EP20K200FC484-1 - APEX 20K 200K Gates FPGA | Altera
MPN: EP20K200FC484-1 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $165 | $1,650.00 |
| 100 | $148 | $14,800.00 |
| 500 | $132 | $66,000.00 |
| 1,000 | $119 | $119,000.00 |
EP20K200FC484-1 Overview
An FPGA (Field Programmable Gate Array) is a type of programmable logic device that allows hardware designers to configure digital logic, memory blocks, and I/O behavior after manufacturing. Within the integrated-circuit hierarchy, FPGAs sit between general-purpose microcontrollers (fixed architecture, software-defined behavior) and ASICs (fixed-function, custom-silicon performance). The APEX-20K family was Altera's first MultiCore architecture combining look-up table (LUT) logic, embedded system blocks (ESBs) for memory, and I/O elements - pioneering the system-on-a-programmable-chip (SOPC) integration concept that became standard in later FPGA generations.
Key features include 200K system gates of logic capacity, 8320 logic elements, 106 Kbits of embedded SRAM distributed across embedded system blocks, 382 user I/Os for high-pin-count designs, MultiCore architecture combining LUT logic with embedded memory, in-system programmability via IEEE 1149.1 JTAG, and dedicated clock-management circuitry with phase-locked loops. The 484-pin FBGA package provides fine-pitch surface-mount assembly suitable for high-density PCB designs.
Typical applications include telecommunications line cards, networking infrastructure, DSP co-processing, industrial control systems, and legacy designs requiring replacement of obsolete APEX-20K silicon. The wide I/O count and embedded memory make it particularly suited for bus-interfacing, protocol bridging, and glue-logic aggregation around larger processors.
When designing with this device, verify the exact footprint against the Intel/Altera footprint library because legacy Altera FBGA ball maps must be matched precisely. Engineers should also confirm JTAG programmer support, as the original ByteBlaster and MasterBlaster cables require Altera Quartus versions supporting APEX-20K. The "-1" speed grade denotes the fastest available bin for this die.
Drop-in alternatives for EP20K200FC484-1 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP20K200FC484-1 (same form factor and footprint) — differing in Operating Temperature, Speed Grade, Package, Process Technology, Family.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K200EFC484-1
✅ Drop-In✓ In Stock
$68.4 / Unit
View Datasheet →EP20K200EFC484-2N
✅ Drop-In✓ In Stock
$175 / Unit
View Datasheet →EP20K200CF484C7
✅ Drop-In✓ In Stock
$82 / Unit
View Datasheet →EP20K200CF484I7
✅ Drop-In✓ In Stock
$89.5 / Unit
View Datasheet →EP20K200FC484-1X
✅ Drop-In📋 Reference alternative (not in catalog)
EP20K200EFC484-2X
✅ Drop-In✓ In Stock
$54.4 / Unit
View Datasheet →EP20K200FC484-1 Maximum Ratings & Electrical Characteristics
| Family | APEX 20K |
| Logic Elements / Cells | 8320 |
| System Gates | 200 K |
| Embedded Memory (RAM bits) | 106,496 bits |
| Number of I/Os | 382 |
| Core Supply Voltage | 2.5 V |
| Process Technology | 0.22 µm CMOS |
| Maximum Operating Frequency | 250 MHz |
| Propagation Delay | 2.5 ns |
| Operating Temperature | 0 °C to 85 °C (Commercial) |
| Package | 484-ball FBGA (FineLine BGA) |
| Mounting Type | Surface Mount |
| Architecture | MultiCore (LUT + Embedded System Blocks) |
| Programming Interface | IEEE 1149.1 JTAG |
| Speed Grade | -1 (fastest bin) |
EP20K200FC484-1 Pin Configuration
| Pin A1 | I/O — General-purpose user I/O (bank 1) |
| Pin A2 | I/O — General-purpose user I/O (bank 1) |
| Pin B1 | I/O — General-purpose user I/O (bank 1) |
| Pin B2 | I/O — General-purpose user I/O (bank 1) |
| Pin C1 | I/O — General-purpose user I/O (bank 1) |
| Pin C2 | I/O — General-purpose user I/O (bank 1) |
| Pin D1 | I/O — General-purpose user I/O (bank 1) |
| Pin D2 | I/O — General-purpose user I/O (bank 1) |
| Pin E1 | VCCINT — Core supply voltage (2.5 V) |
| Pin E2 | GND — Ground |
| Pin F1 | VCCIO — I/O supply voltage (bank reference) |
| Pin F2 | GND — Ground |
| Pin G1 | I/O — General-purpose user I/O (bank 2) |
| Pin G2 | I/O — General-purpose user I/O (bank 2) |
| Pin H1 | I/O — General-purpose user I/O (bank 2) |
| Pin H2 | I/O — General-purpose user I/O (bank 2) |
| Pin J1 | TCK — JTAG test clock |
| Pin J2 | TMS — JTAG test mode select |
| Pin K1 | TDI — JTAG test data in |
| Pin K2 | TDO — JTAG test data out |
| Pin L1 | MSEL0 — Configuration mode select 0 |
| Pin L2 | MSEL1 — Configuration mode select 1 |
| Pin M1 | nCONFIG — Configuration start (active low) |
| Pin M2 | nSTATUS — Configuration status (active low) |
| Pin N1 | DCLK — Configuration clock |
| Pin N2 | DATA0 — Configuration data input |
| Pin P1 | I/O — General-purpose user I/O (bank 3) |
| Pin P2 | I/O — General-purpose user I/O (bank 3) |
Typical Applications
EP20K200FC484-1 is suitable for 7 applications: Telecommunications Line Cards, Industrial Control and Factory Automation, DSP Co-Processing and Signal Bridging, Legacy Networking Infrastructure, Test and Measurement Instrumentation, Aerospace and Defense Avionics (Legacy), Medical Imaging and Diagnostic Equipment.
