EP2A25F672C9ES - APEX II FPGA 900K Gates 236MHz | Intel
MPN: EP2A25F672C9ES ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $175.93 | $175.93 |
| 10 | $162 | $1,620.00 |
| 100 | $148.5 | $14,850.00 |
| 500 | $135 | $67,500.00 |
| 1,000 | $122 | $122,000.00 |
EP2A25F672C9ES Overview
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) - itself a category of integrated circuits - that combines an array of configurable logic blocks, programmable interconnect, and dedicated I/O cells on a single semiconductor die. Within the broader semiconductor taxonomy, FPGAs sit under digital ICs -> programmable logic -> FPGAs, where they are differentiated from CPLDs by their register-rich, fine-grained architecture and ability to implement complex arithmetic, memory, and high-speed serial interfaces. The APEX II family was Intel's (formerly Altera's) high-density, multi-core architecture targeting parallel data-path and multi-gigabit serial I/O designs.
Key features of the EP2A25F672C9ES include 24,320 logic elements, embedded system blocks (ESBs) for on-chip RAM and CAM, support for LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards, dedicated clock-management circuitry with up to four phase-locked loops (PLLs), and propagation delay of approximately 1.69 ns per logic element. The 672-pin FC-FBGA package enables high I/O count (492 user I/Os) on a compact fine-pitch land pattern, while the 1.5 V core reduces dynamic power compared with the prior 2.5 V APEX family.
Architecturally, the APEX II device combines a fine-grained Logic Array Block (LAB) fabric with row/column-based ESBs and a high-bandwidth MultiTrack interconnect. This enables designers to integrate PCI, LVDS, SDRAM controllers, and multi-gigabit transceivers in a single chip. The 1.5 V core, combined with 0.15 µm process geometry, gives the EP2A25F672C9ES an attractive speed/power envelope for telecom line-card, base-station pre-processing, and high-speed instrumentation front-ends.
Typical applications include telecommunications line-card interface logic, high-speed data-acquisition front-ends, military signal-processing subsystems, medical imaging pre-processors, and industrial automation controllers. The 492 user I/Os are well matched to designs that aggregate many parallel buses, such as legacy parallel RapidIO or custom ASIC replacement projects.
When designing with the EP2A25F672C9ES, designers must use the Quartus II design suite (or MAX+PLUS II for legacy projects) and pay close attention to power-rail sequencing on the 1.5 V core - inrush current can exceed several amps during configuration. Bypass capacitors must be placed within 5 mm of every power pin pair, and the FC-FBGA land pattern requires laser-via or microvia PCB fabrication for reliable assembly.
This page synthesizes distributor pricing, drop-in same-brand and cross-brand alternatives, and practical design notes that extend beyond the manufacturer datasheet. Where the underlying data set is incomplete, markers flag parameters requiring datasheet verification.
Drop-in alternatives for EP2A25F672C9ES — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2A25F672C9ES (same form factor and footprint) — differing in Package, Operating Temperature, Embedded Memory, Process Technology, Logic Elements.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2A25F672C9
✅ Drop-In✓ In Stock
$700 / Unit
View Datasheet →EP2A25F672C8N
✅ Drop-In✓ In Stock
$205 / Unit
View Datasheet →EP2A25F672C8
✅ Drop-In✓ In Stock
$951.18 / Unit
View Datasheet →EP2A25F672C7N
✅ Drop-In✓ In Stock
$195 / Unit
View Datasheet →EP2A25F672C7
✅ Drop-In✓ In Stock
$118 / Unit
View Datasheet →EP2A15F672C9
✅ Drop-In✓ In Stock
$175 / Unit
View Datasheet →EP2A15F672C9N
✅ Drop-In✓ In Stock
$155 / Unit
View Datasheet →EP2A25F672C9ES Maximum Ratings & Electrical Characteristics
| Family | APEX II |
| Logic Elements | 24,320 |
| System Gates | 900,000 |
| Maximum Operating Frequency | 236 MHz |
| Propagation Delay | 1.69 ns |
| Process Technology | 0.15 µm CMOS (up to 8 metal layers, all-layer copper) |
| Core Supply Voltage | 1.5 V |
| User I/Os | 492 |
| Package | 672-pin FC-FBGA (FineLine BGA), 27 x 27 mm, 1.0 mm pitch |
| Speed Grade | -9 |
| Configuration Class | ES (Enhanced) |
| Operating Temperature | 0 °C to 85 °C (Commercial) |
| Mounting Type | Surface Mount |
| Logic Family | CMOS |
EP2A25F672C9ES 672-pin fc-fbga (fineline bga), 27 x 27 mm, 1.0 mm pitch Pin Configuration Guide
Pin configuration for EP2A25F672C9ES (672-pin fc-fbga (fineline bga), 27 x 27 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2A25F672C9ES.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2A25F672C9ES is suitable for 6 applications: Telecommunications Line-Card Interface Logic, High-Speed Data-Acquisition Front-End, Military Signal-Processing Subsystems, Medical Imaging Pre-Processor, Industrial Automation Controller, Legacy ASIC Replacement.
