EP2S60F1020C5N - Stratix II FPGA 60K LE | Altera
MPN: EP2S60F1020C5N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $175 | $175.00 |
| 10 | $167.5 | $1,675.00 |
| 100 | $159 | $15,900.00 |
| 500 | $151.25 | $75,625.00 |
| 1,000 | $143.75 | $143,750.00 |
EP2S60F1020C5N Overview
An FPGA is a reconfigurable digital integrated circuit whose logic fabric, routing, and I/O behavior can be programmed after manufacture. In a system hierarchy, an FPGA belongs to programmable logic, which sits above soft intellectual-property cores and configuration memory but below complete application boards. The EP2S60F1020C5N is part of Altera's Stratix II family, an architecture that combines adaptive logic modules, DSP functionality, and large embedded memory blocks to implement complex digital systems without custom ASIC fabrication.
Key differentiators include 3022 LABs, 718 user I/O pins, 2,544,192 RAM bits, a 1.15 V to 1.25 V core supply, and a 0°C to 85°C junction temperature range. The large ball count enables dense board-level routing and high pin availability for parallel buses, while the N suffix in the order code indicates a lead-free device option. These features make it suitable for systems that need substantial programmable logic, memory, and wide parallel interfaces in one package.
Stratix II FPGAs use SRAM-based configuration, meaning the device must be loaded from an external configuration device or host after power-up. This architecture supports rapid iterative design changes in prototyping and field upgrades. The 1020-ball BGA provides robust power and ground distribution, important for maintaining signal integrity at high toggle rates. The target commercial grade supports controlled-environment equipment and many industrial settings where the junction temperature remains below 85°C.
Typical applications include high-performance DSP, radar and beamforming front ends, wireline and wireless communications, industrial machine vision, medical imaging, video processing, and ASIC prototyping. Large logic density plus many I/O allows designers to implement complete signal-chain processing in one FPGA. The wide I/O count also supports connecting to high-speed converters, DDR memory, and backplane interfaces.
A key design consideration is power and thermal management. A 60K-logic-element FPGA with high utilization and many I/O toggles can dissipate several watts; estimate power in the Quartus PowerPlay analyzer and provide adequate BGA copper pours, vias, and airflow.
This page combines distributor availability signals, package-aware drop-in alternatives, comparison tables, and practical design notes that are not all stated in a single datasheet page, giving engineers a faster procurement and selection reference.
Drop-in alternatives for EP2S60F1020C5N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2S60F1020C5N (same form factor and footprint) — differing in Package, Speed Grade, RoHS Status, Family, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2S60F1020C4N
✅ Drop-In✓ In Stock
$67 / Unit
View Datasheet →EP2S60F1020C4
✅ Drop-In✓ In Stock
$1240 / Unit
View Datasheet →EP2S60F1020C5
✅ Drop-In✓ In Stock
$995 / Unit
View Datasheet →EP2S60F1020I4N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$270 / Unit
View Datasheet →EP2S60F1020C3N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1095 / Unit
View Datasheet →EP2S60F1020C5N Maximum Ratings & Electrical Characteristics
| Series | Stratix II |
| Number of Logic Elements | 60440 |
| Number of LABs/CLBs | 3022 |
| Number of Logic Array Blocks | 3022 LABs |
| Total RAM Bits | 2544192 bits |
| Number of User I/O | 718 |
| Package / Case | 1020-BBGA, FCBGA |
| Number of Terminals | 1020 |
| Terminal Form | BALL |
| Package Code | BGA |
| Package Shape | SQUARE |
| Supply Voltage | 1.15 V to 1.25 V |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Mounting Type | Surface Mount |
| Speed Grade / Order Code | C5 (commercial speed grade per Altera order code) |
EP2S60F1020C5N square Pin Configuration Guide
Pin configuration for EP2S60F1020C5N (square package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2S60F1020C5N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2S60F1020C5N is suitable for 6 applications: High-Performance DSP and Radar Beamforming, Wireline and Wireless Communications, Industrial Machine Vision and Industrial Control, Medical Imaging and Ultrasound, Video and Image Processing, High-Performance Computing Prototyping.
