EP20K30ETC144-1X - APEX-20KE FPGA, 30K Gates, 92 I/O, 144-LQFP | Intel
MPN: EP20K30ETC144-1X ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $33.2 | $332.00 |
| 100 | $27.85 | $2,785.00 |
| 250 | $24.1 | $6,025.00 |
| 500 | $21.4 | $10,700.00 |
EP20K30ETC144-1X Overview
An FPGA (Field Programmable Gate Array) is a type of programmable logic device (PLD) containing configurable logic blocks (LABs/CLBs), programmable interconnect, and I/O cells that can be rewired after manufacture. FPGAs sit in the broader taxonomy of programmable logic (PLD -> CPLD -> FPGA -> SoC FPGA) and are used to implement arbitrary digital logic, glue logic, DSP pipelines, and full processor subsystems when the silicon is large enough. The APEX-20KE family is a MultiCore architecture that combines Look-Up Table (LUT)-based logic with embedded memory blocks (ESBs) for high-density, system-on-a-programmable-chip (SOPC) designs.
Key features include 1,200 logic elements (cells), 24,576 total RAM bits distributed across embedded system blocks, 92 user I/O pins, and 113,000 maximum system gates. The device supports in-system programmability via SRAM configuration, hot-socketing, and multi-voltage I/O. The 144-LQFP package uses a 0.5 mm pitch gull-wing lead frame and is suitable for cost-sensitive, moderate-density designs that do not require the fine-pitch or high-speed transceivers of newer families.
The APEX-20KE architecture combines fine-grain LUTs with coarse-grain ESBs, allowing efficient implementation of wide datapath functions, multipliers, and small FIFOs. The 0.22 µm CMOS process is mature and supports the 1.8 V core voltage with 3.3 V/5 V-tolerant I/O via banked VCCIO pins (referenced in the datasheet), enabling direct interface to legacy TTL/CMOS peripherals without external level shifters.
Typical applications include communications glue logic, industrial control interfaces, video and image processing front-ends, legacy ASIC prototyping, and educational development platforms. The 92 I/Os in a 144-LQFP package balance logic capacity with board-level routability for prototype through small-volume production runs.
When designing with this device, plan the configuration scheme (EPC configuration device or microprocessor-driven passive serial/parallel), respect the I/O bank VCCIO grouping shown in the pinout, and ensure the Quartus II design tool (or MAX+PLUS II for legacy flows) supports the EP20K30E device variant.
This page synthesizes distributor stock and pricing, verified pin-compatible alternatives, and practical design notes not consolidated in any single manufacturer or distributor page.
Drop-in alternatives for EP20K30ETC144-1X — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP20K30ETC144-1X (same form factor and footprint) — differing in Operating Temperature, Propagation Delay, Mounting Type, Family, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K30ETC144-1
✅ Drop-In✓ In Stock
$28.73 / Unit
View Datasheet →EP20K30ETC144-2X
✅ Drop-In✓ In Stock
$19.85 / Unit
View Datasheet →EP20K30ETC144-2
✅ Drop-In📋 Reference alternative (not in catalog)
EP20K100ETC144-1X
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$23.1 / Unit
View Datasheet →EP20K160ETC144-2N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$82 / Unit
View Datasheet →EP20K30ETC144-1X Maximum Ratings & Electrical Characteristics
| Series | APEX-20KE |
| Family | APEX 20K |
| Typical Gates | 30,000 |
| Maximum System Gates | 113,000 |
| Number of Logic Elements / Cells | 1,200 |
| Number of LABs / CLBs | 120 |
| Total RAM Bits | 24,576 |
| Number of User I/Os | 92 |
| Supply Voltage (Core) | 1.71 V to 1.89 V |
| Process Technology | 0.22 µm CMOS |
| Core Voltage | 1.8 V |
| Propagation Delay | 1.68 ns (per datasheet graph reference) |
| Internal Frequency (max) | 160 MHz (per DigChip datasheet entry) |
| Package | 144-LQFP (20x20 mm, 0.5 mm pitch) |
| Mounting Type | Surface Mount |
| Operating Temperature | 0 °C to +85 °C (TJ) |
| Configuration | SRAM-based, in-system programmable |
EP20K30ETC144-1X 144-lqfp (20x20 mm, 0.5 mm pitch) Pin Configuration Guide
Pin configuration for EP20K30ETC144-1X (144-lqfp (20x20 mm, 0.5 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K30ETC144-1X.
Refer to the datasheet for full pin configuration.
