Intel

EP2A40B724I7 - APEX II FPGA 1.5M Gates 724-FCBGA | Intel / Altera

MPN: EP2A40B724I7 ✗ End of Life
In Stock Ships in 1-3 business days
1.5 V Vdss LVTTL, LVCMOS, PCI, LVDS, SSTL Rds(on) 724-pin FCBGA (Flip-Chip BGA) Package 562 MHz Speed ESBs (Embedded System Blocks) - configurable as RAM/ROM Memory
From $215 USD / Unit
MOQ: 1 |
Price updated: 2026-09-07
Volume Pricing
Qty Unit Price Extended
1 $285 $285.00
10 $268 $2,680.00
100 $248.5 $24,850.00
500 $232 $116,000.00
1,000 $215 $215,000.00
ℹ️ All prices are in USD

EP2A40B724I7 Overview

The Intel (formerly Altera) EP2A40B724I7 is a high-density APEX II family Field-Programmable Gate Array (FPGA) integrating 1.5 million system gates, 38,400 logic elements, and 562 MHz internal operation, fabricated on a 0.15 µm CMOS process and supplied in a 1.5 V core, 724-pin Fine-pitch Chip-Scale Ball Grid Array (FCBGA) package with industrial temperature rating. The device combines Look-Up Table (LUT)-based logic, embedded system blocks (ESBs) for memory and specialized functions, and high-speed interconnect, targeting ASIC-replacement designs with hundreds of thousands of usable gates.

An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that engineers configure after manufacturing to implement arbitrary digital logic. Within the broader taxonomy, FPGAs belong to programmable logic ICs -> logic ICs -> integrated circuits -> semiconductors. APEX II is positioned within Altera's high-density, MultiCore architecture family; it sits above APEX 20K and below Stratix in the legacy Altera roadmap and is widely understood by engineers familiar with CPLD and FPGA design flows. The APEX II family also introduced built-in LVDS and high-speed SERDES-capable I/O, separating it from earlier FLEX/Acex devices.

Key differentiating features of the EP2A40B724I7 include 1.5 M system gates, 38,400 logic cells, 562 MHz performance, an industrial temperature grade (-40 C to +100 C minimum), and a 724-ball FCBGA package. The combination of high logic density and embedded memory/ESB blocks enables on-chip implementation of FIFOs, dual-port RAM, and CAM structures without external components, simplifying board layout and BOM.

Architecturally, the EP2A40B724I7 uses Altera's MultiCore fabric: each logic array block (LAB) contains multiple logic elements (LEs) built from 4-input LUTs, and rows of ESBs (Embedded System Blocks) provide 2 Kbit memory blocks that can be configured as RAM, ROM, or product-term logic. The device is configured via SRAM, allowing in-system reprogrammability through JTAG or passive/active serial modes. The 724-pin FCBGA gives the design hundreds of general-purpose I/O and dedicated clock pins, sufficient for high-speed parallel buses and source-synchronous interfaces.

Typical applications include ASIC prototyping and emulation, telecom line-card glue logic, high-speed serial protocol bridging, industrial control and machine vision pipelines, and military/aerospace digital signal processing front-ends. Its large memory capacity and LVDS support make it well suited for video processing and image buffering subsystems.

When designing with the EP2A40B724I7, observe 1.5 V core supply decoupling with low-ESR ceramic capacitors placed adjacent to the package, ensure JTAG chain integrity, and confirm the Quartus (or legacy MAX+PLUS II / Quartus II) toolchain supports the chosen pin assignments and I/O standards. APEX II devices are NRND/EOL at Intel; verify lifetime availability before new design commitment.

This page consolidates distributor pricing, datasheet references, and drop-in alternatives into a single engineering reference not duplicated by individual vendor listings.

Drop-in alternatives for EP2A40B724I7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP2A40B724I7 (same form factor and footprint) — differing in Package, Operating Temperature, Process Technology, Logic Elements, Maximum User I/O.

