EP2A15F672I8 - APEX II 600K Gate FPGA, 672-FBGA | Altera
MPN: EP2A15F672I8 ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $908.31 | $908.31 |
| 10 | $845 | $8,450.00 |
| 100 | $780 | $78,000.00 |
| 500 | $720 | $360,000.00 |
| 1,000 | $680 | $680,000.00 |
EP2A15F672I8 Overview
A Field-Programmable Gate Array (FPGA) is a reprogrammable integrated circuit whose logic, interconnect, and I/O behavior are configured by the user after manufacture via a configuration bitstream stored in SRAM or antifuse. APEX II sits in the historical Altera device hierarchy as APEX II -> APEX -> PLD -> programmable logic device -> semiconductor, and as a Look-Up Table (LUT)-based coarse-grained FPGA it sits alongside structured-ASIC predecessors and contemporary CPLDs at the high-density end of programmable logic.
Key features of the EP2A15F672I8 include 492 user I/O pins (LVTTL/LVCMOS compatible), MultiVolt I/O support, embedded system blocks (ESBs) for dual-port RAM and FIFO, embedded array blocks (EABs), up to 416 Kbits of embedded memory, and dedicated clock management circuits (PLL-like clockLock/clockBoost circuitry in the APEX II architecture). Per-pin and per-bank I/O standards are software-configurable via the Quartus design tool.
Typical applications include high-speed communications line cards, telecom backplane interfaces, DSP co-processing engines, industrial control and machine-vision front-ends, and PCI/PCI-X system interconnect bridging. Designers select this device when they need high logic density combined with up to 1 Gbps LVDS-style I/O capability (the APEX II platform advertises up to 1 gigabit-per-second serial I/O bandwidth).
When designing with this part, pay attention to the FBGA 27 x 27 mm footprint and 1.0 mm pitch — it requires multilayer PCB with microvia or via-in-pad fabrication. The industrial-grade -40 °C to 100 °C junction range makes it suitable for harsh-environment systems but engineering samples of this part are no longer in active production.
Drop-in alternatives for EP2A15F672I8 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2A15F672I8 (same form factor and footprint) — differing in Package, Operating Temperature, Process Technology, Speed Grade, Embedded Memory.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2A15F672C9N
✅ Drop-In✓ In Stock
$155 / Unit
View Datasheet →EP2A15F672C9
✅ Drop-In✓ In Stock
$175 / Unit
View Datasheet →EP2A15F672C7N
✅ Drop-In✓ In Stock
$171 / Unit
View Datasheet →EP2A15F672C7
✅ Drop-In✓ In Stock
$98 / Unit
View Datasheet →EP2A15F672C7AA
✅ Drop-In✓ In Stock
$215 / Unit
View Datasheet →EP2A15F672I8 Maximum Ratings & Electrical Characteristics
| Family | APEX II |
| Process Technology | 0.15 µm all-layer copper CMOS |
| Metal Layers | Up to 8 |
| Typical Gates | 600 K |
| Logic Elements / Cells | 16,640 |
| User I/Os | 492 |
| Embedded Memory | 416 Kbits |
| Maximum Internal Frequency | 435 MHz |
| Propagation Delay (typ.) | 1.94 ns |
| Core Supply Voltage | 1.5 V (1.425 V – 1.575 V) |
| Supply Voltage Range | 1.425 V to 1.575 V |
| Operating Temperature | -40 °C to +100 °C (TJ, industrial) |
| Package | 672-FBGA, FCBGA, 27 x 27 mm, 1.0 mm pitch |
| Mounting Type | Surface Mount (BGA) |
| I/O Standards | LVTTL, LVCMOS, LVDS, MultiVolt I/O |
EP2A15F672I8 Pin Configuration
| Pin A1 | I/O — User I/O bank 1 (MultiVolt) |
| Pin A2 | I/O — User I/O bank 1 (MultiVolt) |
| Pin B1 | VCCIO_1 — I/O bank 1 supply (1.8 V / 2.5 V / 3.3 V) |
| Pin B2 | GND — Ground |
| Pin C1 | I/O — User I/O bank 1 |
| Pin C2 | I/O — User I/O bank 1 |
| Pin D1 | VCCINT — Core supply 1.5 V |
| Pin D2 | GND — Ground |
| Pin E1 | I/O — User I/O bank 2 |
| Pin E2 | I/O — User I/O bank 2 |
| Pin F1 | VCCIO_2 — I/O bank 2 supply |
| Pin F2 | GND — Ground |
| Pin G1 | I/O — User I/O bank 3 |
| Pin G2 | I/O — User I/O bank 3 |
