EP2A70B724I9 - APEX II FPGA 3M Gates 724-FCBGA | Altera
MPN: EP2A70B724I9 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $255 | $2,550.00 |
| 100 | $215 | $21,500.00 |
| 500 | $185 | $92,500.00 |
| 1,000 | $160 | $160,000.00 |
EP2A70B724I9 Overview
What is a FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor device whose logic fabric, routing, and I/O can be reconfigured by the end user after manufacture. FPGAs sit above general-purpose microcontrollers and below fixed-function ASICs in the programmable-logic taxonomy (FPGA -> programmable logic -> semiconductor IC), offering parallel processing, deterministic timing, and hardware-level customization for data-path acceleration, glue logic, and prototyping. The APEX II family specifically targets high-density, multi-standard I/O designs by integrating up to four embedded system blocks (ESBs) with each ESB providing up to 32 Kbits of dual-port RAM.
Key features of the EP2A70B724I9 include 540 Kbits of embedded memory, 4 phase-locked loops (PLLs) for flexible clock management, support for multiple I/O standards including LVTTL, LVCMOS, SSTL, and HSTL, and an industrial operating temperature range. The 724-pin FCBGA package provides a high-density interconnect suitable for high-speed designs with numerous differential pairs and high pin-count I/O requirements.
The EP2A70B724I9 architecture combines four-input look-up tables (LUTs) with embedded system blocks and high-speed interconnect, allowing designers to implement both register-rich datapaths and memory-intensive functions in a single device. The PLLs allow multiple clock-domain synthesis and zero-delay buffering for backplane or source-synchronous interfaces such as LVDS and SSTL.
Typical applications include telecommunications infrastructure, network switching and routing equipment, high-speed serial backplanes, digital signal processing (DSP) pipelines, and ASIC prototyping. The high logic density and embedded memory make the EP2A70B724I9 well suited for datapath-heavy designs such as protocol bridges, packet processors, and image-processing front-ends.
When designing with this device, careful attention must be paid to power integrity: the 1.5 V core and PLL supply must be decoupled with low-ESR ceramics placed close to the FCBGA balls, and the high pin count drives a complex multi-layer PCB stack-up. Signal-integrity simulations are recommended for LVDS and high-speed DDR interfaces. This page synthesizes distributor pricing, drop-in alternative MPNs, and design guidance not consolidated on any single distributor page.
Drop-in alternatives for EP2A70B724I9 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2A70B724I9 (same form factor and footprint) — differing in Package, Process Technology, Speed Grade, Operating Temperature, System Gates.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2A70B724I8
✅ Drop-In✓ In Stock
$210 / Unit
View Datasheet →EP2A70B724I7
✅ Drop-In✓ In Stock
$198.5 / Unit
View Datasheet →EP2A70B724C9
✅ Drop-In✓ In Stock
$998.27 / Unit
View Datasheet →EP2A70B724C8
✅ Drop-In✓ In Stock
$1250 / Unit
View Datasheet →EP2A70B724C7
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Contact for price
View Datasheet →EP2A70B724I-9
✅ Drop-In✓ In Stock
$925 / Unit
View Datasheet →EP2A40B724I9
✅ Drop-In✓ In Stock
$150 / Unit
View Datasheet →EP2A70B724I9 Maximum Ratings & Electrical Characteristics
| Family | APEX II |
| Logic Elements | 67,200 |
| System Gates | Approximately 3,000,000 |
| Embedded Memory | 540 Kbits (1,146,880 bits total ESB memory per Jotrin listing) |
| Process Technology | 0.15 µm CMOS |
| Core Voltage | 1.5 V |
| Maximum Operating Frequency | 198 MHz |
| Number of PLLs | 4 |
| Embedded System Blocks (ESBs) | 4 |
| Package | 724-pin FCBGA (Flip-Chip BGA) |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Mounting Type | Surface Mount |
| I/O Standards Supported | LVTTL, LVCMOS, SSTL, HSTL, LVDS |
| Configuration Mode | SRAM-based, configurable via JTAG or EPC enhanced configuration devices |
EP2A70B724I9 724-pin fcbga (flip-chip bga) Pin Configuration Guide
Pin configuration for EP2A70B724I9 (724-pin fcbga (flip-chip bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2A70B724I9.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2A70B724I9 is suitable for 7 applications: Telecommunications Infrastructure, ASIC Prototyping and Emulation, High-Speed Network Switching, Digital Signal Processing (DSP) Pipelines, Industrial Control and Automation, Legacy Military and Aerospace Avionics Upgrades, Medical Imaging Front-Ends.
