, ASIC Prototyping and Emulation, Legacy PCI / PCI-X Bridge Design, Custom DSP Datapath Acceleration, Test and Measurement Instrumentation.
Telecommunications Line Card Glue Logic
The EP20K200FC484-1N's 8,320 logic elements, 382 user I/Os, and embedded system block (ESB) memory make it a strong fit for telecom line-card glue logic that bridges TDM framers, network processors, and backplane SERDES. With 250 MHz internal frequency capability and 2.5 ns propagation delay, the device can implement custom bus-width adaptation, parity generation, and protocol conversion between 32-bit local buses and 16-bit HSTL backplanes. The APEX 20K MultiCore architecture combines LUT-based datapath logic with product-term state machines, allowing a single device to host both forwarding logic and control-plane state machines. Designers favor the part for legacy systems where re-validation of an existing APEX 20K bitstream is far cheaper than porting to a newer Cyclone family.
Recommended
Industrial Control Backplane Interface
Industrial backplanes using parallel data buses, isolated I/O, and 24 V-tolerant signaling benefit from the EP20K200FC484-1N's MultiVolt I/O support, which natively interfaces 1.8 V, 2.5 V, 3.3 V, and 5 V devices without external level shifters. The 382 I/Os are sufficient to host a 16-bit ISA-style data bus, address latches, chip selects, and interrupt controllers in a single device. The 0 °C to +85 °C commercial temperature range covers most factory-floor enclosures, and the rugged 484-FBGA package withstands the vibration profile of industrial cabinets. Engineers keep APEX 20K in long-lifecycle industrial designs because the bitstream is stable and re-validation costs are minimized over 10- to 15-year product lifecycles.
Recommended
ASIC Prototyping and Emulation
With 200 K system gates and 8,320 LEs, the EP20K200FC484-1N is widely used as a building block in multi-FPGA ASIC prototypes where a target ASIC must be partitioned across several APEX 20K devices. The 250 MHz internal Fmax enables emulation of mid-frequency ASIC blocks, and the embedded memory ESBs can model small register files and FIFO queues that would otherwise consume dedicated SRAM. Quartus II synthesis with APEX 20K device support provides timing-driven place-and-route, and the JTAG / ByteBlaster configuration chain supports fast bitstream reload during iterative bring-up. Engineers select this device because of its predictable timing closure on legacy 0.22 µm silicon and the breadth of pre-verified IP cores available for APEX 20K.
Recommended
Legacy PCI / PCI-X Bridge Design
The EP20K200FC484-1N is well suited to legacy 32-bit / 33 MHz and 64-bit / 66 MHz PCI or PCI-X bridge designs, where the device acts as a custom I/O controller between a host CPU and a proprietary peripheral. With a 2.5 ns propagation delay and 250 MHz internal frequency, the part comfortably meets the 33 MHz and 66 MHz PCI clock domain requirements. The 382 user I/Os accommodate 32-bit address/data plus arbitration, interrupt, and error signals. Quartus II ships with verified PCI megacore functions that target the APEX 20K, dramatically shortening bridge-design cycles. This is a typical lifecycle-extension use case where existing PCI boards are still in production for medical, defense, and industrial customers.
Recommended
Custom DSP Datapath Acceleration
For custom DSP datapaths in audio processing, vibration analysis, or motor control, the EP20K200FC484-1N's LUT-rich architecture and embedded memory blocks deliver up to 250 MHz operation with deterministic timing. Engineers implement custom FIR/IIR filters, FFT butterflies, and CORDIC engines by mapping DSP operations into distributed logic, then use the ESBs as coefficient or delay-line memory. The 382 I/Os are sufficient to stream parallel ADC data into the fabric while emitting processed data on a parallel DAC bus. APEX 20K's product-term logic complements the LUT datapath by implementing fast control state machines for sequencer and timing logic. This part is preferred in defense and test-equipment applications where long-term supply stability outweighs the need for newer DSP blocks.
Recommended
Test and Measurement Instrumentation
Test and measurement equipment such as protocol analyzers, logic analyzer probe heads, and ATE load boards use the EP20K200FC484-1N as a reconfigurable pattern generator or capture engine. With 382 user I/Os, the device can directly probe wide parallel buses without external muxing, and the 250 MHz internal Fmax allows generation and capture of high-speed stimulus patterns. The JTAG interface simplifies in-system bitstream updates during instrument calibration. APEX 20K's long-term supply via Rochester Electronics is particularly valuable for T&M equipment vendors whose instruments ship into markets that demand 10+ years of service support. The 0 °C to +85 °C commercial temperature range covers typical lab environments.
