EP20K400GC655-1 - 400K Gate APEX 20K FPGA, 655-pin CPGA | Intel/Altera
MPN: EP20K400GC655-1 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $193.04 | $193.04 |
| 10 | $178.5 | $1,785.00 |
| 100 | $162 | $16,200.00 |
| 500 | $148.25 | $74,125.00 |
| 1,000 | $135 | $135,000.00 |
EP20K400GC655-1 Overview
An FPGA (Field Programmable Gate Array) is a programmable logic device that combines LUT-based logic, product-term logic, and embedded memory blocks on a single die. The APEX 20K series was the industry's first PLD family to integrate MultiCore architecture that fuses look-up table logic with embedded system blocks, enabling true system-on-a-programmable-chip (SOPC) integration. Within the broader taxonomy, the EP20K400 sits at the intersection of FPGA, programmable logic device (PLD), and system-on-chip integration - bridging discrete logic and ASIC-class functionality.
Key features include up to 502 user I/O pins, 4 embedded system blocks (ESBs) totaling 212,992 bits of RAM, a 32-bit FastTrack interconnect routing fabric, and JTAG-compliant IEEE 1149.1 boundary-scan test support. The device supports in-system programmability via passive serial, passive parallel asynchronous, and passive parallel synchronous configuration modes, with optional EPC configuration devices.
The EP20K400 uses 0.22 µm CMOS technology on a 2.5 V core with 3.3 V I/O compatibility, providing a propagation delay as low as 2.5 ns. The MultiCore architecture enables designers to instantiate LUT-based logic, product-term logic, and dual-port RAM within the same device, eliminating the need for separate glue logic and memory chips.
Typical applications include telecommunications infrastructure (SONET/SDH framer ICs, ATM switching), high-speed data acquisition, DSP preprocessing, encryption engines, and industrial control systems. The large gate count and embedded memory make the EP20K400 suitable for designs that would otherwise require multiple discrete FPGAs or ASICs.
When designing with the EP20K400GC655-1, plan power sequencing to bring the 2.5 V core up before or simultaneously with I/O banks to avoid latch-up. The ceramic CPGA package requires careful thermal management - consider forced-air cooling for sustained junction temperatures above 100 °C, and use socketed mounting for prototyping with the through-hole pin grid.
This page synthesizes distributor availability, same-family drop-in alternatives from the Site MPN library, and practical design notes not found in the manufacturer's datasheet - giving engineers a single source for sourcing and second-source decisions on legacy APEX 20K designs.
Drop-in alternatives for EP20K400GC655-1 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP20K400GC655-1 (same form factor and footprint) — differing in Family, Series, Operating Temperature, Package, Package Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K400BC652-1X
✅ Drop-In✓ In Stock
$140 / Unit
View Datasheet →EP20K400BC652-1XV
✅ Drop-In✓ In Stock
$115 / Unit
View Datasheet →EP20K400BC652-1
✅ Drop-In✓ In Stock
$108 / Unit
View Datasheet →EP20K400GC652-1XV
✅ Drop-In✓ In Stock
$190 / Unit
View Datasheet →EP20K400EBC652-1
✅ Drop-In✓ In Stock
$110 / Unit
View Datasheet →EP20K400EBC652-1X
✅ Drop-In✓ In Stock
$92 / Unit
View Datasheet →EP20K400GC655-1 Maximum Ratings & Electrical Characteristics
| Family | APEX 20K |
| Series | EP20K400 |
| Logic Elements | 16,640 |
| Maximum Gates | 1,052,000 |
| Typical Gates | 400,000 |
| Embedded System Blocks (ESBs) | 4 |
| Total RAM Bits | 212,992 |
| Maximum User I/O | 502 |
| Dedicated Inputs | 6 |
| Process Technology | 0.22 µm CMOS |
| Core Supply Voltage | 2.5 V |
| I/O Supply Voltage | 3.3 V |
| Maximum Internal Frequency | 250 MHz |
| Propagation Delay | 2.5 ns |
| Package | 655-pin CPGA (Ceramic Pin Grid Array) |
| Pin Count | 655 |
| Mounting Type | Through-Hole |
| Operating Temperature | 0 °C to +85 °C (commercial) |
| Configuration Modes | Passive Serial, Passive Parallel Async, Passive Parallel Sync |
| Boundary Scan | IEEE 1149.1 (JTAG) |
| RoHS Status | Non-compliant (contains lead in ceramic package) |
EP20K400GC655-1 655-pin cpga (ceramic pin grid array) Pin Configuration Guide
Pin configuration for EP20K400GC655-1 (655-pin cpga (ceramic pin grid array) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K400GC655-1.