Telecommunications Infrastructure
The EP2A70B724I9 fits telecommunications infrastructure such as SONET/SDH framers, multi-protocol label switching (MPLS) engines, and 10G backplane controllers because its 67,200 logic elements and 540 Kbits of embedded memory can map deep queue managers and lookup tables in parallel. The four PLLs support multiple clock domains for line-card and fabric interfaces, while the 198 MHz core speed enables wire-speed processing of packet headers. The 724-pin FCBGA package exposes the high I/O count required for LVDS and SSTL interfaces to SFP modules and backplane connectors. Source: Altera APEX II datasheet (ds_apollo2.pdf).
Recommended
ASIC Prototyping and Emulation
The EP2A70B724I9 is a strong ASIC prototyping platform for designs in the 1.5M-3M gate range because its APEX II architecture combines four-input LUTs with embedded system blocks that can emulate ASIC RAM macros. The 198 MHz Fmax enables verification of most synchronous ASIC blocks at near-real-time speed. Designers can map multi-clock ASIC domains to the four on-chip PLLs and use the 724-pin FCBGA for high-fanout signal observability. For larger ASICs, multiple EP2A70B724I9 devices can be time-multiplexed using the JTAG chain.
Recommended
High-Speed Network Switching
The EP2A70B724I9 suits high-speed network switches and routers that need parallel lookup engines, TCAM emulators, and packet classifiers. Its 540 Kbits of embedded memory can buffer routing tables and queue descriptors, while the 67,200 logic elements implement CAM match logic and policers. The 198 MHz system clock combined with LVDS I/O allows direct interfacing to 1G/2.5G Ethernet PHYs without external serializer/deserializer overhead. The industrial temperature range supports thermally constrained top-of-rack switch deployments.
Recommended
Digital Signal Processing (DSP) Pipelines
The EP2A70B724I9 can implement DSP pipelines such as FIR filters, FFT engines, and forward error correction (FEC) decoders because its APEX II fabric includes dedicated multiplier chains within embedded system blocks. The 198 MHz core clock supports up to 198 million multiply-accumulate operations per second when implemented in hard multiplier blocks, and the 724-pin FCBGA exposes the high I/O count required for parallel data-path sampling. JTAG-based debug allows real-time signal observation in the lab.
Recommended
Industrial Control and Automation
The EP2A70B724I9 is well suited to industrial control systems such as PLC backplanes, motion controllers, and machine-vision pre-processors because its industrial temperature range (-40C to +100C) tolerates factory-floor thermal stress. The 3M-gate capacity allows integration of multiple motor-control loops or high-speed vision pipelines on a single device, while the LVTTL/LVCMOS I/O standards connect directly to industrial sensors and encoders. The FCBGA package, although advanced, is mechanically robust when properly reflowed and underfilled.
Recommended
Legacy Military and Aerospace Avionics Upgrades
The EP2A70B724I9 is found in legacy avionics and military systems where long-life-cycle support is required. Its SRAM-based architecture allows in-theatre reconfiguration via JTAG for mission updates. The 540 Kbits of embedded memory supports sensor-fusion pre-processing, while the 198 MHz Fmax handles INS/GPS navigation and electronic-warfare waveform synthesis. Obsolete-lifecycle status requires careful sourcing with traceability documentation for these high-reliability deployments.
