EP2A40B724I-8 - APEX II FPGA, 38,400 LEs, 724-BGA | Altera
MPN: EP2A40B724I-8 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $425 | $425.00 |
| 10 | $380 | $3,800.00 |
| 100 | $340 | $34,000.00 |
| 500 | $305 | $152,500.00 |
| 1,000 | $280 | $280,000.00 |
EP2A40B724I-8 Overview
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that combines the density of an ASIC with the flexibility of in-system reprogrammability. FPGAs sit higher in the programmable-logic hierarchy than simple CPLDs: they provide fine-grained look-up tables (LUTs), embedded RAM blocks, DSP multipliers, and high-speed I/O that together implement complex datapaths, protocol controllers, and even soft processor cores. The APEX II architecture, released in the late 1990s, pioneered MultiCore interconnect and combines LUT-based logic with embedded RAM and CAM blocks - the engineering lineage that ultimately evolved into today's Stratix, Cyclone, and Arria device families.
Key features of the EP2A40 include 38,400 logic elements organized into 3,840 logic array blocks (LABs), a hierarchical memory architecture (ESBs - Embedded System Blocks) totaling 655 Kbits, and 540 user I/O pins enabling wide parallel buses and multiple high-speed interfaces. The device supports LVTTL, LVCMOS, PCI, GTL+, and other popular I/O standards, and integrates 4 PLLs for clock management. The 724-BGA FineLine BGA package is a surface-mount, wire-bond BGA with a fine-pitch ball grid suitable for high-I/O-count designs.
The APEX II architecture uses a MultiCore interconnect that links LABs to ESBs via direct and row/column interconnect lines, supporting pipelined datapath operation at hundreds of MHz internally. The device operates from a 1.5 V core supply and supports multiple I/O voltage banks. Because APEX II predates modern serial transceivers, high-speed parallel I/O and external clocking are the standard integration path.
Typical applications include telecommunications line cards and protocol engines, ASIC prototyping, custom DSP pipelines, high-speed data acquisition front-ends, and industrial control systems. The 540 user I/Os and large RAM/CAM blocks also make the EP2A40 attractive for deep-packet inspection and ATM/Sonet networking designs.
When designing with this FPGA, verify the Quartus version compatibility: APEX II is supported by Quartus II (legacy toolchains), and Intel currently maintains it as a mature device for legacy re-designs. Power sequencing, decoupling, and JTAG configuration topology follow the standard Altera BGA guidelines in the device handbook.
This page synthesizes sourced distributor inventory, APEX II family context, and drop-in family variants not consolidated in any single manufacturer datasheet, providing engineers with a single decision view for legacy redesign work.
Drop-in alternatives for EP2A40B724I-8 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2A40B724I-8 (same form factor and footprint) — differing in Operating Temperature, Package, Speed Grade, Process Technology, Configuration Mode.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2A40B724I-7
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$158 / Unit
View Datasheet →EP2A40B724CP
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$71 / Unit
View Datasheet →EP2A40B724C9
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$395.38 / Unit
View Datasheet →EP2A40B724C8
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$615 / Unit
View Datasheet →EP2A40B724C7
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$650 / Unit
View Datasheet →EP2A40B724I-8 Maximum Ratings & Electrical Characteristics
| Family | APEX II |
| Logic Elements (LEs) | 38,400 |
| Logic Array Blocks (LABs) | 3,840 |
| Embedded System RAM | 655,360 bits (655 Kbits) |
| Maximum User I/O | 540 |
| Package | 724-ball FineLine BGA |
| Package Code | HBGA / S-PBGA-B724 |
| Speed Grade | -8 |
| Operating Temperature | -40C to +100C (Industrial) |
| Core Supply Voltage | 1.5 V (1.425 V to 1.575 V) |
| PLLs | 4 |
| Mounting Type | Surface Mount |
| Configuration Mode | JTAG / passive serial / passive parallel |
EP2A40B724I-8 hbga / s-pbga-b724 Pin Configuration Guide
Pin configuration for EP2A40B724I-8 (hbga / s-pbga-b724 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2A40B724I-8.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2A40B724I-8 is suitable for 6 applications: Telecommunications Line Cards, ASIC Prototyping, High-Speed Data Acquisition, Custom DSP Pipelines, Industrial Control Systems, Deep Packet Inspection / Networking.
Telecommunications Line Cards
The EP2A40B724I-8 fits telecom line-card applications because it combines 38,400 logic elements with 655 Kbits of embedded RAM and 540 user I/Os - enough density and pin count to implement UTOPIA, POS-PHY, or custom cell/ATM framers alongside payload processing. The 724-ball BGA exposes up to 540 user I/Os that can be split across multiple 8-bit/16-bit parallel bus interfaces, allowing direct connection to network processors, TCAMs, and PHY devices without external glue logic. APEX II's ESB blocks also support CAM mode for fast table lookup in route lookup or QoS classification paths. Industrial temperature rating enables deployment in outdoor DSLAM or aggregation cabinets.
Recommended
ASIC Prototyping
For ASIC prototyping the EP2A40B724I-8 offers 38,400 LEs and 655 Kbits of RAM that can be partitioned across synthesized ASIC blocks via the Quartus II LogicLock flow. The MultiCore interconnect allows high-fanout signal routing critical for ASIC emulation, and the 540 user I/Os enable breakout to test fixtures for early silicon bring-up. Industrial temperature grade supports prototype validation under aggressive environmental stress. Quartus II's design-partitioning features let teams move IP blocks between FPGAs incrementally as the ASIC shrinks in area.