High-Performance DSP and Radar Beamforming
The EP2S60F1020C5N fits high-performance DSP and radar beamforming because its 60440 logic elements and 2544192 bits of embedded RAM allow parallel FIR filters, FFT engines, and beamform coefficients to reside on-chip. In radar signal chains, wideband ADC data is often processed at high sample rates; the 718 user I/O pins give enough routing bandwidth to capture multiple converter lanes and control words simultaneously. The FPGA's parallel architecture performs many multiply-accumulate operations concurrently, reducing the need for external DSP chips. A common topology places the FPGA between high-speed ADCs and a host processor, with DSP blocks and memory buffers implementing pulse compression and digital down-conversion. The 1.15 V to 1.25 V core supply must be clean and well-decoupled; power supply noise on the core rail can couple into PLLs and degrade converter clock performance.
Recommended
Wireline and Wireless Communications
Communications equipment benefits from the EP2S60F1020C5N because the device can implement protocol framing, packet processing, error correction, and multiple independent data paths on one FPGA. With 718 I/O pins, designers can interface to broad parallel backplanes, multiple gigabit-class serial transceivers via external PHYs, and memory devices. The 2544192 bits of RAM provide substantial FIFO and packet-buffer space without reaching off-chip for every queue. In a line-card application, the FPGA might sit between the framer and the switch fabric, handling ingress and egress logic. Because the package is a 1020-ball BGA, dense signal escape is achievable with a multilayer PCB using blind or buried vias. Timing closure on high-speed transceiver interfaces must be verified in Quartus because this is a commercial C5 speed-grade device, not the highest Stratix II speed grade.
Recommended
Industrial Machine Vision and Industrial Control
Industrial machine vision systems use the EP2S60F1020C5N to implement real-time image preprocessing, pixel correction, pattern matching, and output triggering with deterministic latency. The FPGA's logic elements can run multiple pipeline stages concurrently, which is important in high-throughput inspection systems. The 718 user I/O pins allow parallel connections to image sensors, frame grabbers, motor controllers, and industrial bus interfaces. Many industrial environments are specified to 0°C to 85°C junction temperature, so the commercial C5 grade is acceptable in controlled indoor equipment. A practical design consideration is that an SRAM-based FPGA requires a configuration device or host CPU to load its bitstream at power-up; in industrial systems, a redundant configuration method is recommended. Mechanical vibration must also be considered, so BGA solder joints should follow IPC-7531 reflow and inspection recommendations.
Recommended
Medical Imaging and Ultrasound
Medical imaging equipment, including ultrasound beamformers, optical coherence tomography engines, and CT data processing, can use the EP2S60F1020C5N to manage high-speed sensor data and perform heavy numerical calculations. The device's combination of logic elements and embedded memory is suitable for delay-and-sum beamforming, filtering, and image enhancement. Since medical systems often need deterministic data acquisition, the FPGA's parallel I/O can connect to multiple ADC channels and sensor arrays. The 1020-ball BGA package provides enough pins for high-density interconnects, but board designers should pay careful attention to signal integrity and power integrity because imaging pipelines operate at high toggle rates. For medical products intending to meet IEC 60601-1, EMC and safety verification is needed; the FPGA itself is a programmable component and does not provide isolation or medical safety certification.
Recommended
Video and Image Processing
The EP2S60F1020C5N can perform real-time video scaling, color space conversion, frame synchronization, and display processing in broadcast or machine-vision products. Its 2544192 bits of RAM are useful for line buffers and small frame tiles, while the 60440 logic elements can implement many pixel pipelines in parallel. With 718 I/O pins, multiple video data buses and memory controllers can be connected to the FPGA, allowing simultaneous input and output streams. Video processing often requires low deterministic latency; an FPGA delivers that better than a CPU or GPU because the pipeline is specialized in hardware. In a typical system, the FPGA receives video from an HDMI or camera interface, processes it, and drives a display link. The commercial 0°C to 85°C operating range is acceptable for most broadcast and office equipment, but ensure the total board ambient does not push the FPGA junction above 85°C in enclosed racks.
Recommended
High-Performance Computing Prototyping
In high-performance computing and ASIC prototyping, the EP2S60F1020C5N is used to validate RTL designs before tape-out. The large number of logic elements supports multiple processor cores or a substantial portion of an ASIC design, while the 718 user I/O pins connect to same-board companion FPGAs or external memory interfaces. Prototyping systems often require many FPGAs, so the ability to configure the same design into multiple speed-grade variants is useful. The C5N target device is slower than C4N or C3N Stratix II parts, so timing-sensitive prototype partitions should use faster variants if the target ASIC frequency is high. The 1020-ball BGA package presents PCB routing complexity during prototype bring-up; use a board with controlled impedance and sufficient layer count. A configuration device or JTAG-based USB Blaster is required for every FPGA power cycle.