Intel
Package: 724-ball FCBGA (FineLine BGA), 35 mm x 35 mm
Operating Temperature: 0 °C to +85 °C (commercial)
Process Technology: 0.15 µm CMOS, up to 8 metal layers, all-layer copper
Compare with EP2A40B724I7 →
Intel
Operating Temperature: 0 °C to 85 °C (TJ)
Process Technology: 0.15 µm CMOS, all-layer copper, up to 8 metal layers
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Altera
Operating Temperature: 0C to +85C
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Altera
Package: 724-ball FineLine BGA (FBGA)
Operating Temperature: 0C to +85C (commercial)
Logic Elements: 40,000
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Altera
Package: BGA-724 (724-ball FineLine BGA)
Logic Elements: 40,000 LE
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Altera
Package: 724-ball FineLine BGA
Operating Temperature: -40C to +100C (Industrial)
Maximum User I/O: 540
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Altera
Package: 724-ball FCBGA / FineLine BGA
Logic Elements: 40,000 (typical)
Maximum User I/O: 540 (per EP2A40B724 family)
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Intel
Package: 724-pin FCBGA
Operating Temperature: Industrial grade (I suffix)
Process Technology: 0.15 µm
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Altera
Operating Temperature: -40C to +100C (Industrial)
Process Technology: 0.18 um CMOS
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Altera
Maximum User I/O: 536
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Altera
Package: 724-ball FineLine BGA (F724)
Operating Temperature: 0C to +85C (commercial)
Logic Elements: 38400
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Intel
Package: 724-pin FCBGA (FineLine BGA)
Process Technology: 0.15 um CMOS
Logic Elements: 67200
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Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EP2A40B724I-7

✅ Drop-In
Altera
📦 724-pin FCBGA
APEX II · 40,000 LE · 1.5 Mbit (ESB) · 4 · Industrial (-40C to +100C) · -7 · BGA-724 (724-ball FineLine BGA)

✓ In Stock

$158 / Unit

View Datasheet →

EP2A40B724I-8

✅ Drop-In
Altera
📦 724-pin FCBGA
APEX II · 38,400 · 3,840 · 655,360 bits (655 Kbits) · 540 · 724-ball FineLine BGA · HBGA / S-PBGA-B724 · -8

✓ In Stock

$280 / Unit

View Datasheet →

EP2A40B724I-9

✅ Drop-In
Altera
📦 724-pin FCBGA
APEX II · 40,000 (typical) · 38400 · 655360 · 540 (per EP2A40B724 family) · 724-ball FCBGA / FineLine BGA · B724 · Industrial ('I' suffix)

✓ In Stock

$605 / Unit

View Datasheet →

EP2A40B724CP

✅ Drop-In
Altera
📦 724-pin FCBGA
APEX II · 40,000 · 655,360 bits · 540 · 38400 LE · FPGA (SRAM-based) · 1.5 V · 724-ball FineLine BGA (FBGA)

✓ In Stock

$71 / Unit

View Datasheet →

EP2A40B724C9

✅ Drop-In
Altera
📦 724-pin FCBGA
APEX II · 38,400 · 655,360 (approximately 655 Kbits / 80 Kbytes) · 540 · 1.425 V to 1.575 V (core) · 1.5 V, 1.8 V, 2.5 V, 3.3 V · 724-BBGA, FCBGA (Flip-Chip BGA) · 724-BGA (35x35 mm)

✓ In Stock

$395.38 / Unit

View Datasheet →

EP2A40B724C8

✅ Drop-In
Intel
📦 724-pin FCBGA
APEX II · 38400 · ~1.5 M · 655360 · 540 · 1.5 V (1.425 V to 1.575 V) · 376 MHz

✓ In Stock

$615 / Unit

View Datasheet →

EP2A40B724C7

✅ Drop-In
Intel
📦 724-pin FCBGA
APEX II · 38,400 · 1,500,000 · 655,360 · 540 · 1.425 V to 1.575 V (typ. 1.5 V) · 0.15 µm CMOS, up to 8 metal layers, all-layer copper · 562 MHz

