EP2A40F33C-8 - 40K LE APEX II FPGA, FBGA-672 | Intel / Altera
MPN: EP2A40F33C-8 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
EP2A40F33C-8 Overview
Field Programmable Gate Arrays (FPGAs) are a class of programmable logic devices that allow designers to configure digital logic after PCB fabrication, enabling rapid prototyping and design iteration. The APEX II family sits within the broader taxonomy of PLD -> CPLD/FPGA -> programmable logic IC -> semiconductor, and is designed for high-performance DSP, communications, and parallel processing applications. EP2A40 variants are typically used where high gate count and embedded dual-port RAM are required.
The F33 package designation indicates a 672-ball FineLine BGA substrate at the 33 mm form factor, and the C suffix denotes a commercial operating temperature range (0C to +85C). The -8 speed grade specifies the slowest of three offered grades, which provides cost advantages for non-timing-critical designs. Moisture Sensitivity Level is MSL 3 per JEDEC J-STD-020, with a peak reflow temperature rating of 220C.
EP2A40 devices combine four logic element groups, each containing ten LogicArray blocks, plus up to 1.125 Mbit of dual-port RAM implemented via embedded system blocks. Typical applications include PCI bus interfaces, high-speed DSP datapaths, telecommunications backplane bridging, and parallel coprocessing blocks. The 672-ball FBGA provides the I/O density required for wide datapath and external memory interfaces.
When designing with this device, ensure MSL 3 handling procedures are followed during PCB assembly, as the plastic BGA absorbs moisture and requires a controlled bake-out before reflow. The -8 speed grade should be reserved for designs where timing margins exceed the slowest timing specifications. Use the Quartus II or MAX+PLUS II toolchain for synthesis, fitting, and timing analysis.
Drop-in alternatives for EP2A40F33C-8 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2A40F33C-8 (same form factor and footprint) — differing in Package, Operating Temperature, Process Technology, Speed Grade, Configuration Method.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2A40F33C-7
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View Datasheet →EP2A40F33C-8 Maximum Ratings & Electrical Characteristics
| Family | APEX II |
| Logic Elements | 40,000 |
| Package | FBGA-672 (F33) |
| Pin Count | 672 |
| Substrate Size | 33 mm |
| Operating Temperature | 0C to +85C (Commercial, 'C' suffix) |
| Speed Grade | -8 (slowest tier) |
| Moisture Sensitivity Level (MSL) | 3 |
| Peak Reflow Temperature | 220 C |
| Mounting Type | Surface Mount (BGA) |
| Family Prefix | EP2A (APEX II series) |
| Device Class | FPGA / Programmable Logic Device |
EP2A40F33C-8 fbga-672 (f33) Pin Configuration Guide
Pin configuration for EP2A40F33C-8 (fbga-672 (f33) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2A40F33C-8.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2A40F33C-8 is suitable for 7 applications: Telecommunications Backplane Bridging, High-Speed DSP Datapath Acceleration, PCI / CompactPCI Bus Interface Controllers, Legacy Industrial Control and PLC Systems, Medical Imaging Pipeline Front-Ends, Aerospace Test and Avionics Simulators, ASIC Prototyping and Emulation Platforms.
Telecommunications Backplane Bridging
The EP2A40F33C-8's 40,000 logic elements and embedded dual-port RAM blocks make it well suited for backplane bridging designs that aggregate multiple telecom interfaces. With the APEX II family providing up to 1.125 Mbit of embedded RAM and a 672-ball FBGA delivering high I/O density, the device can implement multi-channel framer/serializer functions, ATM/SONET protocol bridging, and TDM bus aggregation. Its MultiVolt I/O supports mixed-voltage bus interfaces (1.5V, 1.8V, 2.5V, 3.3V), enabling direct connection to legacy telecom ASICs without level shifters.
Recommended
High-Speed DSP Datapath Acceleration
The EP2A40F33C-8's LUT-based logic fabric supports high-throughput DSP datapath designs, particularly FIR filters, FFT engines, and correlators. APEX II LogicArray blocks combine four 4-input LUTs with arithmetic carry chains and dedicated register stages, enabling efficient multiply-accumulate operations at 100+ MHz in the -8 speed grade. Embedded system blocks provide configurable dual-port RAM for coefficient storage and sample buffering, while the 672-ball FBGA supports wide external memory buses (e.g., 64-bit ZBT SRAM) for streaming data access.
Recommended
PCI / CompactPCI Bus Interface Controllers
The EP2A40F33C-8 is well matched to PCI 2.2 and CompactPCI bus interface controller implementations, providing ample logic capacity for transaction layer state machines, scatter-gather DMA engines, and protocol compliance verification. With up to 40 KLEs, the device can implement a 64-bit/66 MHz PCI-X target plus an embedded protocol analyzer without partitioning. The 672-ball FBGA exposes sufficient user I/O for 64-bit data plus control signals, while MultiVolt I/O lets the FPGA interface directly to 3.3V and 5V PCI signaling environments.