| Pin H1 | I/O — User I/O bank 3 |
| Pin H2 | I/O — User I/O bank 3 |
| Pin J1 | VCCIO_3 — I/O bank 3 supply |
| Pin J2 | GND — Ground |
| Pin K1 | I/O — User I/O bank 4 |
| Pin K2 | TCK — JTAG test clock |
| Pin L1 | TMS — JTAG test mode select |
| Pin L2 | TDI — JTAG test data in |
| Pin M1 | TDO — JTAG test data out |
| Pin M2 | nCONFIG — Configuration control (active low) |
| Pin N1 | nSTATUS — Configuration status (active low) |
| Pin N2 | CONF_DONE — Configuration done (open-drain) |
| Pin P1 | DCLK — Configuration clock |
| Pin P2 | DATA0 — Configuration data bit 0 |
| Pin R1 | MSEL0 — Configuration mode select 0 |
| Pin R2 | MSEL1 — Configuration mode select 1 |
Typical Applications
EP2A15F672I8 is suitable for 6 applications: Telecom Line-Card Aggregation, DSP Co-Processing Engine, Industrial Machine-Vision Front-End, PCI / PCI-X Bridge / Endpoint, Legacy Defense / Avionics Backplane Interface, Test & Measurement Instrumentation Backbone.
Telecom Line-Card Aggregation
The EP2A15F672I8 is well-suited to high-density telecom line-card aggregation where 492 user I/Os and 16,640 logic cells provide plenty of state-machine and packet-classification fabric. Its 1.5 V core and MultiVolt I/O banks let designers mix 1.8 V, 2.5 V, and 3.3 V PHY interfaces on one chip without level shifters. The 672-FBGA footprint supports dense board placement alongside 10/40 Gbps PHY devices, and the device's advertised 1 Gbps serial I/O bandwidth matches legacy telecom backplanes. Plan for a 6-layer board with microvias around the 1.0 mm-pitch BGA.
Recommended
DSP Co-Processing Engine
The EP2A15F672I8's 16,640 logic elements and embedded multiplier/ESB blocks make it a competent DSP co-processor for FFT, FIR, and error-correction accelerators in software-defined radio and instrumentation. The 1.5 V core keeps dynamic power manageable even at 435 MHz internal Fmax, and the 416 Kbits of embedded memory serve as distributed line buffers. Place the device adjacent to a host DSP or PowerPC processor and use LVDS pairs for high-speed sample transfer. Watch the BGA escape routing — 1.0 mm pitch requires HDI stack-up.
Recommended
Industrial Machine-Vision Front-End
Industrial machine-vision line-scan and area-scan cameras need abundant I/O for parallel image sensors, plus enough logic for line buffers and basic preprocessing — the EP2A15F672I8 fits this role with 492 user I/Os and 16,640 cells. Its industrial -40 °C to 100 °C junction range survives factory-floor temperature swings, and the MultiVolt I/O banks accept 1.8 V CMOS image sensors and 3.3 V Camera Link drivers on the same silicon. Use the embedded system blocks (ESBs) as dual-port RAM for line buffers.
Recommended
PCI / PCI-X Bridge / Endpoint
The APEX II architecture includes dedicated on-chip PCI cores (32-bit/33 MHz PCI, 64-bit/66 MHz PCI-X) that the EP2A15F672I8 instantiates directly in fabric with full Plug-and-Play compliance. With 492 I/Os and 16,640 cells, the device can host a complete PCI-X endpoint plus custom logic for legacy peripheral bridging. Pair the FPGA with a downstream PHY or use it as a bus master on industrial backplanes. Mind the 5 V tolerance requirement of legacy PCI — confirm I/O bank VCCIO settings.
Recommended
Legacy Defense / Avionics Backplane Interface
The EP2A15F672I8 is commonly found in long-lifecycle defense and avionics systems where the industrial temperature grade and 1.5 V low-power operation are mandatory. Its 600K-gate capacity accommodates MIL-STD-1553, ARINC 429, or custom serial backplane glue logic, while 492 user I/Os handle multiple redundant data buses. Designers use Quartus II 13.0sp1 (the final supported version) for bitstream generation. Component obsolescence management is critical — most users stock last-time-buy quantities through Rochester Electronics or Heisener.
