EP2A40B724C9N - 1.5M Gates APEX II FPGA, 366MHz, 724-BGA | Altera
MPN: EP2A40B724C9N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $165 | $1,650.00 |
| 100 | $142 | $14,200.00 |
| 500 | $120 | $60,000.00 |
| 1,000 | $99.5 | $99,500.00 |
EP2A40B724C9N Overview
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that allows engineers to implement arbitrary digital logic through a sea of configurable logic blocks, programmable interconnect, and I/O cells. Within the broader taxonomy, FPGAs sit under programmable logic devices -> logic ICs -> integrated circuits -> semiconductors, complementing CPLDs (which target simpler glue logic) and ASICs (which are application-specific but not field-reprogrammable). The APEX II family specifically targets high-performance data-path, telecommunications, and DSP designs that require on-chip RAM and multipliers.
Key features of the EP2A40B724C9N include 38,400 logic cells, a maximum propagation delay of 2.05 ns, 0.15 µm process geometry, 1.5 V core supply, and 536 user I/O lines for high-bandwidth external interfacing. The 724-ball FCBGA package uses a 1.270 mm ball pitch and supports surface-mount assembly on standard FR-4 PCB substrates with controlled-impedance routing. The device also integrates MultiVolt I/O support for interfacing with mixed-voltage rails common in telecom backplane designs.
The APEX II architecture combines a Logic Array Block (LAB) fabric with Embedded System Blocks that provide true dual-port RAM, FIFO buffers, and dedicated multiplier blocks. This makes the EP2A40B724C9N particularly well-suited for high-throughput signal-processing pipelines where parallel arithmetic paths need simultaneous data storage and compute resources. The 366 MHz internal frequency enables 32-bit datapath designs in the 100-200 MHz operating range typical of communications infrastructure.
Typical applications include telecommunications line-card processing, high-speed networking ASIC prototyping, DSP accelerator functions, and baseband signal processing. The wide I/O count (536 user I/O) and high pin density also make the device suitable for custom interface bridging and protocol conversion in industrial embedded systems.
When designing with this FPGA, engineers must provide adequate decoupling on all VCCINT and VCCIO rails, follow Intel/Altera's Quartus II place-and-route tool flow, and respect the device's junction temperature envelope under industrial operating conditions. Because the APEX II family is a mature node, second-source supply and long-term availability should be verified before committing to new designs.
This page synthesizes distributor pricing snapshots, same-family drop-in alternatives, and practical design guidance that consolidates information typically scattered across multiple Altera/Intel APEX II datasheets and third-party distributor listings.
Drop-in alternatives for EP2A40B724C9N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2A40B724C9N (same form factor and footprint) — differing in Package, Process Technology, Operating Temperature, Series, System Gates.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2A40B724C9
✅ Drop-In✓ In Stock
$395.38 / Unit
View Datasheet →EP2A40B724C9ES
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →EP2A40B724C8N
✅ Drop-In✓ In Stock
$199.5 / Unit
View Datasheet →EP2A40B724C8
✅ Drop-In✓ In Stock
$615 / Unit
View Datasheet →EP2A40B724C7N
✅ Drop-In✓ In Stock
$175 / Unit
View Datasheet →EP2A40B724C9N Maximum Ratings & Electrical Characteristics
| Family | APEX II |
| Series | EP2A40 |
| Device Type | FPGA (Field-Programmable Gate Array) |
| System Gates | 1,500,000 |
| Logic Elements / Cells | 38,400 |
| Maximum Frequency | 366 MHz |
| Propagation Delay | 2.05 ns |
| Process Technology | 0.15 µm CMOS |
| Core Supply Voltage | 1.5 V |
| User I/O Count | 536 |
| Package | 724-ball FCBGA (Fine-pitch Chip-Scale BGA) |
| Terminal Pitch | 1.270 mm |
| Number of Terminals | 724 |
| Terminal Form | Ball |
| Output Function | Macrocells |
| Operating Temperature Grade | Industrial (OTHER / per datasheet) |
| Mounting Type | Surface Mount |
EP2A40B724C9N 724-ball fcbga (fine-pitch chip-scale bga) Pin Configuration Guide
Pin configuration for EP2A40B724C9N (724-ball fcbga (fine-pitch chip-scale bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2A40B724C9N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2A40B724C9N is suitable for 6 applications: Telecommunications Line-Card Processing, High-Speed DSP Accelerator, Networking ASIC Prototyping, Baseband Signal Processing, Custom Interface Bridging, Industrial Embedded Control Systems.