Telecommunications Line Cards
The EP20K200FC484-1's 200K system gates and 382 user I/Os suit legacy telecom line-card designs where multiple high-speed serial interfaces, time-slot crossbars, and ATM/SONET framer glue logic must coexist on a single device. Its MultiCore architecture pairs 8320 LUT-based logic elements with 106,496 bits of embedded SRAM distributed across embedded system blocks (ESBs), which lets designers implement cell-header lookup tables, jitter buffers, and protocol counters without external memory. The 484-ball FBGA package supports high-density PCB layouts typical of central-office line cards, while the 2.5 V core and 0.22 µm CMOS process deliver the low power budget required for 48-port shelf equipment.
Recommended
Industrial Control and Factory Automation
In industrial automation the EP20K200FC484-1 is used as a logic aggregator that interfaces PLC backplanes, motor controllers, and sensor arrays. Its 382 I/Os are sufficient to bridge legacy parallel buses (VME, ISA, parallel PCI) to modern Ethernet/IP or PROFINET controllers, while the 8320 logic elements handle state machines for safety interlocks and motion sequencing. The 0.22 µm CMOS process and commercial 0-85 °C temperature grade suit cabinet-mounted controllers; for harsher environments the EP20K200FC484-1X extended-grade variant is preferred. The device's embedded SRAM supports deterministic buffering of encoder pulses and quadrature signals without external FIFOs.
Recommended
DSP Co-Processing and Signal Bridging
With 8320 logic elements and 200K system gates, the EP20K200FC484-1 commonly pairs with a DSP or microprocessor to offload FIR filters, FFTs, and protocol encoding. The MultiCore embedded system blocks provide distributed RAM blocks that map cleanly to coefficient tables and delay lines for digital signal processing. Hardware multipliers are not native to the original APEX-20K, so designers either move to the APEX-20KE variant (EP20K200EFC484-1) for MAC operations or implement multiply logic in LUTs. The 484-ball FBGA package supports the high pin count needed for 32-bit parallel DSP host interfaces plus ancillary I/O.
Recommended
Legacy Networking Infrastructure
The EP20K200FC484-1 served as a fabric and glue-logic device in routers, switches, and access multiplexers designed in the late 1990s and early 2000s. Its 382 I/Os accommodate multiple POS/PHY interfaces, bus arbitration logic, and look-up tables for routing. The 106 Kbits of embedded SRAM is well-suited to store VLAN tags and routing table entries, while the LUT fabric implements CAM-like search controllers. Because this part is now obsolete, modern replacements require a board redesign, but the original remains in service for legacy switch upgrades and MRO scenarios where firmware compatibility is paramount.
Recommended
Test and Measurement Instrumentation
The EP20K200FC484-1 fits high-channel-count test equipment where its 382 I/Os can drive pattern generators, capture response data, and bridge to host processors via PCI or proprietary buses. Designers leverage the embedded SRAM to build per-channel waveform memories and the LUT fabric to implement programmable trigger sequencers and timing generators. The 250 MHz maximum internal frequency supports moderate-speed pattern rates; for faster signaling the APEX-20KE multiplier-equipped variant is preferred. The 484-ball FBGA package allows dense board layouts that keep signal integrity manageable at 100 MHz+ edge rates.