Recommended
Legacy Industrial Control and PLC Systems
Long-life industrial control and PLC platforms built around APEX II devices continue to require EP2A40-class FPGAs for replacement and maintenance. The EP2A40F33C-8 provides the digital glue logic, encoder/decoder interfaces, and high-speed counter subsystems used in PLC backplanes, motor control cards, and SCADA I/O concentrators. Industrial users maintaining these systems through 2026 and beyond rely on broker-sourced inventory of the APEX II family since end-of-life was declared by Altera years ago.
Recommended
Medical Imaging Pipeline Front-Ends
Ultrasound, CT, and MRI front-end subsystems deployed in the 2000s used APEX II FPGAs as the central image-pipeline processor, and many of these systems remain in clinical service today. The EP2A40F33C-8's dual-port RAM and wide I/O suit beam-former datapaths and image preprocessing stages that demand deterministic latency. The commercial 0C to +85C temperature range accommodates equipment-room thermal environments, while the -8 speed grade keeps cost low for non-timing-critical image paths.
Recommended
Aerospace Test and Avionics Simulators
Military and aerospace test rigs, hardware-in-the-loop (HIL) simulators, and avionics protocol emulators continue to operate using APEX II FPGAs where re-certification cost makes migration impractical. The EP2A40F33C-8 supports MIL-STD-1553, ARINC 429, and other avionics databus implementations in test/simulator contexts where temperature and ruggedization are controlled at the rack level. FPGA-based avionics simulators benefit from the APEX II's flexible I/O voltage support and large logic capacity for protocol state machines and traffic generators.
Recommended
ASIC Prototyping and Emulation Platforms
ASIC prototyping and pre-silicon emulation stations built around the APEX II family use multi-FPGA configurations to validate complex SoC designs before tape-out. The EP2A40F33C-8's 40K LE density allows partitioning of medium-complexity ASIC blocks into single-device prototypes, and the multi-FPGA interconnect fabric benefits from the 672-ball FBGA's abundant user I/O for chip-to-chip links. Modern emulation flows still support APEX II as a verified reference platform, extending the lifespan of legacy prototyping rigs.
Recommended
Recommended Products Summary
Engineering reference data for EP2A40F33C-8 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2A40F33C-7 | EP2A40F1508 | EP2A40F1020I8 | EP2A40B724C8 | EP2A40B652C8 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | FBGA-672 (F33) | FBGA-672 (F33) - same | FBGA-1508 | FBGA-1020 | BGA-724 | BGA-652 |
| Logic Elements | 40,000 | 40,000 (same die) | 40,000 (same die) | 40,000 (same die) | 40,000 (same die) | 40,000 (same die) |
| Speed Grade | -8 | -7 (15% faster) | -8 (same) | -8 (same) | -8 (same) | -8 (same) |
| Temperature Range | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
| MSL Level | 3 | 3 | 3 | 3 | 3 | 3 |
| Family | APEX II | APEX II | APEX II | APEX II | APEX II | APEX II |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Same F33 BGA package as the original (vs EP2A40F1508)
- Industrial temperature support available (vs EP2A40F1020I8)
- Higher density alternative with smaller ball pitch (vs EP2A40B724C8)
Design Notes
The FBGA-672 (F33) FineLine BGA requires high-density PCB layout with microvia stack-ups (typically 4-6 layer HDI), controlled-impedance routing for high-speed I/O, and a thermal via array under the die for heat dissipation. Use JEDEC MSL 3 handling procedures including dry-pack storage and pre-assembly bake-out at 125C for 24 hours minimum to prevent moisture-induced delamination during reflow.
Configuration of APEX II devices requires a serial or parallel configuration PROM (e.g., EPC16 or EPC8), and designers frequently underestimate the JTAG chain setup time and TDO-to-TDI daisy-chain requirements when stacking multiple FPGAs. Always verify the chain with the Quartus II programmer before attempting to load configuration data, and confirm that nCONFIG, nSTATUS, and CONF_DONE pull-ups are present on each device per APEX II datasheet guidance.
The -8 speed grade in FBGA-672 at full I/O toggle may dissipate 2-4 W; ensure the PCB thermal design incorporates a thermal via array (typically 25-49 vias at 0.3 mm pitch) under the BGA center for heat transfer to inner copper planes. Industrial variants (I suffix) require additional thermal margin for -40C to +100C operation. Without proper thermal relief, junction temperature may exceed 100C under sustained operation, reducing long-term reliability.
Compliance Information
EP2A40F33C-8 was originally manufactured by Altera (now Intel). The APEX II family preceded RoHS-era design, so the commercial-grade C-suffix variants were typically offered in leaded packages; RoHS/REACH compliance status is not confirmed in the verified web data and should be verified per specific date code and supplier documentation. Lead-free and halogen-free status not in provided data.
