EP2A40B724I9N - APEX II 1.5M Gates FPGA, 724-FCBGA | Intel
MPN: EP2A40B724I9N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $265 | $2,650.00 |
| 25 | $248 | $6,200.00 |
| 100 | $225 | $22,500.00 |
| 250 | $210 | $52,500.00 |
EP2A40B724I9N Overview
What is an FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor IC containing an array of configurable logic blocks (CLBs), programmable interconnects, and embedded memory/DSP/multiplier blocks that can be rewired after manufacture to implement arbitrary digital logic. APEX II belongs to the PLD (Programmable Logic Device) hierarchy: PLD -> CPLD/FPGA -> high-density SRAM-based FPGA -> system-on-a-chip capable FPGA, and is used where ASIC-level integration is needed but flexibility is required for late-stage design changes or field upgrades.
Key features of the EP2A40B724I9N include four-phase PLL clock management, embedded CAM blocks, True-LVDS support, multi-standard I/O with 3.3 V/64 mA drive strength, and dedicated multiplier blocks for DSP pipelines. The device supports configuration via passive serial (PS), passive parallel synchronous/asynchronous (PPS/PPA), and JTAG-based in-system programming, enabling remote bitstream updates in deployed systems. Hot-socketing capability allows board-level insertion without device damage.
The architecture combines Look-Up Table (LUT)-based logic elements with embedded array blocks (EABs) that implement RAM, ROM, and CAM functions. Fast row/column interconnect, multi-tier pipelining, and dedicated carry chains deliver predictable timing closure for synchronous datapaths. The 1.5 V core reduces dynamic power versus 2.5 V predecessors by approximately 40 percent.
Typical applications include high-speed telecom line cards, DSP-based baseband processing, RAID controllers, SONET/SDH framer/mapper ASIC replacements, and pre-silicon prototyping of ASIC designs. The 724-pin FCBGA package provides a 1.27 mm pitch, suitable for 8-layer or higher-density PCB stack-ups with controlled-impedance routing.
Designers should plan power sequencing because the APEX II core requires 1.5 V before I/O ramp. Decoupling requires 0.1 µF and 0.01 µF capacitors within 5 mm of every VCC pin. For legacy replacement, verify bitstream compatibility against the Quartus II 4.2 or later development environment since the APEX II family is no longer actively recommended for new designs.
This page synthesizes distributor stock, drop-in alternatives from the APEX II family, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for EP2A40B724I9N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2A40B724I9N (same form factor and footprint) — differing in Package, Speed Grade, Operating Temperature, Maximum User I/O, Configuration Mode.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2A40B724I8N
✅ Drop-In✓ In Stock
$138.75 / Unit
View Datasheet →EP2A40B724I-9
✅ Drop-In✓ In Stock
$605 / Unit
View Datasheet →EP2A40B724I9
✅ Drop-In✓ In Stock
$150 / Unit
View Datasheet →EP2A40B724I7N
✅ Drop-In✓ In Stock
$310 / Unit
View Datasheet →EP2A40B724I-8
✅ Drop-In✓ In Stock
$280 / Unit
View Datasheet →EP2A40B724I-7
✅ Drop-In✓ In Stock
$158 / Unit
View Datasheet →EP2A40B724I9N Maximum Ratings & Electrical Characteristics
| Family | APEX II |
| Device | EP2A40 |
| System Gates | 1,500,000 |
| Logic Elements / Cells | 38,400 |
| Maximum Operating Frequency | 366 MHz |
| Process Technology | 0.15 µm CMOS |
| Core Voltage | 1.5 V |
| Package | 724-pin FCBGA (FineLine BGA), 1.27 mm pitch |
| Pin Count | 724 |
| Operating Temperature | -40 °C to +100 °C (Industrial, "I" grade) |
| Speed Grade | 9 |
| Mounting Type | Surface Mount |
| Configuration Modes | PS, PPS, PPA, JTAG |
EP2A40B724I9N 724-pin fcbga (fineline bga), 1.27 mm pitch Pin Configuration Guide
Pin configuration for EP2A40B724I9N (724-pin fcbga (fineline bga), 1.27 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2A40B724I9N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2A40B724I9N is suitable for 6 applications: SONET/SDH Telecom Framer and Mapper, DSP-Based Baseband Processing, RAID Storage Controller, ASIC Prototyping Platform, Industrial Motor Control and Automation, Military/Aerospace Avionics Legacy Sustainment.