Typical Applications
EP20K30ETC144-1X is suitable for 6 applications: Legacy Industrial Control Logic Replacement, Telecom Glue Logic and Protocol Bridging, Educational FPGA Development Platform, Video and Image Processing Front-End, ASIC Prototype and Emulation, Legacy Avionics Display Driver.
Legacy Industrial Control Logic Replacement
The EP20K30ETC144-1X is a direct fit for maintaining installed industrial control systems originally built around APEX-20KE designs, where the firmware is locked to the 1,200-LE silicon and 92-I/O bank topology. Its 24,576 RAM bits accommodate process-state buffers and small lookup tables used in PLC scan engines. Designers benefit from the 144-LQFP hand-solderable footprint for field rework when a programmed configuration device fails on the line. Compared with modern Cyclone equivalents, the EP20K30ETC144-1X avoids the multi-day revalidation required when porting to new silicon, and its mature 0.22 µm CMOS process delivers predictable timing margin across 0 °C to 85 °C operating environments typical of factory-floor cabinets.
Recommended
Telecom Glue Logic and Protocol Bridging
The EP20K30ETC144-1X fits telecom backplane glue-logic roles where it bridges legacy TDM/PCM buses, UARTs, and SPI peripherals to a modern processor. Its 120 LABs/CLBs and 1,200 logic elements deliver enough capacity for multi-channel protocol converters without external CPLDs, while the 92 user I/Os absorb abundant parallel bus pins in 144-LQFP. The device's 1.68 ns propagation delay per internal logic element keeps latency low for HDLC or custom serial-protocol state machines. I/O banks tolerate 3.3 V signalling, allowing direct connection to legacy telecom ASICs without level shifters, and the 24,576 bits of embedded RAM serve as elastic buffers for clock-domain crossing between TDM and packet networks.
Recommended
Educational FPGA Development Platform
Universities and training labs use the EP20K30ETC144-1X as a teaching vehicle for Verilog/VHDL fundamentals because the APEX-20KE family is supported by legacy Quartus II versions, which remain free to download. The 1,200 logic elements and 24,576 RAM bits offer enough headroom for student projects ranging from UART controllers to small RISC cores, while the 92-I/O 144-LQFP package is breadboard-friendly with standard 0.1-inch headers. The mature 1.8 V core simplifies power-tree design on lab benches, and the device's multi-voltage I/O banks let students interface 5 V sensors directly. Compared with modern dev kits, the EP20K30ETC144-1X provides authentic FPGA-design experience at minimal per-seat cost.
Recommended
Video and Image Processing Front-End
The EP20K30ETC144-1X suits front-end video-processing tasks such as color-space conversion, line buffering, and sync insertion in legacy broadcast equipment. Its 24,576 embedded RAM bits host line buffers for a single NTSC/PAL line (720x10 bits), and 1,200 logic elements implement pixel-pipeline combinational logic at video clock rates. The 92 user I/Os accommodate parallel ITU-R BT.601 video buses plus I2C control and JTAG. The 144-LQFP package is well-suited to low-volume professional broadcast equipment where field-reworkability matters more than PCB density. I/O bank VCCIO flexibility lets the device sit directly between 3.3 V video ADCs and 5 V sync drivers.
Recommended
ASIC Prototype and Emulation
Engineers use the EP20K30ETC144-1X as a low-cost ASIC emulation platform when validating control logic, register interfaces, or peripheral glue before committing to a mask set. The SRAM-based configuration allows rapid design-iteration cycles (program in seconds via JTAG), and 1,200 logic elements represent roughly 30K ASIC gates, enough to emulate typical peripheral controllers. The 144-LQFP package and 92 I/Os map cleanly to standard ASIC prototyping boards with 0.5 mm-pitch headers. Compared with ASIC NRE, the EP20K30ETC144-1X offers fully re-programmable silicon for under $40 per unit as of 2026-09-08, a compelling trade-off for low-volume production runs.
Recommended
Legacy Avionics Display Driver
The EP20K30ETC144-1X maintains fielded avionics display-driver boards where reliability history and DO-160 qualification artifacts favor preserving the original silicon. Its 1.8 V core and 0.22 µm CMOS process deliver predictable radiation-tolerance margins for cabin-pressurized flight environments, and 92 I/Os drive segmented LCD/LED displays with parallel backplane timing. The 24,576 RAM bits support character-generator ROM and small frame buffers for monochrome cockpit indicators. The 144-LQFP package withstands the conformal-coating and vibration profiles common in avionics LRUs. Compared with newer FPGAs, the EP20K30ETC144-1X avoids re-certification cost when only a single line-replaceable unit is being reproduced.