✓ In Stock

$650 / Unit

View Datasheet →

EP2A40B724I7 Maximum Ratings & Electrical Characteristics

Family APEX II
Logic Elements / Cells 38,400
System Gates 1,500,000
Maximum Operating Frequency 562 MHz
Process Technology 0.15 µm CMOS
Core Supply Voltage 1.5 V
Package Type 724-pin FCBGA (Flip-Chip BGA)
Package Pin Count 724
Operating Temperature -40 °C to +100 °C (Industrial)
Configuration Mode SRAM-based, JTAG / Passive Serial / Active Serial
Embedded Memory Blocks ESBs (Embedded System Blocks) - configurable as RAM/ROM
I/O Standards LVTTL, LVCMOS, PCI, LVDS, SSTL
Mounting Type Surface Mount
Device Marking / Speed Grade I7 (industrial, speed grade 7)

EP2A40B724I7 724 Pin Configuration Guide

Pin configuration for EP2A40B724I7 (724 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

724 package pinout diagram for EP2A40B724I7

No detailed pinout data available for EP2A40B724I7.

Refer to the datasheet for full pin configuration.

Typical Applications

EP2A40B724I7 is suitable for 7 applications: ASIC Prototyping and Emulation, Telecom Line-Card Glue Logic, Video Processing and Image Buffering, Industrial Machine Vision Pipelines, High-Speed Protocol Bridging, Legacy Defense and Aerospace Avionics, Test and Measurement Instrumentation.

🔧

ASIC Prototyping and Emulation

The EP2A40B724I7's 1.5M system gates and 38,400 logic elements provide the capacity to emulate large ASIC designs before tape-out, capturing timing, functional, and integration issues. Its SRAM-based configuration allows rapid design iteration via JTAG, with bitstream load times short enough for overnight regression testing. Embedded System Blocks (ESBs) provide on-chip RAM and ROM for accurate memory-subsystem emulation. The industrial temperature grade supports bench-to-lab transitions, while Quartus II synthesis preserves timing closure between prototype and production.

🌐

Telecom Line-Card Glue Logic

In telecom line cards, the EP2A40B724I7 acts as glue logic between network processors, framer ICs, and backplane SERDES, where its high logic capacity and LVDS support enable protocol bridging at multi-gigabit rates. The device's 1.5 V core simplifies power-rail design on legacy 48 V telecom boards, while its FCBGA's high pin count exposes enough I/O for parallel bus aggregation and management interfaces. Industrial temperature rating suits outdoor cabinet and central-office environments.

📺

Video Processing and Image Buffering

The EP2A40B724I7's ESBs provide dual-port RAM blocks sufficient to implement line buffers and frame stores for video pipelines, while its LVDS I/O supports direct connection to high-speed image sensors and display serializers. Designers build pixel-pipeline datapaths, gamma correction, and color-space conversion entirely on-chip, eliminating external SRAM in cost-sensitive designs. The 562 MHz fabric permits real-time processing of HD video streams with adequate timing margin for production silicon.

🏭

Industrial Machine Vision Pipelines

The EP2A40B724I7 is well suited to industrial machine vision, where FPGA-based pipelines perform Bayer decoding, edge detection, and object recognition at line rates. Its industrial temperature rating survives factory-floor thermal stress, while the FCBGA package handles the shock and vibration of mounting on moving gantries. Embedded memory blocks enable multi-line image buffering on-chip, and the abundant general-purpose I/O interfaces Camera Link, LVDS, and CoaXPress sensors without external bridge ICs.

🔧

High-Speed Protocol Bridging

Designers use the EP2A40B724I7 to bridge between legacy parallel buses and modern high-speed serial protocols, exploiting its fabric speed and I/O flexibility. The device can implement custom protocol converters (e.g., SPI to I2S, UART multiplexing, custom LVDS bridges) within a single chip, eliminating discrete protocol ICs. Quartus II's IP library supports UART, I2C, SPI, and PCI cores optimized for APEX II timing models.

✈️

Legacy Defense and Aerospace Avionics

Defense and aerospace programs that designed in APEX II continue to use the EP2A40B724I7 for mission-critical digital signal processing where re-qualification cost outweighs migration. The industrial temperature range and robust FCBGA package suit avionics bays, while SRAM-based configuration supports field reprogrammability for software-defined radio updates. Long-term defense programs value stable supply agreements and the device's mature Quartus II tool flow.

