EP20K600EFC33-1X - APEX 20K 2432 Macros FPGA 1020-FBGA | Intel
MPN: EP20K600EFC33-1X β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $425 | $425.00 |
| 10 | $395 | $3,950.00 |
| 100 | $365 | $36,500.00 |
| 250 | $340 | $85,000.00 |
| 500 | $320 | $160,000.00 |
EP20K600EFC33-1X Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and embedded memory blocks that engineers can reconfigure post-manufacture. FPGAs sit at the top of the programmable-logic hierarchy alongside CPLDs (which use a more restricted sum-of-products architecture) and are widely used for parallel processing, custom I/O protocols, and hardware acceleration where ASIC NRE is uneconomical.
Key features include MultiVolt I/O support (1.8 V, 2.5 V, 3.3 V), embedded CAM blocks for high-speed lookup operations, a 4-PLL clock network, and high-bandwidth embedded memory. The -1X speed grade targets faster logic placement-and-route timing compared to -2/-3 grades, at the cost of higher dynamic power. The 1020-FBGA package is a surface-mount FineLine BGA designed for high pin-count routing on multi-layer PCBs.
Typical applications include telecom line cards, DSP co-processing blocks, high-speed image-pipeline front-ends, and ASIC prototyping. The APEX 20K family was historically popular for bus-bridging, custom RISC peripherals, and embedded RISC cores (ARM/Excalibur soft-cores).
When designing with this part, ensure 1.8 V core decoupling is placed within 5 mm of every power pin, and verify that the JTAG chain follows Altera ByteBlaster/USB-Blaster guidelines. Designers should also budget for the larger configuration PROM (EPC16/EPC8) required for this device family.
This page synthesizes distributor pricing, drop-in APEX 20K alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for EP20K600EFC33-1X β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP20K600EFC33-1X (same form factor and footprint) β differing in Family, Operating Temperature, Series.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP20K600CFC1020C7
β Drop-Inπ Reference alternative (not in catalog)
EP20K600CFC1020C8
β Drop-Inπ Reference alternative (not in catalog)
EP20K600CFC1020I7
β Drop-Inπ Reference alternative (not in catalog)
EP20K600CFC1020I8
β Drop-Inπ Reference alternative (not in catalog)
EP20K600CFC1020I9
β Drop-Inπ Reference alternative (not in catalog)
EP20K600CFC1020C9
β Drop-Inπ Reference alternative (not in catalog)
EP20K600EFC33-1X Maximum Ratings & Electrical Characteristics
| Series | APEX 20K |
| Family | APEX 20K E |
| Number of Logic Elements/Cells | 24320 |
| Number of LABs/CLBs | 2432 |
| Total RAM Bits | 311296 |
| Number of I/O | 588 |
| Number of Gates | 1537000 |
| Voltage - Supply | 1.71 V to 1.89 V |
| Operating Temperature | 0 Β°C to 85 Β°C (TJ) |
| Mounting Type | Surface Mount |
| Package / Case | 1020-BBGA, FCBGA |
| Supplier Device Package | 1020-FBGA (33x33) |
| Speed Grade | -1X |
| Programmable Type | In System Reprogrammable |
| Form of Terminal | Ball |
EP20K600EFC33-1X 1020-fbga (33x33) Pin Configuration Guide
Pin configuration for EP20K600EFC33-1X (1020-fbga (33x33) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K600EFC33-1X.
Refer to the datasheet for full pin configuration.
Typical Applications
EP20K600EFC33-1X is suitable for 6 applications: Telecom Line Card Interface, DSP Co-Processing Engine, High-Speed Image Processing Pipeline, ASIC Prototyping and Emulation, Industrial Control and Bus Bridging, Legacy Telecom Backplane Aggregation.
