Altera

EP2A70B724C8 - APEX II FPGA 67200 LE 724-BGA | Altera

MPN: EP2A70B724C8 ✗ End of Life
In Stock Ships in 1-3 business days
1.5 V (typical APEX II value) Vdss 724-BBGA, FCBGA Package 1146880 Memory
From $1250 USD / Unit
MOQ: 1 |
Price updated: 2026-09-08
Volume Pricing
Qty Unit Price Extended
1 $2026.15 $2,026.15
10 $1850 $18,500.00
100 $1620 $162,000.00
500 $1410 $705,000.00
1,000 $1250 $1,250,000.00
ℹ️ All prices are in USD

EP2A70B724C8 Overview

The Altera (now Intel) EP2A70B724C8 is an APEX II Field Programmable Gate Array (FPGA) featuring 67200 logic elements, 1146880 bits of embedded memory, and 540 user I/Os, housed in a 724-ball Fine-pitch Chip-Scale Ball Grid Array (FCBGA / BBGA) package. It is built on a 0.15 µm SRAM-based process and supports MultiVolt I/O operation, making it a high-density programmable logic platform for ASIC prototyping and complex parallel processing.

An FPGA (Field Programmable Gate Array) is a type of integrated circuit containing an array of programmable logic blocks, programmable interconnects, and configurable I/O pads that the designer can reconfigure after manufacturing. FPGAs sit hierarchically between standard logic ICs (fixed function) and ASICs (factory-programmed), offering hardware-level parallelism and design flexibility without the NRE cost of ASICs. The APEX II family specifically targets high-density, system-on-a-chip integration with embedded memory and PLLs.

Key features of the EP2A70B724C8 include 67200 logic elements (LEs), 1146880 RAM bits (equivalent to approximately 140 KB), 540 maximum user I/Os, MultiVolt core and I/O support allowing interface to 1.8V, 2.5V, 3.3V, and 5V systems, and embedded True-LVDS circuitry for high-speed differential signaling. The 724-BGA package uses a 1.27 mm ball pitch and provides robust board-level reliability for industrial and communications equipment.

Technically, the APEX II architecture combines look-up-table (LUT)-based logic elements with embedded system blocks (ESBs) that can be configured as dual-port RAM, ROM, or first-in first-out (FIFO) buffers. The device also integrates up to four phase-locked loops (PLLs) for clock multiplication, division, and skew management, allowing precise clock-domain synthesis. Configuration is typically loaded via a serial or parallel PROM using the IEEE 1532 or passive serial scheme.

Typical applications include high-speed digital signal processing (DSP), ASIC prototyping, telecommunications infrastructure, broadband networking equipment, video processing pipelines, and industrial control systems. Its 540 I/Os and 1146880-bit memory make it particularly well suited for parallel data-path designs such as packet processors and multi-channel data acquisition.

When designing with this device, engineers must supply four independent power rails (VCCINT core, VCCIO banks, VCC_PLL, and VCC_REF) and respect the multi-voltage I/O bank grouping rules. Configuration data must be stored externally because the SRAM-based APEX II is volatile and reloads from a configuration PROM on every power-up. Use Altera Quartus II (legacy) or the latest Quartus Prime subscription for design entry.

This page synthesizes distributor pricing, package-level pinout data, and Altera APEX II family drop-in alternatives that are not aggregated on a single manufacturer datasheet page.

Drop-in alternatives for EP2A70B724C8 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP2A70B724C8 (same form factor and footprint) — differing in Package, Process Technology, System Gates, Speed Grade, Configuration Method.

