EP20K400EFC672-3 - 400K Gate APEX-20KE FPGA 672-BBGA | Intel
MPN: EP20K400EFC672-3 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $256.5 | $2,565.00 |
| 100 | $228 | $22,800.00 |
| 250 | $213.75 | $53,437.50 |
| 500 | $199.5 | $99,750.00 |
EP20K400EFC672-3 Overview
An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, and programmable interconnect that the user can redefine after manufacture. APEX-20KE belongs to the APEX (Advanced Logic Element Matrix) family and was Altera's first System-On-a-Programmable-Chip (SOPC) architecture, integrating look-up-table (LUT) based logic with embedded dual-port RAM and True-LVDS support so that complex glue-logic, datapath, and bus-interface functions can be consolidated into a single device.
Key features of the EP20K400EFC672-3 include 488 maximum user I/Os, 1.8 V core supply with 2.5 V multi-voltage I/O support, on-chip PLL clock management, LVDS/True-LVDS compatible I/O pairs, and MultiCore architecture that combines fine-grained LUTs with embedded memory blocks (ESBs). The -3 speed grade denotes the fastest commercial-grade speed bin in this family and pairs with a 0 to 85 C operating temperature window.
Architecturally, the device embeds 212 Kbits of distributed SRAM organized as embedded system blocks, each capable of true dual-port operation. Combined with dedicated multiplier/carry chains and high fan-out routing, the EP20K400 supports high-bandwidth datapath designs, bus interfaces (PCI, SDRAM), and protocol bridging on a single die. The 672-ball FineLine BGA provides controlled-impedance signal integrity for high-speed parallel buses.
Typical applications include telecommunication line cards, industrial control and automation, networking switches/routers, and ASIC prototyping/emulation. APEX-20KE was widely adopted in mid-2000s designs and remains available as a long-lifecycle part for industrial and military refresh programs.
Design consideration: ensure I/O bank supply voltages match the connected logic (3.3 V, 2.5 V, 1.8 V). Add decoupling on every VCCINT/VCCIO pin and verify JTAG chain integrity before in-system programming. This page synthesizes distributor inventory, same-package alternatives, and design context not found in the original datasheet.
Drop-in alternatives for EP20K400EFC672-3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP20K400EFC672-3 (same form factor and footprint) — differing in Operating Temperature, Package, Speed Grade, Process Technology, Family.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K400EFC672-2
✅ Drop-In✓ In Stock
$92.75 / Unit
View Datasheet →EP20K400EFC672-2N
✅ Drop-In✓ In Stock
$171 / Unit
View Datasheet →EP20K400EFC672-2X
✅ Drop-In✓ In Stock
$118.9 / Unit
View Datasheet →EP20K400EFC672-1
✅ Drop-In✓ In Stock
$110 / Unit
View Datasheet →EP20K400EFC672-1N
✅ Drop-In✓ In Stock
$175 / Unit
View Datasheet →EP20K400EFC672-1XN
✅ Drop-In✓ In Stock
$215 / Unit
View Datasheet →EP20K400EFC672-3 Maximum Ratings & Electrical Characteristics
| Product Type | FPGA (Field Programmable Gate Array) |
| Series | APEX-20KE |
| Logic Elements | 16,640 (approx. 1,052,000 system gates) |
| Embedded Memory (bits) | 212,992 |
| User I/Os | 488 |
| Maximum User I/O | 488 pins |
| Propagation Delay | 2.5 ns |
| Core Voltage (VCCINT) | 1.8 V |
| I/O Voltage (VCCIO) | 2.5 V (multi-voltage I/O) |
| Speed Grade | -3 (fastest commercial) |
| Operating Temperature | 0 C to +85 C (commercial) |
| Package | 672-ball FineLine BGA |
| Mounting Type | Surface Mount |
| Logic Family | CMOS |
EP20K400EFC672-3 672-ball fineline bga Pin Configuration Guide
Pin configuration for EP20K400EFC672-3 (672-ball fineline bga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K400EFC672-3.
Refer to the datasheet for full pin configuration.
Typical Applications
EP20K400EFC672-3 is suitable for 6 applications: Telecommunication Line Cards, Industrial Control and Automation, Networking Switches and Routers, ASIC Prototyping and Emulation, Military and Aerospace Avionics, Medical Imaging Systems.
Telecommunication Line Cards
The EP20K400EFC672-3's 488 user I/Os and 212 Kbits of embedded SRAM make it well-suited for telecommunication line-card designs including T1/E1 framers, DSLAM backplanes, and SONET/SDH interface cards. Its MultiCore architecture combines LUT logic with embedded dual-port memory blocks, enabling concurrent datapath processing and frame buffering without external FIFOs. The 672-ball FineLine BGA package provides controlled-impedance signal integrity for high-speed parallel buses running at 66 MHz and above, while 1.8 V core operation keeps power consumption manageable in dense multi-FPGA line cards.
Recommended
Industrial Control and Automation
Industrial PLC and motion-control systems benefit from the EP20K400EFC672-3's high I/O count, which accommodates multi-axis encoder inputs, sensor arrays, and parallel bus interfaces within a single device. The 0 to 85 C commercial operating range covers most factory-floor enclosures, and APEX-20KE's long-term supply program ensures multi-year lifecycle support for industrial customers. Designers implement custom PID loops, safety interlocks, and protocol bridges (Modbus, Profibus) in the LUT fabric while using ESB memory blocks for encoder-capture buffering and waveform generation.