Recommended
Test & Measurement Instrumentation Backbone
High-end oscilloscopes, logic analyzers, and protocol testers historically used APEX II devices like the EP2A15F672I8 as the timing-and-acquisition backbone. The 16,640 logic cells host custom trigger logic and protocol decoders, while 492 I/Os parallel-drive ADC/DAC front-ends and backplane interfaces. The 435 MHz internal Fmax supports deep state-machine sequencing at full acquisition rates. The industrial temperature range suits benchtop and ATE rack environments; pair with a temperature-controlled chassis for best long-term stability.
Recommended
Recommended Products Summary
Engineering reference data for EP2A15F672I8 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2A15F672C9N | EP2A15F672C9 | EP2A15F672C7N | EP2A15F672C7 | EP2A15F672C7AA |
|---|---|---|---|---|---|---|
| Package | 672-FBGA, 27x27 mm, 1.0 mm pitch | 672-FBGA, 27x27 mm, 1.0 mm pitch | 672-FBGA, 27x27 mm, 1.0 mm pitch | 672-FBGA, 27x27 mm, 1.0 mm pitch | 672-FBGA, 27x27 mm, 1.0 mm pitch | 672-FBGA, 27x27 mm, 1.0 mm pitch |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Family | APEX II | APEX II | APEX II | APEX II | APEX II | APEX II |
| Operating Temperature | -40 °C to +100 °C (Industrial I8) | 0 °C to +85 °C (Commercial C9N) | 0 °C to +85 °C (Commercial C9) | 0 °C to +85 °C (Commercial C7N) | 0 °C to +85 °C (Commercial C7) | 0 °C to +85 °C (Commercial C7AA) |
| Speed Grade | -8 | -9 (faster) | -9 (faster) | -7 (slower) | -7 (slower) | -7 (slower) |
| Logic Cells | 16,640 | 16,640 (same die) | 16,640 (same die) | 16,640 (same die) | 16,640 (same die) | 16,640 (same die) |
| User I/Os | 492 | 492 | 492 | 492 | 492 | 492 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
Key Differentiators
- Industrial temperature grade (-40 °C to +100 °C TJ) (vs EP2A15F672C9 / EP2A15F672C9N)
- Mid-tier -8 speed grade balance (vs EP2A15F672C7 (speed grade -7) and EP2A15F672C9 (speed grade -9))
- Full 672-FBGA, 492-I/O silicon populated (vs EP2A15B652C7 (652-ball BGA, fewer I/Os))
Design Notes
The 672-FBGA package uses a 1.0 mm ball pitch on a 27 x 27 mm body. Escape routing requires a high-density interconnect (HDI) PCB stack-up with microvias (laser-drilled, typically 0.1 mm or smaller) or via-in-pad construction. Designers should plan a 6+ layer board with dedicated power and ground planes to deliver clean 1.5 V VCCINT and the per-bank VCCIO rails (1.8/2.5/3.3 V) without IR-drop.
The APEX II device dissipates roughly 1.5–3 W at full utilization depending on toggle rate and clock frequency. With θJA around 14–16 °C/W on a JEDEC test board for the 27 mm FBGA, junction temperature rise above ambient is approximately 25–50 °C. In a sealed industrial enclosure with 60 °C ambient, junction can approach 100 °C — keep utilization and clock rate budgeted and add thermal vias under the BGA thermal balls.
Do not assume new design starts on EP2A15F672I8 — the APEX II family is end-of-life and supported only by Quartus II 13.0sp1 (legacy). Maintain a virtual machine with the original toolchain or freeze the design and qualify through a distributor with last-time-buy inventory. For new designs, evaluate Cyclone III/IV or Cyclone V E families which provide higher logic density, lower core voltage, and active toolchain support.
Use a low-dropout regulator with sub-1% accuracy for VCCINT (1.5 V ±75 mV) to keep the device within spec — Altera recommends a 1.5 V ±5% rail. Decouple each VCCINT/VCCIO ball pair with a 0.1 µF ceramic plus a bulk 47–100 µF tantalum or polymer cap within 25 mm of the package. Add a ferrite bead on the 3.3 V supply feeding VCCIO banks to suppress switching noise.
Compliance Information
APEX II family is mature/legacy. RoHS/REACH status was not explicitly listed in the verified distributor data; verify with manufacturer or distributor documentation before compliance-critical designs.