Telecommunications Line-Card Processing
The EP2A40B724C9N fits telecommunications line-card processing because its 38,400 logic cells and 536 user I/O lines support multi-channel framer/mapper functions at line rate. Its 366 MHz core frequency enables 32-bit datapath designs in the 100-200 MHz range typical of telecom backplanes, while the 1.5 V core keeps per-channel power reasonable for densely populated line cards. The integrated Embedded System Blocks provide true dual-port RAM for buffer storage between framer and mapper stages. Placed on the line card between SERDES transceivers and the network processor, the device handles bit-error monitoring, HDLC framing, and ATM cell segmentation at wire speed. Trade-off: because it is built on a mature 0.15 µm process, per-gate dynamic power is higher than modern 28/14 nm FPGAs; designers must budget thermal envelope accordingly.
Recommended
High-Speed DSP Accelerator
The EP2A40B724C9N suits DSP accelerator functions because the APEX II architecture embeds dedicated multiplier blocks alongside the LAB fabric, enabling parallel FIR/FFT pipelines at the 366 MHz clock rate. With 38,400 cells, designers can instantiate multi-tap filters and complex mixers that would otherwise require a discrete DSP farm. The 536 user I/O also allows the device to act as a coprocessor, accepting samples from high-speed ADCs and delivering processed streams to a host CPU. In a typical radar or software-defined radio chain, the FPGA sits between the ADC and the host, performing channelization and pulse compression. Trade-off: APEX II multipliers are limited compared with the hard DSP blocks of newer Cyclone/Arria families, so block-level partitioning must respect this.
Recommended
Networking ASIC Prototyping
The EP2A40B724C9N is well suited to ASIC prototyping because its 1.5 M system gates and 38,400 cells can map most mid-complexity networking ASICs (switches, routers, protocol offload engines) before committing to mask sets. The 536 user I/O count accommodates wide external buses and SERDES parallel interfaces, and the 1.5 V core keeps internal timing margins predictable. Engineers typically use the FPGA as a behavioral and timing reference, then validate the same logic on the silicon ASIC. The Quartus II toolchain produces realistic timing reports that translate well to the final ASIC flow. Trade-off: APEX II is an older process, so power and area estimates from FPGA prototyping are conservative relative to modern ASIC nodes.
Recommended
Baseband Signal Processing
The EP2A40B724C9N fits baseband signal processing in wireless infrastructure because the combination of 38,400 cells, embedded multipliers, and 536 I/O allows designers to implement channel estimation, equalization, and turbo decoding in a single device. The 366 MHz clock enables baseband pipelines to keep pace with mid-tier LTE/WCDMA sample rates when properly pipelined. Placed between the RF front-end and the baseband CPU, the FPGA absorbs the heavy lifting of real-time channel processing. Trade-off: for very-high-throughput 5G NR applications, the APEX II fabric density may be insufficient and a Cyclone V/Arria 10 successor is preferred; designers must verify timing closure.
Recommended
Custom Interface Bridging
The EP2A40B724C9N works well as a custom interface bridge in industrial embedded systems because its 536 user I/O lines and MultiVolt I/O support let it bridge legacy parallel buses (PCI, VME, custom LVTTL/CMOS) to modern high-speed serial links. With 38,400 cells, the device can implement protocol converters, bus arbiters, and FIFO bridges without external glue logic. The 724-ball FCBGA package supports dense board layouts where many parallel signals need to be routed between mismatched voltage domains. Placed on a mezzanine card between legacy and modern subsystems, the FPGA provides buffering, voltage translation, and protocol translation in a single chip. Trade-off: this is not a low-power part, so thermal management and supply sequencing are mandatory.
