EP4CE40F23C8N - Cyclone IV E FPGA, 39.6K LE, 484-FBGA | Intel
MPN: EP4CE40F23C8N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $71.2 | $712.00 |
| 100 | $64.8 | $6,480.00 |
| 500 | $58.4 | $29,200.00 |
| 1,000 | $52.95 | $52,950.00 |
EP4CE40F23C8N Overview
An FPGA (Field Programmable Gate Array) is a programmable logic device whose interconnect and function blocks can be configured after manufacture by loading a bitstream into SRAM-based configuration memory. Within the broader semiconductor taxonomy, FPGAs sit above CPLDs (Complex Programmable Logic Devices) in logic capacity and below ASICs in per-unit cost. The Cyclone IV E sub-family belongs to the low-cost, non-transceiver branch of the Cyclone IV family, sharing the same Quartus Prime design environment as Cyclone IV GX parts.
Key features include 4 PLLs for clock synthesis, 66 embedded 18x18 multipliers supporting DSP operations up to ~150 MHz, 1161 Kbit of M9K block RAM, and support for external memory interfaces such as DDR, DDR2, and QDR II SRAM. User I/O voltages are programmable to 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V, and LVDS, and the device operates from a 1.2 V core supply with a separate PLL analog supply.
The 484-ball FBGA package provides a 1.0 mm ball pitch suitable for multilayer PCB fabrication with standard reflow profiles. Configuration options include JTAG, Active Serial (AS), and Passive Serial (PS) modes using a serial flash or download cable.
Typical applications include industrial motor control, video processing bridges, LED display controllers, and PCIe endpoint soft IP implementations on the Cyclone IV E family. The part is also well-suited for prototyping ASIC functionality, machine vision preprocessing, and protocol bridging between legacy and modern interfaces.
When designing with this part, ensure the PCB supports the 1.0 mm BGA pitch with microvia or via-in-pad fabrication, and provision decoupling close to each bank supply. Configuration mode selection at MSEL pins must match the selected boot source, otherwise the device will fail to configure.
This page synthesizes Cyclone IV E specifications, drop-in alternatives with the same FBGA-484 footprint, and practical design notes not consolidated in the manufacturer datasheet.
Drop-in alternatives for EP4CE40F23C8N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CE40F23C8N (same form factor and footprint) — differing in Package, Speed Grade, Process Technology, RoHS Status, Core Voltage.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4CE40F23C8LN
✅ Drop-In✓ In Stock
$49.95 / Unit
View Datasheet →EP4CE40F23C8L
✅ Drop-In✓ In Stock
$72.1 / Unit
View Datasheet →EP4CE40F23C8
✅ Drop-In✓ In Stock
$54.8 / Unit
View Datasheet →EP4CE40F23C7N
✅ Drop-In✓ In Stock
$21.8 / Unit
View Datasheet →EP4CE40F23C6N
✅ Drop-In✓ In Stock
$76.8 / Unit
View Datasheet →EP4CE40F23A7N
✅ Drop-In✓ In Stock
$118.4 / Unit
View Datasheet →EP4CE40F23C8N Maximum Ratings & Electrical Characteristics
| Family | Cyclone IV E |
| Logic Elements | 39,600 |
| Number of Logic Array Blocks (LABs) | 2475 LAB |
| Embedded Memory (M9K blocks) | 1134 Kbit |
| Embedded Multipliers (18x18) | 66 |
| PLLs | 4 |
| User I/Os | 328 |
| Maximum Operating Frequency | 200 MHz |
| Core Supply Voltage | 1.2 V |
| Operating Supply Voltage | 1.2 V (core) |
| I/O Standards Supported | LVTTL, LVCMOS, LVDS, SSTL, HSTL |
| Package / Case | 484-FBGA (F23, 23x23 mm, 1.0 mm pitch) |
| Mounting Type | Surface Mount (BGA) |
| Operating Temperature | 0C to +85C (commercial) |
| Moisture Sensitivity Level | MSL 3 (per JEDEC J-STD-020) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
| Configuration Modes | AS, PS, JTAG |
| Process Technology | 60 nm low-power CMOS |
| Transceivers | None (use Cyclone IV GX for transceivers) |
EP4CE40F23C8N 484-fbga (f23, 23x23 mm, 1.0 mm pitch) Pin Configuration Guide
Pin configuration for EP4CE40F23C8N (484-fbga (f23, 23x23 mm, 1.0 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CE40F23C8N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CE40F23C8N is suitable for 6 applications: Industrial Motor Control, Video Processing Bridge, LED Display Controller, ASIC Prototyping Platform, Communications Protocol Bridge, Test and Measurement Instrumentation.
Industrial Motor Control
The EP4CE40F23C8N is well suited for industrial motor control applications, including servo drives, stepper motor controllers, and variable-frequency drives. Its 39,600 logic elements and 66 embedded 18x18 multipliers provide sufficient DSP bandwidth to implement field-oriented control (FOC), space-vector PWM, and digital filter loops at typical 10-20 kHz switching frequencies. The four PLLs enable independent clock synthesis for motor PWM, encoder sampling, and communication interfaces (EtherCAT, CAN, RS-485). Industrial temperature extension is achieved by selecting the EP4CE40F23I8N drop-in variant in the same F23 FBGA-484 footprint.
Recommended
Video Processing Bridge
The EP4CE40F23C8N can serve as a video format converter or resolution scaler, bridging between camera sensors, display panels, and host processors. With 328 user I/Os supporting LVDS, LVCMOS, and HSTL standards, the device can ingest parallel RGB, MIPI (via deserializer), or HDMI TMDS streams and reformat them through on-chip line buffers. The 1,134 Kbit of M9K block RAM provides sufficient frame-line buffering for 720p/1080p processing. Designers can leverage Altera/Intel VIP (Video and Image Processing) IP cores for scaling and color-space conversion without external memory.
