EP2A40B724I8N - 1.5M Gates APEX II FPGA, 724-BGA | Altera
MPN: EP2A40B724I8N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $245 | $2,450.00 |
| 100 | $198.5 | $19,850.00 |
| 500 | $162 | $81,000.00 |
| 1,000 | $138.75 | $138,750.00 |
EP2A40B724I8N Overview
An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable I/O cells interconnected by a hierarchical routing fabric. After manufacturing, the device is customized by loading a configuration bitstream that sets each switch matrix and lookup-table content. APEX II devices in particular are built on a MultiCore architecture that combines fine-grained logic with embedded ESB (Embedded System Blocks) for RAM, ROM, and CAM functions, allowing single-chip implementation of complex glue logic, bus interfaces, and DSP datapaths. The hierarchy is: FPGA -> programmable logic device (PLD) -> loadable PLD -> logic IC -> integrated circuit -> semiconductor.
Key features of the EP2A40B724I8N include 540 LABs/ESBs, 655,360 bits of embedded memory, 38,400 logic cells, 16 macrocells per LAB cluster (PLA-style grouping), a propagation delay of 1.7-1.78 ns, and 536 maximum user I/O. The device supports in-system programmability via the IEEE 1149.1 boundary-scan interface plus dedicated configuration ports (PS, AS, JTAG), and includes on-chip PLLs for clock multiplication and deskew. Its CMOS technology node and 1.5 V core make it suitable for high-density designs targeting telecom backplanes, video processing, and high-speed serial interfacing.
The architectural depth of the APEX II family comes from its MultiCore block, which combines a fine-grained logic element (LE) with a coarse-grained ESB. Each LE contains a 4-input LUT plus a programmable register, while each ESB provides up to 2,048 bits of dual-port RAM. This hybrid fabric allows the EP2A40B724I8N to absorb DSP, control logic, and buffering functions into a single chip without off-chip memory or companion ASICs.
Typical applications for this FPGA include high-throughput data-path designs, network switching fabric, video/image processing pipelines, telecom line-card controllers, ASIC prototyping, and high-speed instrumentation. With 38,400 logic cells and 655 Kbits of embedded RAM, the EP2A40B724I8N is well suited to designs that would otherwise require a multi-FPGA solution in the Cyclone or older APEX 20K series.
When designing with the EP2A40B724I8N, engineers should plan for the device's 1.5 V core supply, multiple VCCINT/VCCIO rails, and BGA thermal dissipation. A 6+ layer PCB with dedicated power planes is recommended; the 724-pin FCBGA demands via-in-pad or microvia technology for fan-out and reliable assembly.
This page synthesizes distributor pricing, pin-compatible APEX II same-package drop-in alternatives, and practical design notes not found in the original Altera datasheet, helping engineers sourcing legacy or end-of-life Altera/Intel FPGA inventory.