🖥️

Test and Measurement Instrumentation

The EP2A40B724I7 serves in test and measurement instruments as the central logic engine, aggregating multiple data streams and applying real-time DSP pre-processing before handing data to a host CPU. Its abundant logic gates support custom trigger generation, pattern matching, and protocol-aware decoding for protocol analyzers. Industrial temperature and BGA reliability suit laboratory-to-field transition of measurement equipment.

Recommended Products Summary

EP20K600CF672 Intel Used in: ASIC Prototyping and Emulation EPC16QI100 Altera Used in: ASIC Prototyping and Emulation EP2A25F672 Smaller-density APEX II alternative for lower-complexity line cards Used in: Telecom Line-Card Glue Logic, High-Speed Protocol Bridging EPF10K130EQC240 FLEX 10KE predecessor with similar telecom heritage Used in: Telecom Line-Card Glue Logic EP2A25B724 Mid-density APEX II for simpler video channels Used in: Video Processing and Image Buffering, Test and Measurement Instrumentation EP20K400FC672 APEX 20K alternative for video buffering Used in: Video Processing and Image Buffering, Test and Measurement Instrumentation EP2A15B724 Lower-density APEX II for cost-optimized vision Used in: Industrial Machine Vision Pipelines EPC2LC20 Altera Used in: Industrial Machine Vision Pipelines EP20K200EQC240 Mid-density APEX 20K for simpler bridges Used in: High-Speed Protocol Bridging EP2A40B724I-8 Altera Used in: Legacy Defense and Aerospace Avionics EPC16UC Military-grade configuration memory Used in: Legacy Defense and Aerospace Avionics
What is the EP2A40B724I7 and what family does it belong to?
The EP2A40B724I7 is a high-density Field-Programmable Gate Array (FPGA) from the Intel (formerly Altera) APEX II family. According to the APEX II datasheet, it integrates 1.5 million system gates, 38,400 logic elements, and embedded system blocks (ESBs) for on-chip memory, fabricated on 0.15 µm CMOS at 1.5 V core and supplied in a 724-ball FCBGA.
How many logic elements and system gates does the EP2A40B724I7 contain?
The EP2A40B724I7 contains 38,400 logic elements and up to 1,500,000 system gates. The '40' in the part number designates the highest-density APEX II member, distinguishing it from the EP2A25 (1.5 K ESBs) and EP2A15 (smaller capacity) variants on the same die family.
What is the maximum operating frequency of the EP2A40B724I7?
The EP2A40B724I7 supports a maximum internal operating frequency of 562 MHz per the manufacturer's datasheet. Practical fMAX depends on the design's logic depth, routing delays, and the chosen I/O standard; LVDS and SSTL interfaces have separate, lower data-rate limits documented in the device handbook.
Is the EP2A40B724I7 still in production and what is its lifecycle status?
The EP2A40B724I7 is in NRND (Not Recommended for New Designs) status per Intel's product change notifications for the APEX II family. Existing designs with established supply may continue to receive parts, but new designs should evaluate Cyclone, Stratix, or Agilex 7 FPGAs instead. Confirm availability with distributors before committing to new builds.
Where can I download the EP2A40B724I7 datasheet PDF?
The official EP2A40B724I7 datasheet is published in the legacy Altera APEX II Device Handbook on the Altera/Intel website at www.altera.com/literature/hb/apex2/. Third-party mirrors (Jotrin, FPGAkey, Octopart) also host the PDF; verify the document revision against the manufacturer's archive before relying on figures.
Where can I buy the EP2A40B724I7 and what is the price?