Recommended
Medical Imaging Front-Ends
The EP2A70B724I9 supports medical imaging front-ends such as ultrasound beamformers, MRI pre-processors, and CT scanner data-acquisition boards. The 67,200 logic elements and 540 Kbits of embedded memory can implement real-time beamforming or digital down-conversion stages. The four PLLs synchronize multi-channel ADC sample clocks, and the LVDS I/O banks interface to high-speed medical-grade ADCs. Industrial temperature operation accommodates the thermal load of hospital equipment racks.
Recommended
Recommended Products Summary
Engineering reference data for EP2A70B724I9 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2A70B724I8 | EP2A70B724I7 | EP2A70B724C9 | EP2A70B724I-9 | EP2A40B724I9 |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 724-pin FCBGA | 724-pin FCBGA - same | 724-pin FCBGA - same | 724-pin FCBGA - same | 724-pin FCBGA - same | 724-pin FCBGA - same |
| Family | APEX II | APEX II | APEX II | APEX II | APEX II | APEX II |
| Logic Elements | 67,200 | 67,200 | 67,200 | 67,200 | 67,200 | 40,000 (-40%) |
| System Gates | ~3,000,000 | ~3,000,000 | ~3,000,000 | ~3,000,000 | ~3,000,000 | ~1,600,000 (-47%) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Operating Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Speed Grade | -9 (198 MHz Fmax) | -8 (~10-15% slower) | -7 (~20-25% slower) | -9 (198 MHz Fmax) | -9 (198 MHz Fmax) | -9 (198 MHz Fmax) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Highest speed grade in the APEX II 724-pin FCBGA family (vs EP2A70B724I8 and EP2A70B724I7)
- Industrial temperature range (vs EP2A70B724C9)
- Maximum logic density within the 724-pin FCBGA package (vs EP2A40B724I9)
Design Notes
The EP2A70B724I9 requires a low-noise 1.5 V core rail (VCCINT) plus separate VCCIO banks for I/O standards. Use a 4-layer PCB with a dedicated power plane for VCCINT and 1-2 low-ESR ceramic capacitors (10 µF + 0.1 µF) within 5 mm of each supply pin. The PLL analog supply (VCCA_PLL) must be filtered with an LC pi-network to minimize jitter, and the JTAG supply must remain active in standby to support in-system configuration.
Estimated: at 198 MHz and 90% logic utilization on the 724-pin FCBGA package, typical core power dissipation is approximately 4-6 W. The FCBGA exposed die requires thermal vias to the bottom PCB copper pour and, in enclosed enclosures, an aluminum heatsink or forced-air cooling. Industrial temperature operation (-40C to +100C) demands junction-to-ambient thermal resistance below 12 C/W for reliable deployment. Use IR thermography during prototype validation.
The 724-ball FCBGA requires a 6+ layer PCB stack-up with microvia technology on the top two layers for breakout. The BGA land pattern must comply with JEDEC MS-034-D standards, and the differential-pair routing for LVDS/LVCMOS must maintain 100 ohm differential impedance with matched lengths within 5 mil tolerance. Place the configuration memory (EPC4, EPC8, or EPC16) within 50 mm of the FPGA to meet passive-serial timing. Include a JTAG header for in-system programming and boundary-scan test.
Do not confuse the 'I9' suffix (industrial, -9 speed grade) with the 'I-9' or 'I8' suffix (different ordering codes for the same die). Always verify the full Altera ordering code with the sales channel before placing production orders. For ASIC prototyping, allocate spare user I/O for debug probes because the high pin count is often fully consumed by application logic. Finally, ensure the configuration bitstream CRC is validated at every power-up to catch SRAM upsets in safety-critical systems.
Compliance Information
RoHS, REACH, lead-free, halogen-free, and conflict-mineral status not explicitly stated in the verified web data. APEX II family predates many of these mandatory declarations. Request Material Declaration (MD-1) from the distributor for production orders.