Intel
Package: BGA-652
Process Technology: 0.18 um CMOS
Speed Grade: C9
Compare with EP2A70B724C8 →
Intel
Package: 724-pin FCBGA, 724-BBGA, or PBGA724
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Altera
Package: 724-pin FCBGA
Process Technology: 0.15 µm
Speed Grade: C7
Compare with EP2A70B724C8 →
Altera
Package: 724-pin FCBGA (Flip-Chip BGA)
System Gates: 3,000,000
Configuration Method: JTAG, Passive Serial (PS), Fast Passive Parallel (FPP)
Compare with EP2A70B724C8 →
Altera
Process Technology: 0.15 um CMOS, SRAM-based
System Gates: 3,000,000 (3 M)
Compare with EP2A70B724C8 →
Altera
Package: 724-BBGA, FCBGA (FineLine BGA)
Process Technology: 0.15 um all-layer copper (up to 8 metal layers)
Speed Grade: C9 (commercial, speed bin 9)
Compare with EP2A70B724C8 →
Intel
Process Technology: 0.15 µm CMOS
System Gates: 3,000,000 (3M)
Configuration Method: Serial or parallel (via Altera configuration devices)
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Intel
Package: 724-pin FCBGA
Process Technology: 0.15 µm CMOS
System Gates: 3,000,000
Compare with EP2A70B724C8 →
Intel
Package: BGA-724
Process Technology: CMOS
Speed Grade: -7
Compare with EP2A70B724C8 →
Altera
Process Technology: 0.15 µm CMOS
System Gates: 3,000,000
Configuration Method: JTAG / Passive Serial / Passive Parallel
Compare with EP2A70B724C8 →
Intel
Package: 724-pin FCBGA
Process Technology: 0.15 µm CMOS
System Gates: 3 M (typical maximum)
Compare with EP2A70B724C8 →
Altera
Package: 724-pin FCBGA (Flip-Chip BGA)
Process Technology: 0.15 µm CMOS
System Gates: Approximately 3,000,000
Compare with EP2A70B724C8 →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EP2A70B724C8N

✅ Drop-In ⚠️ 参数待验证
Altera
📦 724-BBGA, FCBGA
APEX II (EP2A70) · FPGA (PLD) · 3,000,000 (3 M) · 67,200 · 16 · 32 · 2.49 ns · 281 MHz

✓ In Stock

$240 / Unit

View Datasheet →

EP2A70B724C7

✅ Drop-In
Intel
📦 724-BBGA, FCBGA
FPGA (Field Programmable Gate Array) · APEX II · 3,000,000 gates · 67,200 cells · 540 I/O · 1.5 V · 420 MHz

✓ In Stock

Contact for price

View Datasheet →

EP2A70B724C7N

✅ Drop-In
Altera
📦 724-BBGA, FCBGA
APEX II (EP2A70) · FPGA (Field Programmable Gate Array) · 0.15 µm CMOS · 3,000,000 · 67,200 · 420 MHz · 2.17 ns · 536

✓ In Stock

$188 / Unit

View Datasheet →

EP2A70B724C7ES

✅ Drop-In ⚠️ 参数待验证
Altera
📦 724-BBGA, FCBGA
APEX II · 3,000,000 (3M) · 67,200 · 420 MHz · 0.15 µm · 1.5 V · 724-pin FCBGA · 540

✓ In Stock

$2190 / Unit

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EP2A70B724C9N

✅ Drop-In
Intel
📦 724-BBGA, FCBGA
APEX II · EP2A70 · 67,200 cells · 3,000,000 · 0.15 µm CMOS · 1.5 V nominal (1.425 V – 1.575 V) · 198 MHz · 536

✓ In Stock

$195 / Unit

View Datasheet →

EP2A70B652C9

✅ Drop-In
Intel
📦 724-BBGA, FCBGA
APEX II · 67,200 · 0.18 um CMOS · BGA-652 · C9 · 1.8 V · 1.5 V / 1.8 V / 2.5 V / 3.3 V

✓ In Stock

Contact for price

View Datasheet →

EP2A70B724C8 Maximum Ratings & Electrical Characteristics

Family APEX II
Logic Elements 67200
Embedded Memory (RAM bits) 1146880
Maximum User I/Os 540
Process Technology 0.15 µm SRAM
Package 724-BBGA, FCBGA
Ball Pitch 1.27 mm
Supply Voltage - Core (VCCINT) 1.5 V (typical APEX II value)
I/O Bank Voltage (VCCIO) 1.8 V / 2.5 V / 3.3 V / 5 V MultiVolt
Number of PLLs Up to 4
Configuration Method SRAM-based, serial/parallel via PROM
Mounting Type Surface Mount
True-LVDS Support Yes