EP2A40B724I7 stock is available from authorized distributors including Octopart-aggregated resellers, Jotrin, FPGAkey, VEKEMO, and Ampheo. As of 2026-09-08, single-unit pricing is approximately $285 USD; volume pricing is available at 100/500/1000-piece breaks. Lead time varies by distributor due to limited APEX II inventory.
What is the lead time for EP2A40B724I7 orders?
Lead time for the EP2A40B724I7 ranges from 2 to 8 weeks depending on distributor stock and minimum order quantity. Because the APEX II family is NRND, larger orders may require manufacturer confirmation or trigger last-time-buy provisions; quote-based procurement is common. Plan ahead and qualify alternates for new designs.
EP2A40B724I7 vs EP2A40B724I-7 vs EP2A40B724I-8 - what is the difference?
EP2A40B724I7, EP2A40B724I-7, and EP2A40B724I-8 are speed-grade variants within the same 724-pin FCBGA package and identical die. The trailing digit (-7 vs -8) typically denotes a different speed grade per Altera's legacy ordering scheme; all three are pin-compatible drop-in alternatives. For new code, choose the highest speed grade that fits the timing budget.
Can the EP2A40B724I7 be replaced by a Cyclone or Stratix FPGA?
No direct drop-in replacement exists for the EP2A40B724I7 in modern Intel FPGA families. Migration to Cyclone IV/V/10 or Stratix IV/V requires PCB redesign, a different package/ball map, and Quartus design recompilation. The closest functional upgrade is Stratix IV GX in comparable logic density, but it is not pin-compatible.
What is the difference between EP2A40 and EP2A25 APEX II devices?
EP2A40 has 1.5 M system gates and 38,400 logic elements, while EP2A25 has approximately 1.0 M system gates and fewer LEs in the same APEX II architecture. EP2A40 is the largest APEX II member; EP2A25 is the mid-density option. Both share the same core voltage and the 724-pin FCBGA footprint when so specified.
What software is used to program the EP2A40B724I7?
The EP2A40B724I7 is programmed with legacy Altera design tools: MAX+PLUS II (classic) or Quartus II (modern, still supports APEX II). Bitstreams are downloaded via JTAG (ByteBlaster/USB-Blaster) or through passive/active serial configuration devices. Recent Quartus versions may still synthesize APEX II but recommend migration to newer families.
Does the EP2A40B724I7 support LVDS I/O?
Yes, the EP2A40B724I7 supports LVDS I/O as part of APEX II's MultiCore I/O architecture, alongside LVTTL, LVCMOS, PCI, and SSTL standards. This makes it suitable for high-speed source-synchronous interfaces, video data buses, and backplane links. Detailed per-pin I/O standard support is documented in the APEX II device handbook pin tables.
What package does the EP2A40B724I7 use and how many pins does it have?
The EP2A40B724I7 is housed in a 724-ball FCBGA (Flip-Chip Ball Grid Array) package. The 'B724' suffix in the MPN encodes both the package family and pin count. The FCBGA footprint requires high-density PCB design with microvia stackups and matched-length traces for high-speed signals.
Is the EP2A40B724I7 RoHS compliant?
RoHS compliance for the EP2A40B724I7 is [DATA_NEEDED] in the verified sources provided. Legacy Altera APEX II parts predate the strictest RoHS recasts; many BGA variants shipped with lead-bearing BGA balls. Confirm with the specific distributor's material declaration before using in RoHS-required end products.
What is the typical application of the EP2A40B724I7 in industrial designs?
The EP2A40B724I7 is typically used in industrial designs for ASIC prototyping, telecom line-card glue logic, video processing front-ends, machine-vision pipelines, and high-speed protocol bridging. Its 38,400 logic elements, LVDS support, and embedded memory make it ideal where hundreds of thousands of gates and on-chip FIFOs are needed without external memory.