Refer to the datasheet for full pin configuration.
Typical Applications
EP20K400GC655-1 is suitable for 6 applications: Telecommunications Infrastructure (SONET/SDH), Industrial Process Control Systems, Military and Aerospace Avionics, High-Speed Data Acquisition Systems, ASIC Prototyping and Emulation, Medical Imaging Equipment.
Telecommunications Infrastructure (SONET/SDH)
The EP20K400GC655-1's 400,000-gate logic capacity and 212,992 bits of embedded RAM suit SONET/SDH framer and mapper designs where parallel datapath processing meets tight jitter budgets. With 502 user I/Os and 250 MHz FastTrack interconnect, the device absorbs full STS-192 overhead processing plus auxiliary payload functions without external glue logic. The 2.5 ns propagation delay enables 155 MHz POS-PHY level-3 interfacing, while the 3.3 V I/O banks interface directly to legacy ATM SAR chips and clock-recovery PLLs. Engineers deploying this part in carrier-grade equipment should retain the ceramic CPGA package for proven long-term reliability in controlled-environment central offices.
Recommended
Industrial Process Control Systems
The EP20K400GC655-1 fits industrial PLC backplanes and process controllers that integrate PID loops, encoder interfaces, and fieldbus bridges on a single programmable device. Its 502 user I/Os consolidate multiple discrete I/O channels and the 4 embedded system blocks (ESBs) provide deterministic dual-port RAM for inter-task messaging. The 0.22 µm CMOS process and ceramic CPGA package have demonstrated long-term thermal stability in factory-floor deployments, with junction temperature ratings supporting 0 °C to +85 °C commercial operation. For modern designs, pair the EP20K400 with an external Ethernet MAC and PROFIBUS transceiver to maintain fieldbus compatibility.
Recommended
Military and Aerospace Avionics
The EP20K400GC655-1 in its ceramic CPGA-655 package is qualified for legacy military avionics programs where hermetic packaging and proven reliability outweigh modern SMT preferences. The 400K-gate capacity supports flight-control co-processors, navigation Kalman filters, and radar preprocessing pipelines operating at up to 250 MHz internal frequency. With 212,992 bits of dual-port RAM, the device handles real-time sensor fusion without external memory contention. Designers maintaining these systems should source factory-traceable inventory through Rochester Electronics to ensure continued airworthiness certifications.
Recommended
High-Speed Data Acquisition Systems
The EP20K400GC655-1's parallel processing architecture fits multi-channel ADC aggregation systems where 16-bit converters at 100 MSPS feed the FPGA's 502 user I/Os for real-time DSP preprocessing. The 4 embedded system blocks enable distributed FIFO buffering across acquisition channels, while 250 MHz FastTrack interconnect handles cross-channel correlation algorithms. The 2.5 ns propagation delay on combinational paths ensures deterministic latency critical for pulse-timing measurements. Typical designs implement FIR filtering, FFT pre-processing, and trigger detection within a single EP20K400, replacing multiple lower-density FPGAs.
Recommended
ASIC Prototyping and Emulation
The EP20K400GC655-1 is widely used as an ASIC prototyping vehicle where its 1,052,000-maximum-gate capacity and JTAG boundary-scan support accelerate pre-silicon validation. The MultiCore architecture lets designers instantiate LUT logic, product-term logic, and dual-port RAM within a single device, accurately modeling ASIC cell libraries. The 502 user I/Os serve as test fixture connection points, while configuration via JTAG enables rapid bitstream iteration. For multi-FPGA ASIC emulation, multiple EP20K400GC655-1 devices can be cascaded through their dedicated FastTrack channels with predictable timing closure.
Recommended
Medical Imaging Equipment
The EP20K400GC655-1 has historically powered ultrasound beamformers and CT image reconstruction pipelines where its parallel DSP blocks and 502 user I/Os enable multi-channel processing. With 212,992 bits of embedded RAM, the device holds scan-line buffers for real-time image rendering, while the 250 MHz FastTrack interconnect supports 64-tap FIR filtering across multiple transducer channels. The ceramic CPGA package ensures long-term reliability in regulated medical environments. For new medical designs, the EP20K400's IEC 60601-1 compliance history and pin-compatible BGA variants like EP20K400BC652-1X remain attractive for refresh programs.