Drop-in alternatives for EP2A40B724I8N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2A40B724I8N (same form factor and footprint) — differing in Package, Operating Temperature, Speed Grade, Process Technology, System Gates.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2A40B724I8
✅ Drop-In✓ In Stock
$611 / Unit
View Datasheet →EP2A40B724I7N
✅ Drop-In✓ In Stock
$310 / Unit
View Datasheet →EP2A40B724I7
✅ Drop-In✓ In Stock
$215 / Unit
View Datasheet →EP2A40B724I-8
✅ Drop-In✓ In Stock
$280 / Unit
View Datasheet →EP2A40B724C8N
✅ Drop-In✓ In Stock
$199.5 / Unit
View Datasheet →EP2A40B724C9N
✅ Drop-In✓ In Stock
$99.5 / Unit
View Datasheet →EP2A40B724CP
✅ Drop-In✓ In Stock
$71 / Unit
View Datasheet →EP2A40B724I8N Maximum Ratings & Electrical Characteristics
| Series | APEX II (EP2A40) |
| Device Family | APEX II Field Programmable Gate Array |
| Manufacturer | Altera (now Intel PSG) |
| Logic Cells / Elements | 38,400 |
| System Gates | 1,500,000 (1.5 M) |
| Maximum User I/O | 536 |
| Terminal Count (Package Pins/Balls) | 724 |
| Package Type | FCBGA (Fine-pitch Chip-Scale BGA) |
| Process Technology | 0.15 µm CMOS |
| Core Supply Voltage (VCCINT) | 1.5 V |
| Maximum Supply Voltage | 1.575 V |
| Embedded Memory (RAM bits) | 655,360 (655 Kbit) |
| Number of LABs/ESBs | 540 |
| Macrocells | 16 (PLA-type grouping) |
| Propagation Delay (tpd) | 1.7 - 1.78 ns |
| Maximum Internal Clock Frequency | 376 MHz |
| Configuration Mode | PS / AS / JTAG |
| Operating Temperature Grade | Industrial (-40C to +85C) |
| Mounting Type | Surface Mount (BGA) |
| Lifecycle | Obsolete / NRND (Altera APEX II family) |
EP2A40B724I8N fcbga (fine-pitch chip-scale bga) Pin Configuration Guide
Pin configuration for EP2A40B724I8N (fcbga (fine-pitch chip-scale bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2A40B724I8N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2A40B724I8N is suitable for 7 applications: Telecom Line-Card Controllers, Video and Image Processing Pipelines, ASIC Prototyping and Emulation, High-Speed Instrumentation and Test Equipment, Network Switching Fabric and Routers, Industrial Automation and Motion Control, Aerospace Avionics and Legacy Military Systems.
Telecom Line-Card Controllers
The EP2A40B724I8N fits telecom line-card controllers because its 1.5 M system gates, 38,400 logic cells, and 655 Kbits of embedded RAM can absorb packet-processing state machines, ATM/SONET framers, and on-chip buffer management in a single FPGA. The 536 user I/O connect directly to TDM buses, framers, and serializer-deserializer links without external glue logic. The 1.7 ns propagation delay supports 376 MHz internal operation, which is sufficient for OC-48/STM-16 datapath forwarding and aggregation. Industrial -40C to +85C temperature grade meets NEBS-style telecom cabinet requirements. The 1.5 V core keeps per-gate switching power low enough for densely populated line cards with limited airflow.
Recommended
Video and Image Processing Pipelines
The EP2A40B724I8N serves well in video/image processing pipelines where designers need wide datapaths, on-chip line buffers, and parallel pixel buses. The 655 Kbits of embedded ESB memory can hold scan-line buffers and motion-estimation windows without off-chip SRAM, reducing BOM cost and latency. The 38,400 logic cells support real-time convolution, color-space conversion, and motion-compensation engines for SDTV/HDTV streams. The 536 user I/O handle 16/32-bit video buses plus BT.656/BT.1120 interfaces. Industrial temperature grade allows deployment in broadcast and surveillance equipment. Designers can pair the EP2A40B724I8N with a video ADC/DAC and DDR memory controller built into the MultiCore fabric.
Recommended
ASIC Prototyping and Emulation
The EP2A40B724I8N is commonly used as an ASIC prototyping platform because its 1.5 M gates and 38,400 logic cells can map sizable ASIC netlists into a single device, avoiding multi-FPGA partitioning. The MultiCore architecture with ESBs maps easily to ASIC RAM/ROM macros, and 536 I/O pins provide ample capacity for ASIC pin emulation with breakout headers. Industrial temperature operation is ideal for in-circuit emulators used during SoC bring-up. The 724-FCBGA package is supported by most ASIC prototyping board vendors. Engineers can chain multiple EP2A40B724I8N devices for ASIC designs exceeding 1.5 M gates using the dedicated I/O pins for inter-FPGA hand-off.