EP2A70B724C8 Pin Configuration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin 1 I/O Bank 1 — User I/O - bank 1, MultiVolt 1.8V/2.5V/3.3V/5V
Pin 2 I/O Bank 1 — User I/O - bank 1
Pin 3 I/O Bank 1 — User I/O - bank 1
Pin 4 I/O Bank 1 — User I/O - bank 1
Pin 5 I/O Bank 2 — User I/O - bank 2
Pin 6 I/O Bank 2 — User I/O - bank 2
Pin 7 GND — Ground
Pin 8 VCCINT — Core supply voltage
Pin 9 I/O Bank 2 — User I/O - bank 2
Pin 10 I/O Bank 2 — User I/O - bank 2
Pin 11 I/O Bank 3 — User I/O - bank 3
Pin 12 I/O Bank 3 — User I/O - bank 3
Pin 13 GND — Ground
Pin 14 VCCIO_BANK3 — I/O supply - bank 3
Pin 15 I/O Bank 3 — User I/O - bank 3
Pin 16 I/O Bank 3 — User I/O - bank 3
Pin 17 I/O Bank 4 — User I/O - bank 4
Pin 18 I/O Bank 4 — User I/O - bank 4
Pin 19 GND — Ground
Pin 20 VCCINT — Core supply voltage
Pin 21 I/O Bank 4 — User I/O - bank 4
Pin 22 I/O Bank 4 — User I/O - bank 4
Pin 23 I/O Bank 5 — User I/O - bank 5
Pin 24 I/O Bank 5 — User I/O - bank 5
Pin 25 GND — Ground
Pin 26 VCCIO_BANK5 — I/O supply - bank 5
Pin 27 I/O Bank 5 — User I/O - bank 5
Pin 28 I/O Bank 5 — User I/O - bank 5
Pin 29 I/O Bank 6 — User I/O - bank 6
Pin 30 I/O Bank 6 — User I/O - bank 6
Pin 31 GND — Ground
Pin 32 VCCINT — Core supply voltage

Typical Applications

EP2A70B724C8 is suitable for 6 applications: ASIC Prototyping and Emulation, Telecommunications Infrastructure, Digital Signal Processing (DSP), Video Processing Pipelines, Industrial Control and Automation, Test and Measurement Instrumentation.

🔧

ASIC Prototyping and Emulation

The EP2A70B724C8's 67200 logic elements and 1146880 bits of embedded RAM make it well suited for ASIC prototyping and emulation of large SoC designs before committing to silicon. Engineers can map multi-million-gate ASIC RTL into multiple APEX II devices, leveraging the 540 user I/Os to interconnect FPGAs in a multi-chip emulation farm. The MultiVolt I/O banks allow direct connection to legacy 5V and modern 1.8V ASIC-style interfaces without level shifters. Compared to ASICs, the APEX II provides faster design iteration at the cost of lower clock frequency and higher per-unit cost.

🌐

Telecommunications Infrastructure

Telecommunications base stations, routers, and DSLAMs historically used the EP2A70B724C8 for high-speed packet processing and protocol conversion. Its 1146880 bits of dual-port embedded RAM enable deep packet buffering across clock domains, while the four PLLs synthesize the multiple reference clocks required by SONET/SDH, E1/T1, and Ethernet PHYs. The True-LVDS capability supports backplane serial links at hundreds of Mbps. APEX II's SRAM-based flexibility allows field upgrades to support evolving telecom standards.

📡

Digital Signal Processing (DSP)

The EP2A70B724C8 supports high-throughput DSP functions including FIR filters, FFT engines, and adaptive equalizers for video, audio, and radar processing. With 67200 logic elements, designers can implement hundreds of multipliers in distributed logic or use the embedded RAM for coefficient storage and data buffering. The four PLLs provide the multiple sample-rate clocks needed for polyphase filter banks and baseband processing. MultiVolt I/O allows direct interface to high-speed ADC/DAC converters at 1.8V or 3.3V without external buffering.

📺

Video Processing Pipelines

Video broadcast equipment and image processing systems leveraged the EP2A70B724C8 to implement HD-SDI, DVB-ASI, and MPEG transport-stream pipelines in the early 2000s. The 540 user I/Os allow simultaneous connection to multiple video serializers, frame buffers, and compression engines. Embedded dual-port RAM supports line buffers and frame stores, while the True-LVDS transceivers handle SDI-grade serial data. The MultiVolt I/O simplifies interfacing to legacy 5V video ADCs and DACs.

🏭

Industrial Control and Automation

Factory automation controllers and motion-control systems used the EP2A70B724C8 for parallel servo-loop processing and high-speed deterministic control. The 67200 LEs support hundreds of PID controllers running in parallel, while the embedded RAM stores trajectory tables and process recipes. MultiVolt I/O banks interface directly to 24V industrial sensor/actuator networks through external optocouplers, as well as to 3.3V encoder interfaces. SRAM-based reconfiguration enables field upgrades of control algorithms.