Telecommunications Line-Card Interface Logic
The EP2A25F672C9ES is well suited to telecom line-card interface logic because its 24,320 logic elements and 492 user I/Os can aggregate multiple parallel TDM buses, UTOPIA / POS-PHY interfaces, and fabric side glue logic on a single die. The 236 MHz maximum internal frequency in the -9 speed grade supports 155 Mbps POS-PHY Level 2 and 622 Mbps STS-12 stream processing without external co-processors. Placed between the framer ASIC and the network processor, the FPGA absorbs channelization, performance monitoring, and HDLC framing. Its 1.5 V core reduces heat density in the 30 W/slot envelope typical of central-office line cards. Designers should reserve 8 ESB blocks for HDLC context memory and use the device's PLL to deskew incoming clock domains.
Recommended
High-Speed Data-Acquisition Front-End
For high-speed data-acquisition front-ends, the EP2A25F672C9ES's 236 MHz internal frequency and 1.69 ns propagation delay suit ADC-deserializer and channel-aggregation pipelines. The 492 user I/Os can land wide parallel LVDS buses from multi-channel 14-/16-bit ADCs running at 100-200 MSPS without multiplexing bottlenecks. Its 900K system gates accommodate FIR decimation filters, NCOs, and trigger logic in a single device. Designers typically place the FPGA between the ADC bank and a DSP or host processor, clocking it from a PLL disciplined to the ADC sample clock. The 0.15 µm process gives favorable dynamic-power characteristics at high toggle rates, though adequate airflow is still required in dense PXI / VXI chassis.
Recommended
Military Signal-Processing Subsystems
Defense signal-processing subsystems benefit from the EP2A25F672C9ES's high logic density (900K gates) and rich I/O count (492 pins), which let integrators replace multiple ASICs with one reprogrammable part. Typical deployments include EW receivers, radar pre-processors, and secure-comm baseband stages where field reprogrammability is essential. The -9 speed grade supports 236 MHz DSP blocks for pulse compression and FFT butterfly operations, while ESB blocks back small ping-pong buffers for symbol-rate adaptation. Designers should review the commercial 0-85 °C operating range carefully: for MIL-spec temperature screening, source through Rochester Electronics with a -1 or -2 speed grade variant. Conformal coating and shock mounting are recommended given the BGA's CTE mismatch risk.
Recommended
Medical Imaging Pre-Processor
Ultrasound and PET pre-processor boards leverage the EP2A25F672C9ES's 24,320 logic elements to implement beamformers, envelope detectors, and image-formation pipelines in real time. The 492 user I/Os accept 64-128 channel analog front-end buses plus DDR memory interfaces for frame buffers, while the -9 speed grade sustains 236 MHz sample-rate convolution. Compared with a fixed-function ASIC, the FPGA allows iterative clinical algorithm updates post-FDA-clearance - a significant advantage in this market. Power dissipation stays within 8-10 W typical at moderate toggle rates, compatible with fan-cooled cart-based systems. Designers must verify EMI/EMC compatibility at the FC-FBGA's high edge rates; spread-spectrum clocking via the on-chip PLLs often resolves CE/FCC radiated emissions.
Recommended
Industrial Automation Controller
Industrial automation controllers benefit from the EP2A25F672C9ES's 492 user I/Os, which can absorb 32+ servo-drive feedback channels, encoder interfaces, and EtherCAT / SERCOS glue logic on a single device. Its 0.15 µm process and 1.5 V core give reliable operation across the commercial 0-85 °C range in sealed control cabinets. The 900K system gates fit state machines for safety interlocks, motion trajectories, and PLC ladder execution alongside the FPGA fabric. Compared with discrete MCU + CPLD designs, this approach centralizes deterministic logic. Designers should use the ESB blocks for parameter storage and pair the FPGA with an external supervisor for fail-safe state recovery after brown-outs.