Recommended
Industrial Embedded Control Systems
The EP2A40B724C9N fits industrial embedded control because its high logic density supports complex state machines, soft-CPU cores, and parallel sensor-fusion logic in factory automation equipment. The 724-ball FCBGA with 1.270 mm pitch is surface-mount compatible with standard industrial PCB processes, and the 1.5 V core is straightforward to derive from 3.3 V/5 V industrial rails. Designers use the FPGA to implement deterministic control loops, custom industrial protocols (PROFIBUS, EtherCAT, Modbus derivatives), and machine-safety logic in one device. Placed on a PLC or motion-controller board, the FPGA provides multi-axis timing and parallel I/O handling. Trade-off: APEX II is EOL, so long-life industrial programs should qualify an alternative family up front.
Recommended
Recommended Products Summary
Engineering reference data for EP2A40B724C9N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2A40B724C9 | EP2A40B724C9ES | EP2A40B724C8N | EP2A40B724C8 | EP2A40B724C7N |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 724-ball FCBGA (1.270 mm pitch) | 724-ball FCBGA - same | 724-ball FCBGA - same | 724-ball FCBGA - same | 724-ball FCBGA - same | 724-ball FCBGA - same |
| Logic Cells | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 |
| System Gates | 1.5 M | 1.5 M | 1.5 M | 1.5 M | 1.5 M | 1.5 M |
| Speed Grade | C9 (366 MHz) | C9 (366 MHz) | C9 (366 MHz) ES | C8 (slower) | C8 (slower) | C7 (slowest) |
| User I/O | 536 | 536 | 536 | 536 | 536 | 536 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Process | 0.15 µm CMOS | 0.15 µm CMOS | 0.15 µm CMOS | 0.15 µm CMOS | 0.15 µm CMOS | 0.15 µm CMOS |
Key Differentiators
- Highest speed grade in the EP2A40 724-ball FCBGA family (vs EP2A40B724C8N)
- Largest logic capacity in the 724-ball FCBGA footprint (vs EP2A25B724C7)
- Engineering-sample variant available for early validation (vs EP2A40B724C9ES)
Design Notes
Estimated: the 724-ball FCBGA with 1.270 mm ball pitch demands a PCB with laser-drilled microvias, solder-mask-defined pads, and at least 6 routing layers to fan out the dense center array. Per JEDEC BGA design guidelines, escape routing must use the top two layers under the package, with via-in-pad recommended for inner-row signals. Plan for X-ray inspection of solder joints - BGA packages cannot be visually inspected.
Estimated: at 366 MHz internal operation across 38,400 cells and 536 I/O switching, dynamic current on the 1.5 V VCCINT rail can exceed 1.5 A in worst-case patterns. Decouple VCCINT with at least ten 0.1 µF X7R ceramic capacitors placed within 100 mil of the package perimeter, plus a single 100 µF bulk capacitor per voltage domain. Use the Altera PowerPlay early-power estimator to model real workload power before board layout finalizes.
The 0.15 µm APEX II process dissipates meaningfully more power per logic cell than modern 28/14 nm FPGAs. At 366 MHz under typical vector activity, expect junction temperature rise of 20-40 C above ambient with a properly stitched thermal via array under the FCBGA. Reference the device's theta_JA value in the APEX II datasheet and ensure the system enclosure provides adequate airflow.
Do not confuse the EP2A40B724C9N with EP2A25B724C7 - both share the 724-ball FCBGA outline but differ by 30-40% in logic density and Fmax. Cross-check the device marking and the speed-grade suffix on the package top side before soldering. Also verify Quartus II device support level - older Altera toolchains may not include APEX II libraries; use Quartus II Service Pack 2 or later.
Compliance Information
RoHS and lead-free compliance inferred from distributor datasheet listings (N suffix indicates Pb-free). Halogen-free status and conflict-minerals declaration not explicitly confirmed in the verified web data; refer to manufacturer material declaration for definitive status.