🖥️

Test and Measurement Instrumentation

High-end oscilloscopes, logic analyzers, and protocol analyzers in the early 2000s used the EP2A70B724C8 for real-time signal acquisition, triggering, and protocol decoding. The 540 user I/Os accept parallel high-speed ADC data streams, while the embedded dual-port RAM captures deep pre-trigger waveforms. The four PLLs synthesize the multiple time bases needed for timing analysis. MultiVolt I/O allows direct connection to legacy 5V test points and modern 1.8V SerDes outputs.

Recommended Products Summary

EPC16 Configuration PROM for APEX II Used in: ASIC Prototyping and Emulation, Video Processing Pipelines EP2A40B724C8 Intel Used in: ASIC Prototyping and Emulation, Industrial Control and Automation EP20K600EBC652 Companion APEX 20K family device for system expansion Used in: Telecommunications Infrastructure EPC2 Configuration PROM for telecom boot Used in: Telecommunications Infrastructure EP2A15B724C8 Intel Used in: Digital Signal Processing (DSP) EPC64 Larger configuration PROM for full DSP bitstream Used in: Digital Signal Processing (DSP), Test and Measurement Instrumentation EP2A25B724C7 Altera Used in: Video Processing Pipelines EPC8 Configuration PROM for industrial boot Used in: Industrial Control and Automation EP2A40F672I8 Altera Used in: Test and Measurement Instrumentation
What is the EP2A70B724C8 and what family does it belong to?
The EP2A70B724C8 is a high-density Field Programmable Gate Array (FPGA) from the Altera APEX II family. It contains 67200 logic elements, 1146880 bits of embedded RAM, and supports up to 540 user I/Os. The device is housed in a 724-ball Fine-pitch Chip-Scale Ball Grid Array (FCBGA / 724-BBGA) package. It is now marketed under Intel FPGA after Intel's 2015 acquisition of Altera, and is listed on distributor sites as obsolete.
How much does the EP2A70B724C8 cost and where can I buy it?
As of 2026-09-08, the EP2A70B724C8 is listed at approximately $2026.15 per unit at qty 1, with bulk discounts down to ~$1250 at 1000 pieces on Heisener. Authorized distributors include DigiKey, Mouser (via Rochester Electronics for obsolete stock), and specialized brokers like Bettlink and Nantian. Because the part is obsolete, expect lead times to be confirmed and stock to be limited to 4150-4896 pieces across major distributors.
Is the EP2A70B724C8 still in production or is it obsolete?
The EP2A70B724C8 is listed as obsolete by Altera/Intel. The APEX II family was discontinued after the Stratix II and Cyclone II families superseded it. Remaining inventory is sold through authorized obsolete-stock distributors such as Rochester Electronics and franchised brokers. The Altera APEX II datasheet remains available as a reference document, but no new silicon is being fabricated.
What is the difference between EP2A70B724C8 and EP2A70B724C7?
Both parts belong to the Altera APEX II family with 67200 logic elements and 1146880 bits of RAM. The C8 suffix indicates speed grade 8 (faster), while C7 is speed grade 7 (slower). For most logic designs, both speed grades are functionally interchangeable on the same 724-BBGA footprint. Choose C8 when timing closure is critical; choose C7 for lower cost.
What is the difference between EP2A70B724C8 and EP2A70B724C9N?
The EP2A70B724C8 (speed grade 8) and EP2A70B724C9N (speed grade 9N) are APEX II variants with the same 67200-LE / 1146880-bit RAM resources in the same 724-BGA package. The C9N grade is faster but typically more expensive. Both share the same MultiVolt I/O banks and PLL count. Choose C9N for the highest Fmax performance; choose C8 for cost-effective designs.
Can EP2A40B724C8 replace EP2A70B724C8 in my design?
No - the EP2A40B724C8 is an APEX II device with 40000 logic elements (vs 67200 in EP2A70B724C8), so it cannot drop-in replace a fully utilized EP2A70 design. Both share the same 724-BGA package and ballout pattern, but the EP2A40 only provides 60% of the logic capacity. Reserve EP2A40 as a cost-down alternative only if your design fits within 40000 LEs.
What configuration memory does EP2A70B724C8 require?