Recommended
Recommended Products Summary
Engineering reference data for EP20K30ETC144-1X — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K30ETC144-1 | EP20K30ETC144-2X | EP20K30ETC144-2 | EP20K100ETC144-1X | EP20K160ETC144-2N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 144-LQFP (20x20 mm) | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same |
| Logic Elements | 1,200 | 1,200 | 1,200 | 1,200 | 4,000 | 6,400 |
| Total RAM Bits | 24,576 | 24,576 | 24,576 | 24,576 | 49,152 | 81,920 |
| User I/Os | 92 | 92 | 92 | 92 | 92 | 92 |
| Speed Grade | -1X | -1 (commercial temp) | -2X (extended temp, faster) | -2 (commercial temp, faster) | -1X (extended temp) | -2N (industrial, lead-free) |
| Operating Temperature | 0 °C to +85 °C (TJ) | 0 °C to +70 °C | 0 °C to +85 °C | 0 °C to +70 °C | 0 °C to +85 °C | -40 °C to +85 °C |
| Core Voltage | 1.8 V (1.71 V to 1.89 V) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Extended commercial 0-85°C temperature grade vs commercial 0-70°C (vs EP20K30ETC144-1)
- Same package and pinout as speed-grade -2X variant (vs EP20K30ETC144-2X)
- Higher density option available in same package family (vs EP20K100ETC144-1X)
Design Notes
The APEX-20KE core operates from a 1.71 V to 1.89 V supply, and I/O banks require separate VCCIO rails (typically 1.8 V, 2.5 V, or 3.3 V depending on the I/O standard). Decouple each VCC/VCCIO pin with a 0.1 µF ceramic capacitor placed within 3 mm of the package pad, and add a single 33 µF tantalum or polymer bulk capacitor near the device. The EP20K30ETC144-1X consumes up to ~0.5 W ICC core current at full toggle rate; ensure the LDO or DC-DC regulator has at least 1 A headroom. Power-rail sequencing is not strictly required but matching VCCINT and VCCIO ramp within 100 ms prevents latch-up risk.
Configuration device selection: the EP20K30ETC144-1X requires an EPC2, EPC4, EPC8, EPC16, or compatible SRAM configuration memory in serial or parallel mode. Estimated: the 1,200-LE bitstream for a fully utilized design is roughly 0.6 Mbit, well within EPC2 (2 Mbit). A common pitfall is leaving nCONFIG floating during power-up, which causes undefined initialization states; tie nCONFIG through a 10 kΩ pull-up to VCCINT. JTAG chain integrity must include a 10 kΩ pull-up on TCK per the APEX-20KE datasheet, and unused I/O pins must be set to output-disabled with weak pull-up in the Quartus II pin planner to avoid floating inputs.
The 144-LQFP package has a higher thermal resistance than the BGA equivalents in the same silicon family. Estimated: with theta_JA of approximately 35 °C/W (typical JEDEC still-air) and worst-case 0.7 W dissipation, junction temperature rises 24 °C above ambient, leaving only ~60 °C margin at 85 °C ambient. For enclosed enclosures or industrial temperature grades, add a small clip-on heatsink or copper pour on the top layer beneath the package. The EP20K30ETC144-1X does not include an exposed thermal pad; cooling relies entirely on PCB copper area and forced airflow.
Place the EPC configuration memory within 5 cm of the EP20K30ETC144-1X to keep DCLK trace reflections under control. Use a 33 Ω series termination on DCLK if the trace exceeds 50 mm. I/O bank VCCIO pins must all be powered, even if unused, or the bank is disabled internally and adjacent banks may exhibit noise coupling. For mixed-voltage designs, group 3.3 V peripherals on one I/O bank and 1.8 V peripherals on a separate bank to simplify power-tree layout. The 144-LQFP lead frame requires ~10 mil clearance between fine-pitch SOIC peripherals and the FPGA body for hand-rework access.
Compliance Information
Original APEX-20KE family predates mandatory RoHS compliance. Exact RoHS/REACH status for EP20K30ETC144-1X was not confirmed in the verified web data - flagged as unknown. The 144-LQFP package historically used SnPb lead finish; lead-free variants typically carry an 'N' suffix (e.g., EP20K30ETC144-1N). All five alternatives are from Intel/Altera, sharing the same compliance uncertainty.