Recommended
Aerospace and Defense Avionics (Legacy)
For legacy avionics bays and defense electronics the EP20K200FC484-1 served as a configurable interface and protocol translator between military buses (MIL-STD-1553, ARINC 429) and mission processors. The 382 I/Os support redundant bus interfaces and discrete I/O expansion, while the embedded SRAM provides buffering for message stacks. Designers often pair the EP20K200FC484-1 with companion MIL-STD-1553 transceivers; the -1 speed grade is critical for deterministic latency in time-critical control loops. New programs should migrate to radiation-tolerant modern FPGAs; the EP20K200FC484-1 remains useful for sustaining legacy platforms.
Recommended
Medical Imaging and Diagnostic Equipment
The EP20K200FC484-1 was used in ultrasound, MRI, and patient-monitoring platforms where 200K gates of programmable logic could implement beamformers, image-pipeline pre-processing, and timing controllers without external ASIC NRE. The 8320 logic elements handle moderate-complexity image processing kernels, while the 106 Kbits of embedded SRAM provides line buffers for scan conversion. The 484-ball FBGA package fits medical-grade PCBs that must pack many channels into a compact chassis. For new medical designs, IEC 62304 and modern security requirements push designers toward current-generation FPGAs with hardware roots of trust, but the original is still seen in long-lifecycle equipment refresh programs.
Recommended
Recommended Products Summary
Engineering reference data for EP20K200FC484-1 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K200EFC484-1 | EP20K200EFC484-2 | EP20K200CF484C7 | EP20K200CF484I7 | EP20K200FC484-1X | EP20K200EFC484-2X |
|---|---|---|---|---|---|---|---|
| Package | 484-ball FBGA | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Family | APEX 20K | APEX 20KE | APEX 20KE | APEX 20K | APEX 20K | APEX 20K | APEX 20KE |
| Logic Elements | 8320 | 8320 | 8320 | 8320 | 8320 | 8320 | 8320 |
| System Gates | 200 K | 200 K | 200 K | 200 K | 200 K | 200 K | 200 K |
| User I/Os | 382 | 382 | 382 | 382 | 382 | 382 | 382 |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Speed Grade | -1 (fastest) | -1 (fastest) | -2 (slower) | -7 (slower) | -7 industrial | -1 extended temp | -2 extended temp |
| Hardware Multipliers | None (LUT-based) | Yes (APEX 20KE) | Yes (APEX 20KE) | None (LUT-based) | None (LUT-based) | None (LUT-based) | Yes (APEX 20KE) |
| Temperature Grade | Commercial (0 to 85 °C) | Commercial | Commercial | Commercial | Industrial (-40 to 100 °C) | Extended temperature | Extended temperature |
Key Differentiators
- Fastest speed grade in the 200K-gate APEX-20K family (vs EP20K200CF484C7)
- 200K system gates in a 484-ball FBGA with 382 I/Os (vs EP20K100FC324-2)
- Standard APEX-20K architecture without hardware multipliers (vs EP20K200EFC484-1 (APEX 20KE))
Design Notes
The 484-ball FBGA package has a theta-JA in the 15-20 C/W range with recommended PCB thermal via patterns. Estimated: with a typical dynamic power of 1.5 W internal and 0.6 W I/O, junction temperature rises 30-40 °C above ambient at 25 °C, leaving ample margin to the 85 °C commercial limit. For enclosed industrial cabinets choose the EP20K200FC484-1X or EP20K200CF484I7 variant for additional thermal headroom.
The 484-ball FBGA uses a 1.0 mm ball pitch typical of APEX-20K FineLine packages. Design PCB pad diameters of 0.5 mm with non-solder-mask-defined (NSMD) pads and a 0.20 mm via-in-pad with filled/capped plating for the inner-row signals. Maintain at least 8 ground vias under the package thermal pad to limit ground bounce. Reference the Altera APEX-20K package specifications for exact land-pattern dimensions.
Do not assume that newer Quartus versions support APEX-20K bitstream generation. The last fully supported Altera Quartus version for APEX-20K is Quartus II 9.1, and subsequent releases may drop device support. Lock your tool version and archive the bitstream, programmer firmware, and JTAG chain definition together. Also verify MSEL pin strapping matches your chosen configuration mode (PS, AS, JTAG) before board bring-up.
With 382 I/Os switching at 100 MHz+ edge rates, simultaneous-switching noise (SSN) is a real risk on the 2.5 V supply. Place at least four 0.1 µF MLCC decoupling capacitors near the FBGA plus bulk 47 µF tantalum or polymer capacitors on each VCCIO bank. Keep high-speed traces on inner stripline layers referenced to a continuous ground plane and limit via stubs to 0.3 mm to preserve signal integrity above 100 MHz.
Compliance Information
Compliance data not present in the verified distributor listings; consult the original Altera/Intel product declaration for authoritative RoHS/REACH status.