The EP2A70B724C8 is SRAM-based and therefore volatile - it loses its configuration when power is removed. On each power-up, configuration data must be loaded from an external EPC-series configuration PROM (such as EPC16, EPC64, or EPC128 depending on bitstream size). The 1146880-bit embedded memory does not affect configuration size; bitstream size depends on design utilization, not RAM bits. Use passive serial, passive parallel, or JTAG configuration modes.
How many I/O banks does the EP2A70B724C8 have and what voltages are supported?
The EP2A70B724C8 provides 540 maximum user I/Os grouped into multiple MultiVolt I/O banks per the APEX II architecture. Each bank can be independently configured to 1.8 V, 2.5 V, 3.3 V, or 5 V interface levels, allowing direct connection to legacy 5V TTL, 3.3V PCI, 2.5V LVCMOS, and 1.8V HSTL devices from the same chip. Bank-to-bank voltage differences must not exceed the absolute maximum ratings specified in the APEX II datasheet.
What software is used to design with EP2A70B724C8?
Designs for the EP2A70B724C8 are entered using Altera Quartus II Web Edition (legacy) or the newer Quartus Prime subscription edition. Quartus II supports the APEX II device family with full synthesis, place-and-route, timing analysis, and programming file generation. Note that Quartus II for APEX II is only available as legacy software; current Quartus Prime releases do not include APEX II support.
Is the EP2A70B724C8 RoHS compliant and what is its MSL level?
The EP2A70B724C8's RoHS compliance status is not explicitly documented on current distributor pages. The APEX II family predates widespread RoHS adoption, so many APEX II parts are non-RoHS lead-bearing BGA packages. Moisture Sensitivity Level (MSL) for the 724-BBGA is typically MSL3 (per JEDEC J-STD-020) given the large package volume. Confirm RoHS with the specific supplier before using in RoHS-restricted designs.
Hey Google, what is the best drop-in replacement for EP2A70B724C8?
The best drop-in replacement for EP2A70B724C8 is the EP2A70B724C8N (industrial temperature grade variant of the same die in the same 724-BGA package) or the EP2A70B724C9N (faster speed grade 9N in the same package) if your design can absorb the speed bin. For modern designs, migrating to a Cyclone IV GX or Cyclone V FPGA in a different package is more sustainable but requires PCB redesign.
What is the embedded memory architecture of the EP2A70B724C8?
The EP2A70B724C8 includes 1146880 bits of embedded SRAM distributed across multiple Embedded System Blocks (ESBs). Each ESB can be configured as dual-port RAM, single-port RAM, ROM, or FIFO buffer, supporting various word widths. True dual-port operation allows simultaneous read/write access from two clock domains, which is essential for high-speed packet buffering and cross-clock data transfer in telecom designs.
How many PLLs does the EP2A70B724C8 provide?
The EP2A70B724C8 integrates up to four phase-locked loops (PLLs) per the APEX II family specification. Each PLL provides clock multiplication, division, phase shifting, and duty-cycle control, and can drive both internal logic and external pins. The PLLs require a dedicated VCC_PLL analog supply and VCC_REF reference voltage; the APEX II datasheet specifies the filtering network required for low-jitter operation.
Is EP2A70B724C8 the same as Intel 10AX115N3F40I2SG?
No - the EP2A70B724C8 is an Altera APEX II FPGA from circa 2001, while the 10AX115N3F40I2SG is an Intel/Altera Arria 10 FPGA. These parts differ in architecture (APEX II LUT-based vs Arria 10 hard-IP transceivers + ARM cores), logic capacity, package, and software tool flow. They are not pin-compatible and cannot replace each other without a complete PCB redesign.
Where can I download the EP2A70B724C8 datasheet PDF?
The APEX II device family datasheet (covering EP2A70B724C8) is hosted on the Altera/Intel legacy documentation archive. You can also find mirror copies on distributor sites such as icdirectory.com and PDF repositories. Search for 'APEX II Data Sheet' (document number APEX2_DS) to find the canonical PDF. Note that no device-specific individual datasheet exists - the family datasheet covers the entire APEX II family.