Recommended
Recommended Products Summary
Engineering reference data for EP20K400GC655-1 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K400BC652-1X | EP20K400BC652-1XV | EP20K400BC652-1 | EP20K400GC652-1XV |
|---|---|---|---|---|---|
| Package | 655-pin CPGA (Ceramic Pin Grid Array) | BGA-652 | BGA-652 | BGA-652 | CPGA-652 |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Family | APEX 20K | APEX 20K | APEX 20K | APEX 20K | APEX 20K |
| Typical Gates | 400,000 | 400,000 | 400,000 | 400,000 | 400,000 |
| Logic Elements | 16,640 | 16,640 | 16,640 | 16,640 | 16,640 |
| Embedded RAM Bits | 212,992 | 212,992 | 212,992 | 212,992 | 212,992 |
| Maximum User I/O | 502 | 502 | 502 | 502 | 502 |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Maximum Internal Frequency | 250 MHz | 250 MHz | 250 MHz | 250 MHz | 250 MHz |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Through-hole ceramic CPGA package for hermetic reliability (vs EP20K400BC652-1X)
- Highest pin count in CPGA family (vs EP20K400GC652-1XV)
- Industry's first MultiCore FPGA architecture (vs EP20K400EBC652-1)
- Bitstream-compatible across APEX 20K 400K-gate family (vs EP20K400FI672-3)
Design Notes
The EP20K400GC655-1 requires careful power sequencing: bring VCCINT (2.5 V core) up before or simultaneously with VCCIO (3.3 V) to prevent I/O latch-up. Use a power supervisor or sequencing controller such as the TPS3808 to enforce this order. Each VCCINT pin must have its own 0.1 µF decoupling capacitor placed within 5 mm of the pin, plus bulk capacitance of at least 100 µF near the supply input. Total VCCINT current can reach 1.5 A at full utilization; size the 2.5 V regulator with at least 2 A headroom.
Estimated: At 250 MHz with 80% utilization and 2.5 V VCCINT, the EP20K400GC655-1 dissipates approximately 2-3 W. The ceramic CPGA-655 package has relatively high theta_JA (≈25 °C/W in still air), so junction temperature can approach 90 °C without airflow in a typical enclosure. For sustained operation above 70 °C ambient, install a heatsink or force-air cooling. The through-hole pin grid array provides natural convective cooling but limits airflow paths compared to surface-mount BGA variants like the EP20K400BC652-1X.
The 655-pin CPGA package requires a through-hole PCB footprint with 2.54 mm pin pitch on a 33x33 grid (minus corners). Plan via stitching on all internal power and ground planes directly under the PGA socket for low-impedance current return paths. For prototype builds, use a PGA socket (e.g., AMP 2-5530843-1) to allow device removal without desoldering. Production designs should consider migrating to BGA-652 variants like EP20K400BC652-1X for better vibration tolerance and reduced PCB area.
The EP20K400's FastTrack interconnect exhibits predictable routing delays but suffers signal degradation on traces exceeding 50 mm at 100 MHz. Use controlled-impedance 50 Ω traces for clock distribution and series-termination resistors (33 Ω) on high-speed outputs. The 3.3 V LVTTL/LVCMOS I/O banks support SSTL-2 and LVDS signaling via dedicated I/O standards; refer to the APEX 20K datasheet I/O chapter for bank-by-bank voltage reference requirements.
Common pitfalls with the EP20K400GC655-1 include: (1) attempting to hot-swap the device - it lacks hot-swap tolerance and requires powered-down insertion; (2) omitting the JTAG chain on production boards, which prevents in-system programming verification; (3) using incorrect configuration mode (MSEL settings) leading to CONF_DONE never asserting; (4) neglecting the nCONFIG reset pulse after power-up, which leaves the device in an undefined state. Always include a pull-up on nCONFIG and a pull-down on nSTATUS per the APEX 20K datasheet.
Compliance Information
Ceramic CPGA package contains lead in ceramic body and pins, making the EP20K400GC655-1 non-compliant with RoHS Directive 2011/65/EU. AEC-Q100 qualification status not specified in available data; military/aerospace deployments follow MIL-STD-883 screening rather than AEC-Q100. Reach compliance and conflict-mineral status not stated in verified web data.