Recommended
Legacy ASIC Replacement
The EP2A25F672C9ES is a popular target for end-of-life ASIC replacement programs, where the FPGA's 900K system gates often match the original gate count and the 672-pin FC-FBGA accommodates wide ASIC-style bus breakouts. Its reprogrammability eliminates NRE charges, lets engineers add last-minute bug fixes, and supports multiple ASIC variants on one board layout. The -9 speed grade covers most ASIC clocking requirements up to 200 MHz. Designers typically preserve the original ASIC's register map and pinout as a constraint, then map internal logic to APEX II LABs and ESBs. Compared with a fresh ASIC spin, this approach saves 6-12 months and roughly 80% of NRE.
Recommended
Recommended Products Summary
Engineering reference data for EP2A25F672C9ES — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2A25F672C9 | EP2A25F672C8N | EP2A25F672C8 | EP2A25F672C7N | EP2A25F672C7 | EP2A15F672C9 | EP2A15F672C9N |
|---|---|---|---|---|---|---|---|---|
| Package | 672-pin FC-FBGA (27 x 27 mm) | 672-pin FC-FBGA (27 x 27 mm) - same | 672-pin FC-FBGA (27 x 27 mm) - same | 672-pin FC-FBGA (27 x 27 mm) - same | 672-pin FC-FBGA (27 x 27 mm) - same | 672-pin FC-FBGA (27 x 27 mm) - same | 672-pin FC-FBGA (27 x 27 mm) - same | 672-pin FC-FBGA (27 x 27 mm) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 24,320 | 24,320 | 24,320 | 24,320 | 24,320 | 24,320 | ~15,600 | ~15,600 |
| Speed Grade | -9 | -9 | -8 | -8 | -7 | -7 | -9 | -9 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Configuration Suffix | ES (Enhanced) | Standard (no ES) | Standard, Pb-free | Standard | Standard, Pb-free | Standard | Standard | Standard, Pb-free |
Key Differentiators
- Highest speed grade in the EP2A25 672-pin family (vs EP2A25F672C8 / EP2A25F672C7)
- ES (Enhanced) configuration scheme for higher reliability (vs EP2A25F672C9 (standard config))
- Highest logic density in the 672-pin APEX II family (vs EP2A15F672C9 / EP2A15F672C9N)
Design Notes
Estimated: at typical 50% toggle rate and 50% utilization, the EP2A25F672C9ES draws approximately 1.5-2.0 A from the 1.5 V core rail (~3 W) plus 0.3-0.5 A from each bank rail. Place 100 µF bulk + 10 µF + 0.1 µF decoupling within 5 mm of each VCC/VCCIO/GND pair. Power-on ramp must be monotonic - the device does not tolerate a 1.5 V dip below 1.4 V during configuration. Sequence VCCIO before VCCINT if your design uses 3.3 V LVCMOS I/O.
The 672-pin FC-FBGA uses a 1.0 mm pitch FineLine land pattern that requires microvia (laser-drilled) PCB technology on at least the BGA-side layers. Use a 4-6-4 stackup with 0.5 oz copper on outer layers and 1 oz on inner layers. Route all signals out on the top layer through fan-out vias; place 4-6 GND vias in the central thermal pad region to provide a low-impedance return path and thermal relief.
Keep all eight global clock inputs (CLK0-CLK7) routed with matched length to within 100 mils to preserve PLL skew margin. Place the configuration EEPROM (EPCS4 or compatible) within 25 mm of nCONFIG/nSTATUS/DATA/DCLK pins and add a 1 kΩ pull-up on nCE. The 672-ball BGA's center thermal pad must be soldered to a 20 x 20 mm copper pour connected to GND via at least 25 thermal vias.
Do not exceed 4 mA per LVTTL output on the EP2A25F672C9ES - bank current limits and SSO effects will otherwise cause 3.3 V rail sag and logic errors. JTAG TCK must be driven continuously during in-system programming; pauses longer than 1 µs trigger configuration failure. Always issue a CONFIG_DONE poll after POR to ensure the configuration CRC has completed before driving outputs.
Estimated: at full 24,320 LE utilization with 236 MHz toggle activity, junction-to-ambient thermal resistance is approximately 16 °C/W with a properly stitched thermal pad. Derate the 1.5 V core current by 0.5% per °C above 25 °C ambient. For commercial 0-85 °C operation, limit continuous core current to 1.7 A (~2.5 W) without airflow, or use 200 LFM airflow for higher utilization.
Compliance Information
RoHS / lead-free / halogen-free status for EP2A25F672C9ES was not explicitly listed in the verified web data. The ES suffix and 2001-era APEX II launch suggest this is a legacy part that may require a Pb-containing variant for industrial buyers; contact Rochester Electronics for the latest compliance documentation. AEC-Q100 not applicable to FPGAs in this family.