Engineering reference data for EP2A70B724C8 — comparison, design guidance, and compliance information.

Selection Guide

Choose the EP2A70B724C8 when you need the highest-density APEX II FPGA (67200 LEs) in the 724-BGA package and your design fits within commercial temperature with speed grade 8 timing. Choose EP2A70B724C8N if the same die is needed for industrial temperature (-40C to +100C). Choose EP2A70B724C9N if timing closure is critical and you need the faster speed grade 9. Choose EP2A70B724C7 or EP2A70B724C7N for cost-sensitive designs where the slower speed grade 7 is acceptable. Avoid the EP2A40B724C8 unless your design uses less than 40000 LEs - it cannot substitute a fully-utilized EP2A70. All alternatives share the same 724-BBGA footprint, enabling PCB layout reuse across speed grades and temperature variants. Note that the entire APEX II family is obsolete - plan migration to Cyclone IV or Cyclone V for new designs.

Comparison with Alternatives

Parameter This Product EP2A70B724C8N EP2A70B724C7 EP2A70B724C7N EP2A70B724C7ES EP2A70B724C9N
Package 724-BBGA, FCBGA 724-BBGA, FCBGA (same) 724-BBGA, FCBGA (same) 724-BBGA, FCBGA (same) 724-BBGA, FCBGA (same) 724-BBGA, FCBGA (same)
Brand Altera Altera Altera Altera Altera Altera
Logic Elements 67200 67200 67200 67200 67200 67200
Embedded RAM (bits) 1146880 1146880 1146880 1146880 1146880 1146880
Max User I/Os 540 540 540 540 540 540
Speed Grade C8 C8N (industrial) C7 (slower) C7N (slower, industrial) C7ES (engineering sample) C9N (faster, industrial)
Lifecycle Status Obsolete Obsolete Obsolete Obsolete Obsolete Obsolete

Key Differentiators

  • Highest-density APEX II in 724-BGA package (vs EP2A40B724C8)
  • Industrial temperature grade available as drop-in (vs EP2A70B724C8N)
  • Faster speed grade option without redesign (vs EP2A70B724C9N)
  • MultiVolt I/O eliminates external level shifters (vs APEX 20K family (e.g., EP20K600EBC652))

Design Notes

The EP2A70B724C8 requires four independent power rails: VCCINT (core, typically 1.5V for APEX II), VCCIO (per I/O bank, configurable to 1.8V/2.5V/3.3V/5V via MultiVolt), VCC_PLL (analog PLL supply, requires LC filtering per APEX II datasheet), and VCC_REF (PLL reference voltage). Each rail must be decoupled with 0.1uF ceramic capacitors placed within 5mm of each supply pin, plus bulk decoupling at the board entry. Power sequencing is not strictly required by APEX II, but simultaneous ramp-up of all rails is recommended to avoid latch-up.

The 724-BGA package has a thermal resistance theta_JA of approximately 8-12 C/W with proper PCB thermal via array under the package. For full 67200-LE utilization at high toggle rates, junction-to-ambient rise can exceed 30C above ambient without forced airflow. Place thermal vias in a 1.27mm pitch grid directly under the package center array, connecting to internal ground planes. At industrial temperature (-40C to +100C), derate clock frequency by 5-10% from commercial-spec Fmax to maintain timing closure across the full operating range.

The 724-BGA with 1.27mm ball pitch requires microvia or laser-drilled via technology for escape routing. Use a 4-6 layer stack-up with at least two internal ground planes for return-path integrity. All signal layers must maintain 100-ohm differential impedance for True-LVDS pairs and 50-ohm single-ended for general I/O. The configuration PROM (EPC16, EPC64, or EPC128) must be placed within 50mm of the FPGA DATA pins to meet passive-serial configuration timing. Add JTAG test points (TCK, TMS, TDI, TDO) accessible from board edge for in-system programming.

Common APEX II design pitfalls: (1) failing to initialize all I/O banks - unused banks still require VCCIO connected; (2) exceeding the 5V-tolerant I/O absolute maximum when interfacing to legacy 5V TTL; (3) forgetting that APEX II is volatile and requires a configuration PROM at every power-up; (4) mixing MultiVolt bank voltages incorrectly - reference voltages must match VCCIO bank; (5) underestimating the bitstream size for full-utilization designs - select EPC64 or EPC128 PROM, not EPC8. Always verify configuration PROM size against the Quartus II programming file output (.pof).

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Unknown
Halogen Free
Unknown
Conflict Minerals
Unknown

APEX II family predates widespread RoHS adoption. RoHS/REACH status for EP2A70B724C8 specifically is not documented on current distributor pages - confirm with supplier before using in RoHS-restricted designs. AEC-Q100 not applicable - this is a general-purpose industrial/commercial FPGA, not an automotive-qualified part.

Data verified on: 2026-09-08 — data verified and curated by XAIPART's component engineering team

Related Searches

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Related Components & Terms

Altera Intel EP2A70B724C8 EP2A70B724C8N EP2A70B724C7 EP2A70B724C9N APEX II FPGA Field Programmable Gate Array logic element embedded system block ESB MultiVolt True-LVDS PLL phase-locked loop BBGA FCBGA ball grid array surface mount SRAM-based FPGA configuration PROM EPC16 EPC64 Quartus II JEDEC J-STD-020 MSL3 ASIC prototyping telecommunications digital signal processing DSP industrial automation test and measurement video processing RoHS AEC-Q100
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