Recommended
High-Speed Data Acquisition
The EP2A40B724I-8 suits high-speed data-acquisition front-ends because its 540 user I/Os can be configured as parallel LVTTL/LVCMOS inputs to capture ADC output data at hundreds of MSPS aggregate rate. The 655 Kbits of embedded RAM is configurable as FIFO depths of up to 32K x 16, which is sufficient to buffer multiple ADC frames before forwarding to a downstream processor. The four on-chip PLLs provide deskew and clock multiplication needed for source-synchronous ADC capture. Industrial temperature rating is advantageous for outdoor or rugged industrial sensor systems.
Recommended
Custom DSP Pipelines
For custom DSP pipelines, the EP2A40B724I-8 fits because its ESB blocks can be configured as multiplier accumulators (MAC) and as RAM/ROM lookup tables for coefficient storage. APEX II supports signed multiplier inference through MegaWizard plug-ins in Quartus II, allowing FIR, polyphase, and FFT implementations at audio and baseband rates. The industrial temperature rating makes the part suitable for industrial DSP applications such as vibration analysis or motor-control loops. 540 user I/Os permit direct connection to multi-channel ADC front-ends.
Recommended
Industrial Control Systems
The EP2A40B724I-8 supports industrial control applications where deterministic response, parallel I/O, and ruggedized temperature rating are required. 540 user I/Os map directly to multi-axis motion controllers or sensor aggregators with PWM, quadrature encoder, and GPIO functions in a single device. The 1.5 V core and 3.3 V I/O are compatible with legacy industrial backplanes. Industrial temperature rating covers -40C to +100C operation typical of factory-floor and outdoor cabinet installations.
Recommended
Deep Packet Inspection / Networking
Deep-packet inspection requires pattern matching against thousands of rules with deterministic throughput, and the EP2A40B724I-8's 655 Kbits of CAM-capable ESB blocks enable hardware-accelerated rule lookup at wire speed. The 38,400 LEs allow tightly pipelined parsers to process 10+ Gbps across 540 user I/Os segmented into multiple network interfaces. APEX II's industrial temperature rating suits outdoor aggregation switches. The four PLLs provide flexible clocking for multi-rate Ethernet and SONET interfaces. Lower-density APEX II variants can be used for per-port offload engines.
Recommended
Recommended Products Summary
Engineering reference data for EP2A40B724I-8 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2A40B724I-7 | EP2A40B724CP | EP2A40B724C9 | EP2A40B724C8 | EP2A40B724C7 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 724-ball FineLine BGA | 724-ball FineLine BGA (same) | 724-ball FineLine BGA (same) | 724-ball FineLine BGA (same) | 724-ball FineLine BGA (same) | 724-ball FineLine BGA (same) |
| Logic Elements | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 |
| Embedded RAM (Kbits) | 655 | 655 | 655 | 655 | 655 | 655 |
| Maximum User I/Os | 540 | 540 | 540 | 540 | 540 | 540 |
| Speed Grade | -8 | -7 (faster) | -P (slower, power-optimized) | -9 (slower) | -8 (same) | -7 (faster) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to 85C) | Commercial (0C to 85C) | Commercial (0C to 85C) | Commercial (0C to 85C) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
Key Differentiators
- Fastest industrial-grade APEX II option at the 724-ball BGA pitch (vs EP2A40B724I-7)
- Industrial temperature rating vs commercial-grade siblings (vs EP2A40B724C9 / EP2A40B724C8 / EP2A40B724C7)
- Standard speed/power grade vs power-optimized variant (vs EP2A40B724CP)
Design Notes
The 724-ball BGA exposes the silicon through a flip-chip or wire-bond thermal slug; in dense line-card layouts, attach a heatsink via the top-side thermal pad to keep junction temperature within industrial -40C to +100C limits. Estimated: at VCCINT = 1.5 V, all 38,400 LEs toggling, and typical APEX II junction thermal resistance (~0.7 C/W with heatsink), the device dissipates ~3-5 W steady state - plan copper pour or airflow accordingly.
Use 0.1 uF decoupling on every VCCINT pin and 0.01 uF on every VCCIO pin placed within 100 mils of the BGA ball; add bulk 47-100 uF tantalum or polymer caps per voltage rail at the PCB edge. Matched-length routing for JTAG TCK/TMS/TDO/TDI within 100 mils preserves boundary-scan integrity. Use the Altera-provided 724-ball land pattern and matched-stackup impedance control for LVDS or source-synchronous interfaces.
Distribute IO banks across the BGA so each I/O voltage group is concentrated in a contiguous region of the ball map, simplifying plane-splitting. Place configuration and clock pins on outer ball rows for shorter escape traces. APEX II benefits from 4-layer minimum stackup (sig/gnd/vcc/sig) with continuous ground plane under the BGA; stitched ground vias around the package perimeter improve thermal and EMI performance.
Quartus II 13.0sp1 is the final release with APEX II device support; subsequent Quartus Prime versions drop the family. Retain a Quartus II install for any future debug or recompile. The APEX II family does NOT support modern serial transceivers or hard PCIe IP - any such interface must be implemented through soft IP and external PHY. JTAG chain should be verified in isolation before loading configuration data.
Compliance Information
RoHS/REACH compliance depends on date code; APEX II parts were originally non-RoHS. Contact franchised distributor (Rochester Electronics) for the specific CoC. AEC-Q100 is not applicable because FPGAs are not automotive qualified at the silicon level; system-level qualification is the integrator's responsibility.