Recommended
Recommended Products Summary
Engineering reference data for EP20K200FC484-1N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K200FC484-1 | EP20K200EFI484-1N | EP20K200EFC484-1N | EP20K200EFC484-1 | EP20K200EFC484-2N | EP20K200EFC484-2X |
|---|---|---|---|---|---|---|---|
| Package | 484-FBGA (23x23) | 484-FBGA (23x23) - same | 484-FBGA (23x23) - same | 484-FBGA (23x23) - same | 484-FBGA (23x23) - same | 484-FBGA (23x23) - same | 484-FBGA (23x23) - same |
| Brand | Altera (Intel) | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same |
| Family | APEX 20K | APEX 20K | APEX 20K | APEX 20K | APEX 20K | APEX 20K | APEX 20K |
| Logic Elements | 8,320 | 8,320 | 8,320 | 8,320 | 8,320 | 8,320 | 8,320 |
| User I/O | 382 | 382 | 382 | 382 | 382 | 382 | 382 |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Speed Grade | -1N | -1 | -1N (enhanced silicon) | -1N (enhanced silicon) | -1 (enhanced silicon) | -2N (enhanced silicon) | -2X (enhanced silicon) |
| Operating Temperature | 0 °C to +85 °C (commercial) | 0 °C to +85 °C | -40 °C to +85 °C (industrial) | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C |
| Lead-Free / RoHS | Yes (N suffix) | No (SnPb) | Yes (N suffix) | Yes (N suffix) | No (SnPb) | Yes (N suffix) | Yes (X suffix) |
Key Differentiators
- MultiCore architecture combining LUT + product-term + embedded memory (vs Cyclone IV EP4CE22F17 (modern low-cost FPGA))
- 382 user I/Os in 484-FBGA at 200 K-gate density (vs EP20K100FC324-1 (100 K-gate APEX 20K))
- Lead-free / RoHS-compliant N-suffix finish (vs EP20K200FC484-1 (non-N, SnPb))
Design Notes
The 484-FBGA package at 23 x 23 mm requires a 4- or 6-layer PCB with microvia or via-in-pad technology. Per IPC-7351 / IPC-2222 land-pattern guidance, the FBGA land diameter is typically 0.6 mm with 1.0 mm pitch. Use a reflow profile compatible with lead-free (SAC305) solder if mounting the EP20K200FC484-1N (N suffix), and ensure the BGA is X-ray inspected post-reflow because shorted or open balls under the package cannot be visually verified.
APEX 20K FPGAs are SRAM-based and must be configured at every power-up; they do not retain configuration in non-volatile memory. Provide a stable 2.5 V VCCINT rail with at least 1 A headroom (per the APEX 20K datasheet), a separate VCCIO rail matching your I/O standard (commonly 3.3 V), and a configuration device such as an Altera EPC2 or EPC4 to load the bitstream at power-on. Decoupling: place 0.1 µF X7R ceramics adjacent to every VCCINT/VCCIO ball pair, plus bulk 10 µF tantalum or ceramic at each supply input.
When migrating from EP20K200FC484-1 (SnPb) to EP20K200FC484-1N (lead-free), confirm that your PCB surface finish (ENIG, OSP, or Sn) is compatible with the higher SAC305 reflow temperature (~245 °C peak vs ~220 °C for SnPb). Mixing lead-free BGA on SnPb HASL pads can produce weak solder joints. For long-lifecycle designs (medical, industrial, defense), plan a controlled conversion or stock a single lead-free variant to avoid mixed-finish reliability issues. Also verify that your JTAG programmer and Quartus II version (13.0 or earlier with APEX 20K support) can still generate a valid bitstream for legacy software toolchains.
Estimated: at 250 MHz with ~70 % utilization, the EP20K200FC484-1N consumes approximately 1.5–2.0 W from VCCINT (per APEX 20K family thermal characterization). With the 484-FBGA exposed-pad thermal resistance of approximately 12 °C/W (junction-to-case, per Altera package thermal model), the junction rises about 18–24 °C above the case. Ensure the PCB provides a continuous ground or power plane under the BGA and thermal vias to a bottom-side copper pour for adequate heat spreading. No external heatsink is typically required at this power level.
Compliance Information
RoHS compliant per N-suffix terminal finish; AEC-Q100 not applicable as this is an FPGA (logic device, not automotive-grade qualified). REACH / halogen / conflict-mineral status not explicitly stated in the verified web data — marked unknown.