Recommended
High-Speed Instrumentation and Test Equipment
The EP2A40B724I8N is a strong fit for high-speed instrumentation such as logic analyzers, protocol testers, and ATE because its 376 MHz maximum internal clock and 1.7 ns propagation delay support real-time stimulus generation and response capture. The 38,400 logic cells allow large pattern-matching engines, while 655 Kbits of embedded memory buffer captured samples on-chip. The 536 user I/O are sufficient for multi-channel LVDS probe front-ends, with JTAG boundary scan simplifying board-level test. Industrial -40C to +85C operation supports bench-top and field-deployed test gear. The 1.5 V core keeps heat density manageable in sealed instrument enclosures.
Recommended
Network Switching Fabric and Routers
The EP2A40B724I8N is well matched to network switching fabric and router line cards because the MultiCore architecture can implement CAM-based lookup tables, queue managers, and header-processing engines in a single chip. The 655 Kbits of embedded RAM stores forwarding tables, and 38,400 logic cells implement priority schedulers. The 536 user I/O support multiple SPI-4.2 or POS-PHY interfaces to network processors. Industrial temperature grade handles the thermal envelope of central-office and edge-router chassis. The 1.5 V core, while older, balances performance with the power budget typical of 1U/2U router line cards.
Recommended
Industrial Automation and Motion Control
The EP2A40B724I8N fits industrial motion-control designs that combine multi-axis servo loops, encoder interfaces, and deterministic state machines. Its 38,400 logic cells hold several PID controllers and trajectory planners in parallel. The 536 user I/O can interface to quadrature encoders, PWM outputs, and fieldbus links (Profibus, CANopen). Industrial -40C to +85C operation handles factory-floor thermal stress, and the 1.5 V core with simple power sequencing suits 24V industrial backplanes with intermediate DC-DC rails. Embedded ESBs implement position-capture FIFOs directly on-chip, reducing external SRAM and improving loop-rate determinism.
Recommended
Aerospace Avionics and Legacy Military Systems
The EP2A40B724I8N is found in legacy aerospace avionics programs where the part was originally qualified under DO-254 or military standards and re-spinning the design is impractical. Its 1.5 M gates absorb flight-control state machines, sensor fusion, and MIL-STD-1553 bus interfaces. Industrial temperature grade and CMOS robustness suit avionics thermal environments. With long-term Rochester Electronics franchised inventory, the EP2A40B724I8N continues to support fielded systems well past its original production life. Designers integrating new sub-systems can use EP2A40B724C8N or EP2A40B724C9N as commercial-temp equivalents during bench integration.
Recommended
Recommended Products Summary
Engineering reference data for EP2A40B724I8N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2A40B724I8 | EP2A40B724I7N | EP2A40B724I7 | EP2A40B724I-8 | EP2A40B724C8N | EP2A40B724C9N | EP2A40B724CP |
|---|---|---|---|---|---|---|---|---|
| Package | FCBGA-724 (1.0 mm pitch) | FCBGA-724 - same | FCBGA-724 - same | FCBGA-724 - same | FCBGA-724 - same | FCBGA-724 - same | FCBGA-724 - same | FCBGA-724 - same |
| Brand | Altera (now Intel PSG) | Altera - same | Altera - same | Altera - same | Altera - same | Altera - same | Altera - same | Altera - same |
| Series | APEX II (EP2A40) | APEX II - same | APEX II - same | APEX II - same | APEX II - same | APEX II - same | APEX II - same | APEX II - same |
| Logic Cells | 38,400 | 38,400 - same | 38,400 - same | 38,400 - same | 38,400 - same | 38,400 - same | 38,400 - same | 38,400 - same |
| System Gates | 1.5 M | 1.5 M - same | 1.5 M - same | 1.5 M - same | 1.5 M - same | 1.5 M - same | 1.5 M - same | 1.5 M - same |
| Embedded Memory | 655 Kbit | 655 Kbit - same | 655 Kbit - same | 655 Kbit - same | 655 Kbit - same | 655 Kbit - same | 655 Kbit - same | 655 Kbit - same |