Telecom Line Card Interface
The EP20K600EFC33-1X fits telecom line-card interface designs because its 588 user I/O pins (across 1020-FBGA balls) can directly drive multiple POS-PHY/UTOPIA bus segments and STS-3 framer data paths. The 1.537 M system gates and 24,320 LE accommodate full custom protocol stacks (ATM SAR, HDLC controllers, custom framer glue) plus high-density state machines without external co-processors. Per the APEX 20K datasheet, the embedded CAM blocks enable wire-speed table lookups for ATM VPI/VCI translation, while 311 kbit of embedded RAM supports cell-payload buffering. The 1.8 V core + MultiVolt I/O (1.8/2.5/3.3 V) allows direct connect to T1/E1 framers and OC-3 PHY devices. Engineers should size the configuration PROM (EPC16 or larger) at design entry to avoid late-stage PROM migration.
Recommended
DSP Co-Processing Engine
The EP20K600EFC33-1X is suitable for DSP co-processing because its 4 PLLs and high LE density support custom FIR/FFT accelerators running in parallel with a host CPU. With 24,320 LE and 311 kbit embedded RAM, a single device can implement a 16-tap 18-bit MAC array plus custom control logic at telecom-grade clock rates. Per the APEX 20K datasheet, the embedded memory blocks deliver true dual-port operation, which is essential for parallel FFT butterflies in radar/wireless baseband processing. Designers benefit from the 1.8 V core (low dynamic power relative to older 5 V FPGAs) and the -1X speed grade for the tightest Fmax in this family.
Recommended
High-Speed Image Processing Pipeline
The EP20K600EFC33-1X fits front-end image pipelines because its 588 I/O can absorb Camera Link LVDS channels directly and its embedded RAM supports line-buffer storage for real-time filtering. The 24,320 LE and 4 PLLs deliver enough logic for Sobel/Canny edge detection plus color-space conversion at HD resolutions. Per the APEX 20K datasheet, MultiVolt I/O allows direct connect to 1.8 V image sensors and 3.3 V Camera Link receivers without external translators. The 1020-FBGA's signal/ground ratio (verified per pin connection guidelines) supports the controlled-impedance layout needed for 65 MHz LVDS operation typical in machine-vision cameras.
Recommended
ASIC Prototyping and Emulation
The EP20K600EFC33-1X is used for ASIC prototyping because its 1.537 M system gates approximate mid-range ASIC complexity, and Quartus II software supports common ASIC synthesis flows (Synopsys DC, Mentor Graphics). With 588 I/O, the device can map large ASIC subsystems for pre-silicon verification. Per the APEX 20K datasheet, the 1020-FBGA package provides the signal integrity required for high-clock-rate emulation. Designers should partition the target ASIC across multiple EP20K600 devices using LVDS-based chip-to-chip bridge pins.
Recommended
Industrial Control and Bus Bridging
The EP20K600EFC33-1X serves industrial control designs because its 1.8 V core + 3.3 V MultiVolt I/O directly bridge legacy 5 V peripherals (with external clamp diodes) and modern 1.8 V MCUs without level translators. The 24,320 LE implement custom protocols like PROFIBUS, Modbus, or CANopen glue logic alongside motor-control state machines. Per the APEX 20K datasheet, the -1X speed grade supports deterministic timing for tight control loops. Designers using the commercial (0C to +85C) variant in industrial enclosures should derate junction temperature per the APEX 20K thermal model.
Recommended
Legacy Telecom Backplane Aggregation
The EP20K600EFC33-1X fits legacy backplane aggregation designs because its 588 I/O and high-density LE support multi-port H.110 bus termination, TDM switching fabrics, and HDLC aggregation in a single chip. The APEX 20K datasheet confirms MultiVolt I/O directly interfaces to 3.3 V H.110 backplanes, eliminating external transceivers. Per the APEX 20K datasheet, embedded CAM blocks accelerate address-lookup tables used in cross-connect fabrics. Designers upgrading older CompactPCI backplanes can drop the EP20K600EFC33-1X into existing footprints thanks to its JEDEC-standard 1020-FBGA ball pattern.