Recommended
Recommended Products Summary
Engineering reference data for EP2S60F1020C5N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2S60F1020C4N | EP2S60F1020C5 | EP2S60F1020I4N |
|---|---|---|---|---|
| Package | 1020-BBGA, FCBGA | 1020-BBGA, FCBGA - same | 1020-BBGA, FCBGA - same | 1020-BBGA, FCBGA - same |
| Brand | Altera | Altera | Altera | Altera |
| Number of Logic Elements | 60440 | 60440 | 60440 | 60440 |
| Total RAM Bits | 2544192 | 2544192 | 2544192 | 2544192 |
| Number of LABs / CLBs | 3022 | 3022 | 3022 | 3022 |
| User I/O | 718 | 718 | 718 | 718 |
| Core Supply Voltage | 1.15 V to 1.25 V | 1.15 V to 1.25 V | 1.15 V to 1.25 V | 1.15 V to 1.25 V |
| Order-Code Suffix | C5 (commercial, speed grade C5, N lead-free) | C4 (commercial, speed grade C4, N lead-free) | C5 (commercial, speed grade C5, non-N leaded) | I4 (industrial temperature, N lead-free) |
| Temperature Range | 0°C to 85°C (TJ) | 0°C to 85°C (TJ) | 0°C to 85°C (TJ) | -40°C to 100°C (TJ) |
Key Differentiators
- Cost-optimized commercial C5 speed grade with lead-free N finish (vs EP2S60F1020C4N)
- RoHS-oriented N suffix for lead-free assembly (vs EP2S60F1020C5)
- Commercial-grade C5N is lower-cost for controlled ambient environments (vs EP2S60F1020I4N)
Design Notes
EP2S60F1020C5N requires a regulated 1.15 V to 1.25 V core supply, typically centered near 1.2 V. The 1020-ball BGA has multiple VCC and GND balls, and every supply ball should be connected to a low-impedance power plane. Place 0.1 uF and 1 uF ceramic capacitors close to the BGA pins, and use enough vias to connect the power balls to the plane. Estimated: a 60K-logic-element FPGA can draw several amperes under high utilization, so use a synchronous buck converter sized for 5 A or more depending on the routed design. Analyze the power dissipation in the Quartus PowerPlay tool rather than guessing from the logic-element count.
The commercial C5 temperature grade is specified for a 0°C to 85°C junction temperature range. Estimated: with a typical high-utilization Stratix II design, power dissipation may reach 5 W to 10 W depending on clock rate and I/O activity. A 1020-ball BGA is usually soldered to a multilayer board, so use thermal vias under the package and a copper pour on bottom layers to spread heat. Do not rely on free convection alone if the enclosed ambient exceeds 40°C. For industrial applications above 85°C junction, choose the EP2S60F1020I4N industrial-temperature Stratix II variant instead of the C5N.
The EP2S60F1020C5N is a large 1020-ball BGA with 718 user I/O, requiring a high-layer-count PCB for reliable signal escape. Use a controlled-impedance stackup for high-speed interfaces and keep clock and data trace lengths balanced. Differential pairs should be routed with uniform spacing and ground return vias. The BGA is not in the standard XAIPART SVG library, so the generated page uses default package diagram; for manufacturing, download the exact footprints and ball map from Intel/Altera Quartus or the Stratix II pin files. Follow IPC-7531 for reflow soldering and X-ray inspection to verify solder joints.
EP2S60F1020C5N is SRAM-based and loses its configuration when power is removed. A common pitfall is assuming the FPGA boots from on-chip flash; you must connect an external configuration device such as EPCS16 or EPC16, or load the bitstream by a host processor through JTAG or passive serial. Another pitfall is using the non-N EP2S60F1020C5 in a lead-free assembly without verifying the finish. If you substitute a different speed-grade variant, regenerate the Quartus bitstream and re-run timing analysis because the programming file may contain timing-driven placement.
Compliance Information
The N in the EP2S60F1020C5N order code typically indicates a lead-free Altera device, but explicit RoHS/REACH certificates were not present in the verified web data. For procurement documentation, request a Certificate of Compliance from the distributor or Intel/Altera.