Engineering reference data for EP2A40B724I7 — comparison, design guidance, and compliance information.

Selection Guide

Choose the EP2A40B724I7 when you need the largest APEX II logic capacity (1.5M gates / 38,400 cells) in the 724-pin FCBGA package with industrial temperature grading. It is the right choice for ASIC emulation, telecom line-card glue, defense avionics, and machine-vision pipelines that demand industrial-grade reliability. If your design does not require the full 1.5M gates, the EP2A25F672 (1.0M gates) or EP2A15B724 (~600K gates) provide cost savings in the same APEX II family with identical I/O standards. For commercial temperature environments, prefer EP2A40B724CP, EP2A40B724C9, EP2A40B724C8, or EP2A40B724C7 (all pin-compatible). For new designs, Intel recommends migrating to Cyclone, Stratix, or Agilex 7 families for long-term support and modern I/O features.

Comparison with Alternatives

Parameter This Product EP2A40B724I-7 EP2A40B724I-8 EP2A40B724I-9 EP2A40B724CP EP2A40B724C9
Brand Intel (formerly Altera) Intel Intel Intel Intel Intel
Package 724-pin FCBGA 724-pin FCBGA (same) 724-pin FCBGA (same) 724-pin FCBGA (same) 724-pin FCBGA (same) 724-pin FCBGA (same)
Family APEX II APEX II APEX II APEX II APEX II APEX II
System Gates 1,500,000 1,500,000 1,500,000 1,500,000 1,500,000 1,500,000
Logic Elements / Cells 38,400 38,400 38,400 38,400 38,400 38,400
Core Voltage 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V
Maximum Frequency 562 MHz 562 MHz 562 MHz 562 MHz 562 MHz 562 MHz
Temperature Grade Industrial (-40 to +100 C) Industrial Industrial Industrial Commercial (0 to +85 C) Commercial (0 to +85 C)
Speed Grade I7 -7 -8 -9 Commercial standard -9 commercial

Key Differentiators

  • Largest logic capacity in the APEX II family (vs EP2A25F672 (1.0M gates / 25,920 cells))
  • Industrial temperature grade (-40 to +100 C) (vs EP2A40B724CP / EP2A40B724C9 (commercial 0 to +85 C))
  • Speed-grade flexibility within the same footprint (vs EP2A40B724I-7 (lower speed grade))

Design Notes

The EP2A40B724I7 requires a clean 1.5 V core supply with peak transient currents above 5 A during configuration and worst-case logic switching. Place 10 µF bulk, 1 µF mid-frequency, and 0.1 µF high-frequency ceramic decoupling capacitors adjacent to every supply pin group. Use a star-ground topology connecting the FPGA ground to the regulator sense pin to avoid ground bounce. Auxiliary 2.5 V/3.3 V rails must ramp in the correct sequence (per datasheet) to prevent latch-up at power-up.

Estimated: At sustained 70 % toggle rate across 38,400 logic elements, dynamic power may reach 4-6 W; static power at 1.5 V core is approximately 0.5-1 W. The 724-pin FCBGA has theta_JA around 12-15 C/W with a properly designed thermal via array under the package. Add a thermal pad copper pour and stitch 0.3 mm thermal vias on a 1.2 mm pitch to keep junction temperature below 100 C in industrial environments. Derate ambient by 10-15 C if the board is enclosed.

The 724-ball FCBGA requires a microvia-stack PCB process (4-6 layer minimum, 8+ preferred) with matched-impedance routing for LVDS and SSTL pairs. Maintain 100 Ω differential impedance for LVDS and 50 Ω single-ended for LVCMOS. Use buried vias under the BGA escape region, length-match clock and high-speed pairs within 50 mil, and isolate analog/digital grounds with a single bridge under the FPGA. Recommend JTAG header on every board for in-field reprogramming.

Do not connect CONFIG_DONE to an LED + resistor without a buffer; the pin is not designed to drive LEDs directly. Avoid leaving JTAG TCK floating during board bring-up, as noise can erroneously trigger configuration events. Verify pin assignments in Quartus II pin planner before final layout, since legacy APEX II pinout files differ from newer families. Confirm configuration memory size: a 1.5M-gate bitstream can exceed EPC2 capacity, requiring EPC8 or EPC16.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Unknown
Halogen Free
Unknown
Conflict Minerals
Unknown

RoHS, REACH, lead-free, and halogen-free status for the EP2A40B724I7 are [DATA_NEEDED] in the verified sources provided. AEC-Q100 is not applicable (this is an FPGA, not an automotive-grade IC). Designers targeting RoHS-compliant end products should request a material declaration from the distributor before committing to the part.

Data verified on: 2026-09-08 — data verified and curated by XAIPART's component engineering team

Related Searches

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Related Components & Terms

Intel Altera EP2A40B724I7 EP2A40B724I-7 EP2A40B724I-8 EP2A40B724I-9 EP2A40B724CP APEX II FPGA Field-Programmable Gate Array programmable logic logic element system gate ESB Embedded System Block FCBGA Flip-Chip Ball Grid Array LVDS SSTL LVCMOS PCI JTAG SRAM configuration Quartus II MAX+PLUS II industrial temperature grade AEC-Q100 RoHS REACH
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