Recommended
Networking Switches and Routers
The EP20K400EFC672-3 supports high-port-count networking switch and router designs by aggregating multiple Gigabit Ethernet MACs, packet-classification engines, and switch fabrics into a single device. The 212 Kbits of embedded SRAM implement per-port statistics counters and lookup tables, while 488 user I/Os interface directly to PHY devices and packet-memory buffers. The MultiCore architecture supports parallel packet-processing pipelines at line rate, and Quartus II synthesis libraries are mature and well-validated for networking protocol implementations.
Recommended
ASIC Prototyping and Emulation
The EP20K400EFC672-3 is widely deployed in ASIC prototyping and emulation rigs where 1,052,000 system gates of logic and 488 I/Os can emulate mid-complexity ASIC designs in real time. Designers partition large ASICs across multiple APEX-20KE devices connected through the BGA ball grid, using the LVDS pairs for high-speed chip-to-chip signaling. The mature Quartus II toolchain supports incremental design flows, hardware breakpoints, and live logic-analyzer probing through JTAG, all of which streamline ASIC bring-up and software-development timelines.
Recommended
Military and Aerospace Avionics
Long-lifecycle military and avionics programs rely on the EP20K400EFC672-3 because the APEX-20KE family is part of Altera/Intel's extended-lifecycle program with guaranteed supply for 15+ years from launch. Designs implementing MIL-STD-1553, ARINC 429, and custom radar-processing datapaths use the FPGA's 488 I/Os for multi-channel serial interfacing, while embedded ESBs buffer radar-return samples. The 0 to 85 C range covers commercial avionics; rugged variants (EP20K400EFC672-1XN-style with extended grade) cover harsher military environments.
Recommended
Medical Imaging Systems
Ultrasound, CT, and MRI imaging systems leverage the EP20K400EFC672-3's 16,640 logic elements and 212 Kbits of embedded SRAM to implement beamforming, image reconstruction, and real-time filter pipelines. The 488 user I/Os interface directly to analog front-end ADCs and high-speed data converters, while ESB memory blocks accumulate scan-line data and intermediate pixel buffers. The mature Quartus II DSP library provides optimized FIR, IIR, and FFT megafunctions that accelerate medical-image processing while keeping power consumption low for portable cart-based systems.
Recommended
Recommended Products Summary
Engineering reference data for EP20K400EFC672-3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K400EFC672-2 | EP20K400EFC672-2N | EP20K400EFC672-2X | EP20K400EFC672-1 | EP20K400EFC672-1N | EP20K400EFC672-1XN |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 672-BBGA (FineLine BGA) | 672-BBGA - same | 672-BBGA - same | 672-BBGA - same | 672-BBGA - same | 672-BBGA - same | 672-BBGA - same |
| Speed Grade | -3 (fastest commercial) | -2 (mid-range) | -2 (mid-range) | -2 (extended) | -1 (slowest) | -1 (slowest) | -1 (extended) |
| Logic Elements | 16,640 | 16,640 | 16,640 | 16,640 | 16,640 | 16,640 | 16,640 |
| Embedded Memory (bits) | 212,992 | 212,992 | 212,992 | 212,992 | 212,992 | 212,992 | 212,992 |
| User I/Os | 488 | 488 | 488 | 488 | 488 | 488 | 488 |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Operating Temperature | 0 to +85 C | 0 to +85 C | 0 to +85 C | Extended | 0 to +85 C | 0 to +85 C | Extended |
Key Differentiators
- Highest-speed commercial bin in the APEX-20KE family (vs EP20K400EFC672-2)
- Maximum 488 user I/Os in the 672-BBGA package (vs EP20K400EBC652-3)
- True-LVDS and multi-voltage I/O support (vs EP20K400EFC672-1)
Design Notes
The EP20K400EFC672-3 requires separate 1.8 V VCCINT and 2.5 V VCCIO rails. Decouple every VCCINT/VCCIO ball with a 0.1 uF X7R ceramic plus a 10 uF bulk tantalum placed within 0.25 inches of the ball. Add a ferrite bead between the regulator and the FPGA VCCINT pins to attenuate switching noise from the core logic. Estimated core current for a 100% utilized APEX-20KE device at typical toggle rates is approximately 1-2 A; verify with Quartus II PowerPlay early in the design cycle.
The 672-ball FineLine BGA requires a multilayer PCB (minimum 6 layers, recommended 8-10) with a dedicated ground plane and at least one solid power plane. Use 0.5 mm pitch ball pads with non-solder-mask-defined (NSMD) pads for higher assembly yield. Match trace lengths within each LVDS pair to within 100 mils for proper differential signaling. Escape routing must use dog-bone fanout or via-in-pad microvias to break out the dense 1.0 mm pitch ball grid.
Do not assume -3 timing-closure designs automatically meet timing on -1 speed grade parts. Recompile and re-run timing analysis for any speed-grade migration. Also, do not leave VCCIO banks floating; unused I/O banks should be tied to a valid VCCIO rail (typically 2.5 V) to prevent input-buffer oscillation. The JTAG TCK signal must be pulled low through a 1-10 kohm resistor to prevent floating-clock configuration errors during board bring-up.
Compliance Information
RoHS and lead-free status not explicitly stated in the verified web data; the N-suffixed variants (EP20K400EFC672-2N, EP20K400EFC672-1N) likely indicate lead-free termination per Altera naming convention but confirmation requires datasheet verification. AEC-Q100 is not applicable as this is an FPGA, not an automotive-grade discrete.