Recommended
LED Display Controller
LED video walls, digital signage, and stage lighting controllers benefit from the EP4CE40F23C8N's combination of high I/O count and logic density. With 328 user I/Os, the FPGA can drive multiple HUB75 LED panels simultaneously while maintaining refresh rates above 1920 Hz to avoid on-camera flicker. The 66 embedded multipliers support gamma correction and color-space matrix operations in real time. Configuration via Active Serial flash enables remote bitstream updates for signage deployments.
Recommended
ASIC Prototyping Platform
The EP4CE40F23C8N serves as an effective ASIC prototyping vehicle for designs in the 20K-50K gate-equivalent range. Engineers can validate RTL against real-world timing before committing to mask costs. The device's 1.2 V core and LVDS I/O up to 640 Mbps allow modeling of many ASIC IO cells. JTAG-based debugging through Quartus Prime SignalTap logic analyzer accelerates bring-up. Drop-in alternatives such as EP4CE115F23C8N (same F23 footprint, higher LE count) provide scaling headroom within the same PCB.
Recommended
Communications Protocol Bridge
The EP4CE40F23C8N bridges legacy industrial protocols to modern Ethernet-based networks. With 4 PLLs, the device can simultaneously clock UART, SPI, I2C, CAN, RS-485, and LVDS interfaces at independent rates while running an Ethernet MAC soft core. The 66 multipliers accelerate CRC, encryption, and signal-processing operations. For industrial deployments, swap to EP4CE40F23I8N for extended temperature range without PCB changes.
Recommended
Test and Measurement Instrumentation
The EP4CE40F23C8N is well suited for digital test instruments, logic analyzers, and pattern generators due to its 328 I/O count and ability to drive multiple logic levels. The four PLLs synthesize independent sampling clocks for multi-channel data acquisition, while the 1,134 Kbit M9K memory stores capture buffers before uploading to a host. Per the Cyclone IV datasheet, the LVDS I/O supports data rates up to 640 Mbps, suitable for moderate-speed serial protocol analysis.
Recommended
Recommended Products Summary
Engineering reference data for EP4CE40F23C8N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CE40F23C8LN | EP4CE40F23C8L | EP4CE40F23C8 | EP4CE40F23C7N | EP4CE40F23C6N | EP4CE40F23A7N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-FBGA (F23, 23x23 mm) | 484-FBGA (F23) - same | 484-FBGA (F23) - same | 484-FBGA (F23) - same | 484-FBGA (F23) - same | 484-FBGA (F23) - same | 484-FBGA (F23) - same |
| Logic Elements | 39,600 LE | 39,600 LE | 39,600 LE | 39,600 LE | 39,600 LE | 39,600 LE | 39,600 LE |
| Embedded Memory | 1134 Kbit | 1134 Kbit | 1134 Kbit | 1134 Kbit | 1134 Kbit | 1134 Kbit | 1134 Kbit |
| User I/Os | 328 | 328 | 328 | 328 | 328 | 328 | 328 |
| Speed Grade | 8 | 8 | 8 | 8 | 7 | 6 | 7 |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| PLLs | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
Key Differentiators
- Largest logic density in Cyclone IV E commercial-grade F23 package (vs EP4CE30F29C8N)
- Commercial temperature with speed grade 8 (fastest) for F23 variants (vs EP4CE40F23C7N)
- RoHS-compliant lead-free ordering code with N suffix (vs EP4CE40F23C8)
Design Notes
The F23 484-FBGA package uses a 1.0 mm ball pitch, which requires microvia or via-in-pad PCB fabrication. Standard 0.2 mm drill vias are too large for fanout; use 0.1 mm laser vias or staggered via-in-pad with tented plating. Estimated: a 6-layer stack-up with 1-2-1 dielectric spacing is typical for clean signal integrity on LVDS pairs. Maintain continuous ground planes under the BGA for thermal spreading and signal return paths.
Decouple each VCCINT, VCCA, and VCCIO bank with 0.1 uF X7R ceramic capacitors placed within 5 mm of each supply pin, plus bulk 10-100 uF tantalum or polymer capacitors. Estimated: at 200 MHz operation with all 4 PLLs active, core current can exceed 500 mA; size the 1.2 V regulator for at least 1 A headroom. The PLL analog supply (VCCA) should be filtered through a ferrite bead and 10 uF/0.1 uF network to minimize jitter.
Group I/O banks by voltage on the PCB to minimize level-shifter crossings. Each VCCIO bank supplies up to 32-40 I/Os; provide independent decoupling. Route LVDS pairs with 100 ohm differential impedance and length matching within 150 mils. JTAG chain must include a 4.7 kohm pull-up on TCK to prevent spurious configuration. The MSEL[3:0] pins must be hard-strapped to select AS, PS, or JTAG boot mode before power-up.
Do not confuse the F23 (23x23 mm) FBGA-484 package with the F29 (29x29 mm) FBGA-484 used on EP4CE30 parts - the ball patterns differ and are not interchangeable. Configuration failures often trace to incorrect MSEL strapping rather than silicon defects. When migrating from Cyclone III, verify that any 1.5 V LVCMOS signaling is re-validated, since Cyclone IV VCCIO ranges differ. Always run SignalTap or JTAG boundary-scan before finalizing board bring-up.
Compliance Information
RoHS and lead-free per the 'N' suffix in the Cyclone IV ordering code. Not AEC-Q100 qualified; for automotive use, contact Intel for the dedicated automotive part number. MSL 3 per JEDEC J-STD-020.