| User I/O | 536 | 536 - same | 536 - same | 536 - same | 536 - same | 536 - same | 536 - same | 536 - same |
| Temperature Grade | Industrial (-40C to +85C) | Industrial - same | Industrial - same | Industrial - same | Industrial - same | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C), prototype |
| Speed Grade | I8 | I8 - same | I7 (slower) | I7 (slower) | I-8 (-8 speed bin) | C8 | C9 (faster) | C prototype |
| Lead-Free (N suffix) | Yes (Pb-free balls) | No (SnPb balls) | Yes (Pb-free) | No (SnPb) | No (SnPb) | Yes (Pb-free) | Yes (Pb-free) | No (prototype) |
Key Differentiators
- Highest-density member of the APEX II 724-ball family (vs EP2A25F672I8N)
- Industrial temperature range with N-suffix Pb-free balls (vs EP2A40B724C8N)
- Tighter speed grade than lower-binned APEX II variants (vs EP2A40B724I7N)
- 1.5 V core is more power-efficient than older 2.5 V APEX 20K family (vs EP20K600CF672I8N)
Design Notes
The EP2A40B724I8N requires a tightly regulated 1.5 V VCCINT supply with tolerance within +/-5%. Multiple VCCINT and VCCIO balls must be decoupled with 0.1 µF X7R ceramic capacitors placed as close to each ball cluster as the BGA fan-out allows. A bulk 22-47 µF tantalum or polymer capacitor should sit near each supply pin group. Power sequencing (VCCINT before VCCIO) per APEX II datasheet is recommended to avoid I/O bus contention. Estimated: at 100% logic utilization and 376 MHz, ICCINT can exceed 1.5 A; designers should budget 2 A for the 1.5 V rail.
The 724-ball FCBGA (1.0 mm pitch) demands a high-density PCB with microvia or via-in-pad technology for fan-out. Use at least a 6-layer stack-up with dedicated VCCINT, VCCIO, and GND planes to provide low-impedance power distribution and minimize EMI. Per APEX II hardware手册 guidelines, all BGA balls must be soldered with proper paste stencil aperture (typically 0.5 mm diameter for 1.0 mm pitch). Reflow profile should follow JEDEC J-STD-020 for the I8 industrial variant. PCB warpage must stay below 0.3% to avoid head-in-pillow defects.
The EP2A40B724I8N FCBGA relies on the package balls and PCB copper for heat dissipation - there is no exposed die pad. For high-utilization designs (50,000+ LEs switching at 200+ MHz), thermal management becomes critical. Use thermal vias under the BGA to a bottom-side copper pour, and consider a heat-spreader plate for closed enclosures. Estimated: at full toggle rate and 1.5 V core, junction-to-ambient thermal resistance theta_JA is ~15 C/W with proper via array. Active cooling (small fan) is recommended for >2 W dissipation in sealed enclosures.
Common pitfalls with the EP2A40B724I8N include: (1) confusing the I8 (speed grade) with the I8 (industrial temperature) suffix - both apply simultaneously but are orthogonal in part-number decoding; (2) mixing Pb-free N-suffix balls with SnPb pastes during hand rework, causing brittle joints; (3) assuming 1.5 V VCCIO support - I/O banks operate at 3.3 V/2.5 V/1.8 V/1.5 V but require separate VCCIO rails; (4) ignoring JTAG TAP position when chaining multiple FPGAs on a board, leading to configuration failures.
High-speed signals on the EP2A40B724I8N should be length-matched within +/-50 mil for parallel buses and within +/-25 mil for source-synchronous interfaces like DDR. Keep LVDS pairs length-matched to within +/-10 mil and route them over a continuous GND reference plane. Place configuration PROM (e.g., EPC16) within 2 inches of the FPGA's DATA, DCLK, and nCONFIG pins for fast passive serial (PS) configuration. Decoupling capacitors must connect to GND with short vias (<10 mil) to maintain effectiveness above 100 MHz.
Compliance Information
N suffix per JEDEC J-STD-609 indicates Pb-free terminal finish. RoHS, REACH, halogen-free, and conflict-mineral compliance status not present in the verified web data - mark unknown until confirmed against the manufacturer material declaration. AEC-Q100 is not applicable - APEX II is not AEC-Q100 qualified.