SONET/SDH Telecom Framer and Mapper
The EP2A40B724I9N's 1.5 M system gates and 366 MHz maximum internal clock make it a strong candidate for SONET/SDH framer/mapper ASIC replacement designs. With 38,400 logic elements the device absorbs OC-48 (2.488 Gbps) data-path logic including pointer processors, payload scramblers, and section/line overhead extractors. Its 1.5 V core reduces dynamic power versus 2.5 V predecessors by approximately 40 percent, critical for line-card thermal envelopes. The 724-pin FCBGA supports up to 8 LVDS channels at 1 Gbps for backplane interconnect. Designers typically pair it with a transceiver PHY such as the HDMP-1632A or TLK1501 for full-rate OC-48 links.
Recommended
DSP-Based Baseband Processing
The EP2A40B724I9N's embedded multiplier blocks and 414 Kbits of EAB memory make it well suited to baseband signal-processing pipelines. For WCDMA/UMTS receive paths the device delivers approximately 30 GMACs of multiply-accumulate throughput at 200 MHz, sufficient for 4-channel rake receivers with 64-finger searchers. The 4-phase PLL supports per-channel sample-rate conversion, eliminating external rate-converter ASICs. Compared with a TI TMS320C6414 DSP, the APEX II offers 5-10x parallelism at the cost of higher power per MIPS. Reference designs in the APEX II Application Note AN220 cover OFDM FFT/iFFT cores for WiMAX and proprietary radio modems.
Recommended
RAID Storage Controller
RAID 5/6 controllers use XOR and Galois-field arithmetic engines that map efficiently onto FPGA logic. The EP2A40B724I9N's 38,400 logic cells can implement a 4-channel SATA II RAID 6 engine with on-the-fly encryption, leaving headroom for an embedded PowerPC-equivalent soft core managing the host interface. The 366 MHz internal operation supports 3 Gbps SATA line-rate processing. Industrial temperature grade ("I") qualifies the device for enterprise storage appliances and ruggedized military storage subsystems. SATA multiplexing, NCQ queuing, and hot-swap state machines are absorbed without external controller ICs.
Recommended
ASIC Prototyping Platform
Pre-silicon ASIC prototyping requires large logic capacity and predictable timing closure - exactly the strengths of the EP2A40B724I9N. The 1.5 M gates can map a 600 k-gate ASIC across 2-3 devices with multi-FPGA partitioning using FPGA Compiler II. JTAG-based readback supports at-speed verification of internal nodes, and the 1.27 mm FCBGA package allows proximity to the target ASIC's BGA land pattern for short critical traces. Designers use APEX II prototyping platforms to validate SOC designs before committing to a 90 nm or 65 nm ASIC tape-out, often shaving 4-6 months from ASIC development cycles.
Recommended
Industrial Motor Control and Automation
Industrial servo drives, PLCs, and CNC controllers benefit from the EP2A40B724I9N's industrial temperature range (-40 °C to +100 °C) and high logic density. The device implements multi-axis FOC (field-oriented control) loops, encoder interfaces (EnDat, SSI, BiSS), and EtherCAT or Profibus MACs in a single chip, eliminating distributed DSP arrays. The 1.5 M gates absorb full current-loop, velocity-loop, and position-loop computations for 4-axis servo at 32 kHz PWM rate. The FCBGA package's 1.27 mm pitch supports industrial PCB thermal stack-ups with heatsink mounting to handle 5-8 W FPGA dissipation.
Recommended
Military/Aerospace Avionics Legacy Sustainment
The EP2A40B724I9N maintains a long-term presence in military and aerospace programs where ASIC requalification costs are prohibitive. Its industrial temperature range, known-good silicon, and FPGA power-on SRAM configuration support fielded avionics, radar signal preprocessing, and secure communications systems. Programs such as upgraded MIDS terminals and legacy radar display processors continue to use APEX II because the bitstream formats and JTAG tooling are mature. The part's lifecycle stability on the secondary market is a deliberate fit for sustainment programs that need 10-20 year supply continuity.