Recommended
Recommended Products Summary
Engineering reference data for EP20K600EFC33-1X β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K600CFC1020C7 | EP20K600CFC1020C8 | EP20K600CFC1020I7 | EP20K600CFC1020I8 | EP20K600CFC1020I9 | EP20K600CFC1020C9 |
|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1020-FBGA (33x33) | 1020-FBGA (33x33) - same | 1020-FBGA (33x33) - same | 1020-FBGA (33x33) - same | 1020-FBGA (33x33) - same | 1020-FBGA (33x33) - same | 1020-FBGA (33x33) - same |
| Number of Logic Elements | 24320 | 24320 | 24320 | 24320 | 24320 | 24320 | 24320 |
| Total RAM Bits | 311296 | 311296 | 311296 | 311296 | 311296 | 311296 | 311296 |
| Number of I/O | 588 | 588 | 588 | 588 | 588 | 588 | 588 |
| Speed Grade | -1X (fastest commercial) | -7 | -8 | -7 industrial | -8 industrial | -9 industrial | -9 |
| Operating Temperature | 0 Β°C to 85 Β°C | 0 Β°C to 85 Β°C | 0 Β°C to 85 Β°C | -40 Β°C to 100 Β°C (industrial) | -40 Β°C to 100 Β°C (industrial) | -40 Β°C to 100 Β°C (industrial) | 0 Β°C to 85 Β°C |
| Core Voltage | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V |
Key Differentiators
- Fastest commercial speed grade in 1020-FBGA APEX 20K 600E family (vs EP20K600CFC1020C7)
- Commercial temperature range suited for indoor/bench applications (vs EP20K600CFC1020I7)
- Legacy Altera/Intel branding with full Quartus II 4.x tool compatibility (vs Modern Cyclone IV EP4CE115F29I7)
Design Notes
Estimated: APEX 20K 600E core current peaks around 1.5-2.5 A at 1.8 V under heavy logic activity. Place at least eight 0.1 Β΅F X7R ceramic decoupling capacitors within 5 mm of the 1020-FBGA VCCINT balls, distributed evenly around the package. Add four 10 Β΅F tantalum bulk capacitors at PCB corners. The PLL analog supply (VCC_PLL) requires its own filtered LDO and a ferrite bead per the APEX 20K Pin Connection Guidelines. Do not use a single ground plane - split analog/digital GND with a single-point tie under the FPGA.
The 1020-FBGA at 33 mm Γ 33 mm uses 1.0 mm ball pitch. Per the Altera AN114 package layout guidelines, escape routing on the top layer requires 4 mil trace-and-space with via-in-pad for inner rows. Use microvia stackups (any-layer HDI) for signals beyond row 8. Maintain 50 Ξ© single-ended and 100 Ξ© differential controlled impedance for LVDS pairs. Add 4-8 thermal vias under the center balls to the opposite-side copper pour to dissipate ~5 W typical power.
Do not forget the configuration PROM - the EP20K600EFC33-1X requires an EPC16 or EPC8 serial configuration device, not a generic SPI flash. Per the APEX 20K datasheet, the CONF_DONE pin must be pulled high through a 4.7 kΞ© resistor and the nSTATUS pin must be pulled high through a 4.7 kΞ© resistor as well. Leaving MSEL pins floating causes configuration failure - tie them to VCCIO or GND per the selected configuration mode (AS/PS/Fast AS). JTAG chain must include the EPC16 in the chain for in-system programming.
Estimated: APEX 20K 600E theta_JA is approximately 18 Β°C/W with a JEDEC 4-layer test board (per Altera packaging report). At 5 W dissipation, junction temperature rise is ~90 Β°C above ambient - well above the 85 Β°C commercial limit. For sustained workloads above 3 W, place the device on a 4-layer board with a minimum 25 cmΒ² unbroken copper pour connected to the center BGA balls. For higher power or sealed enclosures, add a heatsink bonded with thermal epoxy.
Compliance Information
RoHS, REACH, lead-free, halogen-free status not stated in the provided verified web data; consult Intel/Altera product compliance documentation directly. The APEX 20K family predates widespread AEC-Q100 automotive adoption, so no automotive qualification is expected for this part.