Recommended
Recommended Products Summary
Engineering reference data for EP2A40B724I9N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2A40B724I8N | EP2A40B724I-9 | EP2A40B724I9 | EP2A40B724I7N | EP2A40B724I-8 |
|---|---|---|---|---|---|---|
| Package | 724-pin FCBGA (1.27 mm) | 724-pin FCBGA (1.27 mm) - same | 724-pin FCBGA (1.27 mm) - same | 724-pin FCBGA (1.27 mm) - same | 724-pin FCBGA (1.27 mm) - same | 724-pin FCBGA (1.27 mm) - same |
| Brand | Intel (Altera) | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same |
| Speed Grade | 9 | 8 | 9 | 9 | 7 | 8 |
| Temperature Range | -40 °C to +100 °C (Industrial) | -40 °C to +100 °C (Industrial) | -40 °C to +100 °C (Industrial) | -40 °C to +100 °C (Industrial) | -40 °C to +100 °C (Industrial) | -40 °C to +100 °C (Industrial) |
| System Gates | 1.5 M | 1.5 M | 1.5 M | 1.5 M | 1.5 M | 1.5 M |
| Logic Cells | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Top speed grade in the APEX II EP2A40 industrial family (vs EP2A40B724I8N)
- Industrial temperature range for harsh-environment deployment (vs EP2A40B724C9N)
- Trailing N suffix indicates lead-free packaging marking per industry convention (vs EP2A40B724I9)
Design Notes
The APEX II core requires 1.5 V on VCCINT and must ramp before or simultaneously with VCCIO; sequencing violations can trigger POR faults that prevent configuration. Use a sequencer IC such as the TPS3808G01 or ADM1184 to enforce core-first ramp. Decouple every VCC/VCCIO/VCC_PLL pin with 0.1 µF and 0.01 µF ceramic capacitors within 5 mm of the pin, plus bulk 47 µF tantalum per power plane. The PLL analog supply should be filtered with a ferrite bead and 10 µF/0.1 µF RC network to reduce jitter on the 366 MHz internal clock.
Estimated: At 100% logic utilization with toggle rate of 12.5% on 366 MHz, the EP2A40 typically dissipates 4-6 W. With FCBGA-724 theta_JA of approximately 12 °C/W on a JEDEC 4-layer test board, junction temperature rise above ambient is 48-72 °C - manageable at industrial temperatures but demanding at elevated ambient. For high-altitude avionics or sealed enclosures, use a thermal pad/heat spreader bonded to the FCBGA lid or design a 6-layer board with internal copper plane tied to VCCINT for spreading.
The 724-pin FCBGA at 1.27 mm pitch requires microvia (laser-drilled) on the top layer to fan out from the BGA balls to escape traces. Use 4-6 mil traces and via-in-pad for high-speed LVDS pairs. Matched-length routing on global clocks (within 50 mil) is mandatory because the APEX II's primary clock network has a tight skew budget. Reference the APEX II Hardware Design Guide for full BGA fan-out and stack-up recommendations, and always include a JTAG header for in-system programming and boundary-scan testing during board bring-up.
LVDS pairs on the AP2A40 require 100 Ω differential impedance with intra-pair skew below 20 ps. Use IBIS models (available from Intel) to simulate reflections and crosstalk at 1 Gbps line rates. Series-match resistor placement is critical - place within 200 mil of the driver pin and avoid stubs on T-junctions. For SDRAM interfaces, place the memory on the same side of the board within 1 inch of the FPGA to minimize round-trip delay.
Do not assume the EP2A40B724I9N is electrically compatible with newer Cyclone or Stratix bitstreams - the APEX II uses a unique bitstream format incompatible with later families. Always regenerate the programming file in Quartus II 4.2 SP2 or later for the APEX II target device. Misusing the Cyclone III/V `.pof` or `.sof` chain will not configure the device and may corrupt configuration memory. Additionally, JTAG chaining that mixes APEX II with newer families requires separate JTAG chains because of differing TMS/TCK timing.
Compliance Information
Lead-free status inferred from trailing N suffix per industry convention. RoHS, REACH, and halogen-free status not explicitly stated in verified web data - marked unknown pending confirmation from manufacturer PCN documents. AEC-Q100 not applicable (this is an FPGA, not a dedicated automotive-grade IC).
